Additive manufactured passive thermal enclosure

Abstract

Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.

1 . A thermal management device comprising:
 a plate having a first surface, the first surface partially defining a chamber of the thermal management device;   capillary features disposed on or in the plate;   walls each having a first end and a second end, each of the walls being disposed on the plate and extending away from the first surface of the plate, at the first end, to the second end, respectively, the walls partially defining the chamber of the thermal management device; and   a layer of material disposed on the second ends of the walls, the layer of material partially defining the chamber.   
     
     
         2 . The thermal management device of  claim 1 , wherein the plate is an enclosure plate of an electronic device. 
     
     
         3 . The thermal management device of  claim 2 , wherein the chamber covers a substantial portion of the first surface of the enclosure plate. 
     
     
         4 . The thermal management device of  claim 2 , wherein the plate is mountable to an inner surface of a housing of the electronic device. 
     
     
         5 . The thermal management device of  claim 1 , wherein the plate, the capillary features, the walls, and the layer of material are made of a first material. 
     
     
         6 . The thermal management device of  claim 5 , further comprising a fluid, a second material, or the fluid and the second material inside the chamber, the second material being different than the first material. 
     
     
         7 . The thermal management device of  claim 1 , wherein the layer of material is a first layer of material,
 wherein the plate has a second surface, the second surface being opposite the first surface, and   wherein the thermal management device further comprises a second layer of material, the second layer of material being disposed on the second surface of the plate.   
     
     
         8 . The thermal management device of  claim 7 , wherein the second layer of material is made of a wax. 
     
     
         9 . The thermal management device of  claim 7 , wherein the second layer of material covers less than all of the second surface of the plate, and
 wherein the second layer of material is a thermal insulator.   
     
     
         10 . The thermal management device of  claim 7 , wherein the second layer of material covers less than all of the second surface of the plate, and
 wherein the thermal management device further comprises a third layer of material, the third layer of material being disposed on the second surface of the plate.   
     
     
         11 . The thermal management device of  claim 10 , wherein the second layer of material and the third layer of material are made of different materials. 
     
     
         12 . The thermal management device of  claim 10 , wherein the second layer of material and the third layer of material are made of a same material. 
     
     
         13 . The thermal management device of  claim 1 , wherein at least one of the walls extends in a non-perpendicular direction relative to the plate. 
     
     
         14 . The thermal management device of  claim 1 , wherein a height of at least one of the walls varies along the plate, a shape of a first portion of the thermal management device is different than a shape of a second portion of the thermal management device, or a combination thereof. 
     
     
         15 . The thermal management device of  claim 1 , wherein a portion of the capillary features extends from the first surface of the plate, towards the layer of material, partially across the chamber. 
     
     
         16 . The thermal management device of  claim 1 , wherein a portion of the capillary features extends from the first surface of the plate to the layer of material, across the chamber. 
     
     
         17 . The thermal management device of  claim 16 , wherein the portion of the capillary features is a first portion of the capillary features,
 wherein a second portion of the capillary features extends from the first surface of the plate to the layer of material, across the chamber.   
     
     
         18 . The thermal management device of  claim 16 , wherein the portion of capillary features includes screen wick structures, open channels, channels covered with screens, and annulus behind a screen, an artery structure, a corrugated screen, or any combination thereof. 
     
     
         19 . The thermal management device of  claim 1 , wherein the plate is a first plate, and
 wherein the layer of material is a second plate disposed on the second ends of the walls.   
     
     
         20 . The thermal management device of  claim 19 , wherein the first plate and the second plate are made of different materials.