Bottom emission microled display and a repair method thereof

Abstract

A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.

What is claimed is: 
     
         1 . A bottom emission micro light-emitting diode (microLED) display, comprising:
 a transparent substrate;   a microLED disposed above the transparent substrate;   a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and   a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.   
     
     
         2 . The display of  claim 1 , further comprising a selection electrode disposed above the transparent substrate, and electrically connected with a first electrode of the microLED. 
     
     
         3 . The display of  claim 2 , wherein the microLED is a vertical-type microLED. 
     
     
         4 . The display of  claim 3 , wherein the reflecting layer acts as a common electrode that electrically connects with a second electrode of the microLED. 
     
     
         5 . The display of  claim 3 , further comprising an insulating layer disposed above the transparent substrate, a portion of the insulating layer being etched to expose the transparent substrate, and the selection electrode being disposed on the exposed transparent substrate. 
     
     
         6 . The display of  claim 2 , wherein the microLED is a flip-chip type microLED. 
     
     
         7 . The display of  claim 6 , further comprising:
 an insulating layer disposed above the transparent substrate and the selection electrode; and   a conductive layer disposed above the insulating layer, the conductive layer electrically connecting with the selection electrode;   wherein a first electrode of the microLED bonds and electrically connects with the conductive layer.   
     
     
         8 . The display of  claim 6 , further comprising a common electrode disposed between the microLED and the transparent substrate, and electrically connected with a second electrode of the microLED. 
     
     
         9 . The display of  claim 1 , wherein the transparent substrate comprises glass. 
     
     
         10 . The display of  claim 1 , wherein the light guiding layer comprises transparent material with diffractive index higher than 1.4. 
     
     
         11 . The display of  claim 1 , wherein the light guiding layer comprises polymer. 
     
     
         12 . The display of  claim 1 , wherein the reflecting layer comprises electrically conductive material. 
     
     
         13 . The display of  claim 12 , wherein the reflecting layer comprises metal. 
     
     
         14 . A repair method of a bottom emission micro light-emitting diode (microLED) display, comprising:
 providing a transparent substrate with an original area and a repair area;   forming a first conductive layer to result in a selection electrode and an extended electrode extended from the selection electrode towards the repair area;   disposing a vertical-type original microLED above the selection electrode, which bonds and electrically connects with a first electrode of the microLED;   forming entirely a first light guiding layer above the transparent substrate, the selection electrode, the extended electrode and the original microLED;   etching the first light guiding layer to expose a second electrode of the original microLED and the transparent substrate in the repair area;   forming a second conductive layer to result in a common electrode above the first light guiding layer in the original area, thereby electrically connecting with the second electrode of the original microLED, and to result in the second conductive layer above the exposed transparent substrate in the repair area, wherein the extended electrode and the second conductive layer in the repair area partially overlap;   when the original microLED passes a functional test, performing the following steps:
 forming entirely a second light guiding layer above the common electrode and the first light guiding layer; 
 etching the second light guiding layer to expose the common electrode and forming a top electrode above the second light guiding layer to electrically connect with the common electrode; 
   when the original microLED fails the function test, performing the following steps:
 disposing a vertical-type repair microLED on the second conductive layer above the exposed transparent substrate in the repair area, such that a first electrode of the repair microLED bonds and electrically connects with the second conductive layer above the exposed transparent substrate; 
 welding to electrically connect the partially overlapped second conductive layer and the extended electrode; 
 forming entirely the second light guiding layer above the repair microLED, the common electrode in the original area and the first light guiding layer; and 
 etching the second light guiding layer to expose the common electrode and a second electrode of the repair microLED, and forming the top electrode above the second light guiding layer to electrically connect the common electrode and the second electrode of the repair microLED. 
   
     
     
         15 . The method of  claim 14 , wherein the partially overlapped second conductive layer and the extended electrode are welded by laser welding technique. 
     
     
         16 . The method of  claim 14 , wherein the exposed transparent substrate in the repair area is adjacent to the extended electrode. 
     
     
         17 . The method of  claim 14 , before forming the selection electrode, further comprising a step of forming entirely an insulating layer above the transparent substrate, a portion of the insulting layer being etched to expose the transparent substrate, and the selection electrode being disposed above the exposed transparent substrate. 
     
     
         18 . A bottom emission micro light-emitting diode (microLED) display, comprising:
 a transparent substrate with an original area and a repair area;   a selection electrode formed above the transparent substrate in the original area, an extended electrode being extended from the selection electrode towards the repair area;   a vertical-type original microLED disposed above the selection electrode, which bonds and electrically connects with a first electrode of the original microLED;   a first light guiding layer formed above the transparent substrate, the selection electrode, the extended electrode and the original microLED, the first light guiding layer not covering an exposed transparent substrate in the repair area;   a common electrode formed above the first light guiding layer in the original area, and electrically connected with a second electrode of the original microLED;   a second conductive layer formed above the exposed transparent substrate in the repair area, wherein the extended electrode and the second conductive layer in the repair area partially overlap and are welded and electrically connected;   a vertical-type repair microLED disposed on the second conductive layer above the exposed transparent substrate in the repair area, such that the first electrode of the repair microLED bonds and electrically connects with the second conductive layer above the exposed transparent substrate;   a second light guiding layer formed above the repair microLED in the repair area, the common electrode and the first light guiding layer in the original area; and   a top electrode formed above the second light guiding layer to electrically connect the common electrode and the second electrode of the repair microLED.   
     
