Light emitting device and method for manufacturing light emitting device
Abstract
A light-emitting device and a method of manufacturing the device are disclosed in this invention. The light-emitting device includes a molded body having metal leads and a plane surface for mounting a light-emitting element. The light-emitting device also includes a lens having one central portion, one edge portion surrounding the central portion, and one base portion supporting the central portion and the edge portion. To produce the device in mass scale, a first sheet of molded structure comprising a plurality of molded bodies having metal leads is provided, then a second sheet of molded structure comprising a plurality of lenses is placed on top of the first sheet of molded structure. The two sheets of molded structures are bonded together with adhesives and by a heat-pressing process to create a bonded structure. Finally, the bonded structure is cut to create individual light emitting devices.
Claims
exact text as granted — not AI-modified1 . A method of manufacturing light emitting devices, the method comprising:
providing a first sheet of molded structure comprising a plurality of molded bodies having metal leads; placing a second sheet of molded structure comprising a plurality of lenses on top of the first sheet of molded structure; bonding the first sheet of molded structure with the second sheet of molded structure to create a bonded structure so that each molded body forms a sealed chamber with a corresponding lens to enclose a light-emitting element; and cutting the bonded structure to create light emitting devices.
2 . The method of claim 1 , wherein the bonding step comprises:
applying adhesives between the first sheet of molded structure and the second sheet of molded structure; removing air between the first sheet of molded structure and the second sheet of molded structure; and applying heat and pressure to create the bonded structure with sealed chambers.
3 . The method of claim 1 further comprising mounting at least one light-emitting element onto each molded body before the placing step.
4 . The method of claim 1 , wherein the first sheet of molded structure is molded from Epoxy Molding Compound, Silicon Molding Compound, or ceramics.
5 . The method of claim 1 , wherein the second sheet of molded structure is molded from silica gel, resin, or epoxy.
6 . The method of claim 1 , wherein each sealed chamber is formed by a molded body and a plurality of corresponding lenses.
7 . The method of claim 1 , wherein each created light emitting device has a sealed chamber.
8 . A light emitting device, comprising:
a molded body having metal leads and a plane surface for mounting a light-emitting element; and a lens having a central portion, an edge portion surrounding the central portion, and a base portion supporting the central portion and the edge portion, wherein the central portion has a dome-shaped top surface, the edge portion has an inner top surface and an outer top surface, the inner top surface of the edge portion connects with the dome-shaped top surface of the central portion to form a valley-shaped groove, the base portion is attached onto the molded body to form a sealed chamber to enclose the light-emitting element, and any angle formed by any plane tangent to the outer top surface of the edge portion and a central axis of the central portion is between 0-45°.
9 . The light emitting device of claim 8 , wherein the molded body has raised edges for bonding with the base portion of the lens to create the sealed chamber.
10 . The light emitting device of claim 8 , wherein the edge portion of the lens has extended leg.
11 . The light emitting device of claim 8 , wherein the molded body is molded from Epoxy Molding Compound, Silicon Molding Compound, or ceramics.
12 . The light emitting device of claim 8 , wherein the lens is molded from silica gel, resin, or epoxy.
13 . The light emitting device of claim 8 , wherein the sealed chamber is a vacuum chamber or contains one of air, dinitrogen, and inert gas.
14 . The light emitting device of claim 8 , wherein the light-emitting element comprises an infrared light emitting diode, a regular light-emitting diode, a die array, a chip-scale package chip, a white chip, a vertical-cavity surface-emitting laser chip, or a super luminescent diode chip.
15 . The light emitting device of claim 8 , wherein the lens and the light-emitting element are both positioned symmetric across a vertical axis of the light-emitting device.
16 . The light emitting device of claim 8 , wherein the lens is positioned symmetric across a vertical axis of the light-emitting device whereas the light-emitting element is positioned off the vertical axis.
17 . The light emitting device of claim 8 , wherein the lens is positioned off a vertical axis of the light-emitting device whereas the light-emitting element is positioned symmetric across the vertical axis.
18 . The light emitting device of claim 8 , wherein the central portion and the edge portion of the lens are formed to tilt with an angle.
19 . A light emitting device, comprising:
a molded body having metal leads and a plane surface for mounting a light-emitting element; and a lens having a central portion, one or more middle portions surrounding the central portion, an edge portion surrounding the one or more middle portions, and a base portion supporting the central portion, the one or more middle portions, and the edge portion, wherein the central portion has a dome-shaped top surface, each middle portion has a upside-down “v” shaped top surface, the edge portion has an inner top surface and an outer top surface, the inner top surface of the edge portion connects with the top surface of the outer-most middle portion to form a valley-shaped groove, the base portion is attached onto the molded body to form a sealed chamber to enclose the light-emitting element, and any angle formed by any plane tangent to the outer top surface of the edge portion and a central axis of the central portion is between 0-45°.
20 . The light emitting device of claim 19 , wherein the sealed chamber is a vacuum chamber or contains one of air, dinitrogen, and inert gas.Cited by (0)
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