Electroplating and Electrophoretic Deposition over Surfaces of Metal Substrate

Abstract

Various examples described herein provide for a substrate, or a method for preparing a substrate, including a first electroplated layer disposed over a metal substrate, a second electroplated layer disposed under the metal substrate, and an electrophoretic deposition layer disposed over the first electroplated layer.

1 . A method, comprising:
 forming a first electroplated layer over a metal substrate;   forming a second electroplated layer under the metal substrate; and   forming an electrophoretic deposition layer over the first electroplated layer.   
     
     
         2 . The method of  claim 1 , comprising disposing a functional coating over the electrophoretic deposition layer. 
     
     
         3 . The method of  claim 1 , comprising disposing a functional coating under the second electroplated layer. 
     
     
         4 . The method of  claim 1 , comprising forming a second electrophoretic deposition layer over the second electroplated layer. 
     
     
         5 . The method of  claim 4 , comprising disposing a functional coating over the second electrophoretic deposition layer. 
     
     
         6 . The method of  claim 1 , wherein forming the electrophoretic deposition layer over the first electroplated layer comprises:
 activating an exterior surface of the first electroplated layer; and   performing electrophoretic deposition on the activated exterior surface of the first electroplated layer to form the electrophoretic deposition layer.   
     
     
         7 . The method of  claim 1 , wherein forming the first electroplated layer over the metal substrate comprises:
 activating an upper-side exterior surface of the metal substrate to produce an activated upper-side exterior surface; and   electroplating the activated upper-side exterior surface to form the first electroplated layer.   
     
     
         8 . The method of  claim 1 , wherein forming the second electroplated layer under the metal substrate comprises:
 activating an underside exterior surface of the metal substrate to produce an activated underside exterior surface; and   electroplating the activated underside exterior surface to form the second electroplated layer.   
     
     
         9 . A method, comprising:
 electroplating a first exterior surface of a metal substrate;   electroplating a second exterior surface of the metal substrate, the second exterior surface being opposite the first exterior surface; and   performing electrophoretic deposition on the electroplated first exterior surface.   
     
     
         10 . The method of  claim 9 , performing electrophoretic deposition on the electroplated second exterior surface. 
     
     
         11 . A substrate, comprising:
 an electrophoretic deposition layer disposed over a first electroplated layer;   the first electroplated layer disposed over a metal substrate;   the metal substrate disposed over a second electroplated layer, and   the second electroplated layer.   
     
     
         12 . The substrate of  claim 11 , comprising a functional coating disposed over the electrophoretic deposition layer. 
     
     
         13 . The substrate of  claim 11 , comprising a functional coating disposed under the second electroplated layer. 
     
     
         14 . The substrate of  claim 11 , comprising a second electrophoretic deposition layer disposed under the second electroplated layer. 
     
     
         15 . The substrate of  claim 14 , comprising a functional coating disposed under the second electrophoretic deposition layer.