     
         19 . The display of  claim 18 , wherein the exposed transparent substrate in the repair area is adjacent to the extended electrode. 
     
     
         20 . The display of  claim 18 , wherein the transparent substrate comprises glass. 
     
     
         21 . The display of  claim 18 , wherein the first light guiding layer and the second light guiding layer comprise transparent material with diffractive index higher than 1.4. 
     
     
         22 . The display of  claim 18 , wherein the first light guiding layer and the second light guiding layer comprise polymer. 
     
     
         23 . The display of  claim 18 , wherein the common electrode and the top electrode comprise metal. 
     
     
         24 . The display of  claim 18 , further comprising an insulating layer entirely formed above the transparent substrate, a portion of the insulating layer being etched to expose the transparent substrate and the selection electrode being disposed above the exposed transparent substrate. 
     
     
         25 . A repair method of a bottom emission micro light-emitting diode (microLED) display, comprising:
 providing a transparent substrate;   forming a selection electrode above the transparent substrate;   forming a first insulating layer above the transparent substrate and the selection electrode;   forming a through hole in the first insulating layer;   forming a conductive layer and a common electrode above the first insulating layer, the conductive layer filling the through hole and thus electrically connecting with the selection electrode;   disposing a flip-chip type original microLED above the conductive layer and the common electrode such that a first electrode of the original microLED bonds and electrically connects with the conductive layer, and a second electrode of the original microLED bonds and electrically connects with the common electrode;   when the original microLED fails a functional test, disposing a repair microLED above the conductive layer and the common electrode, such that a first electrode of the repair microLED bonds and electrically connects with the conductive layer and a second electrode of the repair microLED bonds and electrically connects with the common electrode;   repeating the functional test and disposing a repair microLED until passing the functional test;   forming a light guiding layer above the first insulating layer, the conductive layer, the common electrode, the original microLED and the repair microLED; and   forming a reflecting layer above the light guiding layer.   
     
     
         26 . The method of  claim 25 , wherein the repair microLED and the original microLED are at a same level. 
     
     
         27 . The method of  claim 25 , wherein the original microLED is far away from the selection electrode and the repair microLED is near the selection electrode. 
     
     
         28 . The method of  claim 27 , when the original microLED makes shorting between the conductive layer and the common electrode, the conductive layer or the common electrode located between the original microLED and the repair microLED is cut off. 
     
     
         29 . The method of  claim 25 , further comprising:
 forming a second insulating layer between the transparent substrate and the first insulating layer; and   forming a bottom conductive layer in the second insulating layer and on a top surface of the transparent substrate.   
     
     
         30 . A bottom emission micro light-emitting diode (microLED) display, comprising:
 a transparent substrate;   a selection electrode formed above the transparent substrate;   a first insulating layer formed above the transparent substrate and the selection electrode, a through hole being formed in the first insulating layer;   a conductive layer and a common electrode formed above the first insulating layer, the conductive layer filling the through hole to electrically connect with the selection electrode;   a flip-chip type original microLED disposed above the conductive layer and the common electrode layer, such that a first electrode of the original microLED bonds and electrically connects with the conductive layer and a second electrode of the original microLED bonds and electrically connects with the common electrode;   at least one repair microLED disposed above the conductive layer and the common electrode, such that a first electrode of the repair microLED bonds and electrically connects with the conductive layer and a second electrode of the repair microLED bonds and electrically connects with the common electrode;   a light guiding layer disposed above the first insulating layer, the conductive layer, the common electrode, the original microLED and the repair microLED; and   a reflecting layer disposed above the light guiding layer.   
     
     
         31 . The display of  claim 30 , wherein the repair microLED and the original microLED are at a same level. 
     
     
         32 . The display of  claim 30 , wherein the original microLED is far away from the selection electrode and the repair microLED is near the selection electrode. 
     
     
         33 . The display of  claim 30 , wherein the transparent substrate comprises glass. 
     
     
         34 . The display of  claim 30 , wherein the light guiding layer comprises transparent material with diffractive index higher than 1.4. 
     
     
         35 . The display of  claim 30 , wherein the light guiding layer comprises polymer. 
     
     
         36 . The display of  claim 30 , wherein the reflecting layer comprises conductive material. 
     
     
         37 . The display of  claim 36 , wherein the reflecting layer comprises metal. 
     
     
         38 . The display of  claim 30 , further comprising:
 a second insulating layer formed between the transparent substrate and the first insulating layer; and   a bottom conductive layer formed in the second insulating layer and on a top surface of the transparent substrate.