Thermal management planes

Abstract

Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.

1 . A thermal management plane comprising:
 a top casing that is hermetically sealed and bondable with copper;   a bottom casing that is hermetically sealed and bondable with copper; and   a copper seal between the top casing and the bottom casing created by sintering a plurality of copper nanoparticles disposed between the top casing and the bottom casing at a temperature between 170° C. and 350° C.   
     
     
         2 . The thermal management plane according to  claim 1 , wherein sintering occurs at a temperature between 250° C. and 300° C. 
     
     
         3 . The thermal management plane according to  claim 1 , wherein the top casing comprises a non-copper layer encapsulated with a copper layer. 
     
     
         4 . The thermal management plane according to  claim 1 , wherein the top casing comprises a polymer encapsulated with a copper layer. 
     
     
         5 . The thermal management plane according to  claim 1 , further comprising a wicking layer disposed between the top casing and the bottom casing. 
     
     
         6 . The thermal management plane according to  claim 1 , wherein either or both the top casing and the bottom casing comprise a plurality of pillars. 
     
     
         7 . The thermal management plane according to  claim 1 , further comprising a plurality of support structures placed between the top casing and the bottom casing. 
     
     
         8 . The thermal management plane according to  claim 1 , wherein the copper seal is disposed at least around the perimeter of both the top casing and the bottom casing. 
     
     
         9 . The thermal management plane according to  claim 1 , further comprising an isolated vacuum cavity disposed within the thermal management plane. 
     
     
         10 . The thermal management plane according to  claim 1 , further comprising a working fluid disposed between the top casing and the bottom casing. 
     
     
         11 . The thermal management plane according to  claim 1 , further comprising a vacuum chamber formed between the top casing and the bottom casing. 
     
     
         12 . The thermal management plane according to  claim 1 , wherein the thermal management plane has a thickness less than about 200 microns. 
     
     
         13 . The thermal management plane according to  claim 1 , further comprising a plurality of spacers disposed between the top casing and the bottom casing and the plurality of spacers comprising a low-thermal conductivity material disposed. 
     
     
         14 . The thermal management plane according to  claim 1 , wherein the top layer and/or the bottom layer include a coating deposited using either atomic layer deposition or molecular layer deposition. 
     
     
         15 . A method for manufacturing a plurality of thermal management planes, the method comprising:
 disposing a first top layer within a press on a first press member, the first top layer comprising a casing and a plurality of pillars;   disposing a first bottom layer within the press relative to the second top layer;   disposing a first plurality of nanoparticles between the first top layer and the first bottom layer;   disposing a second press member within the press on the first bottom layer;   disposing a second top layer within the press on the second press member, the second top layer comprising a casing and a plurality of pillars;   disposing a second bottom layer within the press relative to the second top layer;   disposing a second plurality of nanoparticles between the second top layer and the second bottom layer;   disposing a third press member within the press on the second bottom layer; and   heating at least the first plurality of nanoparticles and the second plurality of nanoparticles to a temperature between 170° C. and 350° C.; and   applying pressure between the third press member and the first press member.   
     
     
         16 . The method according to  claim 15 ,
 wherein the first press member is shaped and configured to apply pressure on the perimeter of the first top layer when the pressure is applied between the third press member and the first press member;   wherein the second press member is shaped and configured to apply pressure on the perimeter of the first bottom layer and the second top layer when the pressure is applied between the third press member and the first press member; and   wherein the third press member is shaped and configured to apply pressure on the perimeter of the second bottom layer when the pressure is applied between the third press member and the first press member.   
     
     
         17 . The method according to  claim 15 , further comprising:
 disposing a first wicking layer between the first top layer and the first bottom layer; and   disposing a second wicking layer between the second top layer and the second bottom layer.   
     
     
         18 . The method according to  claim 15 , wherein the first plurality of nanoparticles and/or the second plurality of nanoparticles comprise copper. 
     
     
         19 . The method according to  claim 15 , wherein the first bottom layer comprises a casing and a plurality of pillars; and the second bottom layer comprises a casing and a plurality of pillars.  20 - 47 . (canceled)