Saw wire and cutting apparatus

Abstract

A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing one of tungsten and a tungsten alloy. A surface roughness Ra of the metal wire is at most 0.15 μm. A diameter of the metal wire is at most 60 μm.

What is claimed is: 
     
         1 . A saw wire, comprising:
 a metal wire containing at least one of tungsten and a tungsten alloy, wherein   a surface roughness Ra of the metal wire is at most 0.16 μm, and   a diameter of the metal wire is at most 60 μm.   
     
     
         2 . The saw wire according to  claim 1 , wherein
 the tungsten alloy includes rhenium and tungsten, and   a rhenium content of the tungsten alloy is at least 0.1 wt % and at most 10 wt % with respect to a total weight of rhenium and tungsten.   
     
     
         3 . The saw wire according to  claim 1 , wherein
 the metal wire containing tungsten is doped with potassium, and   a potassium content of the metal wire is at most 0.010 wt % with respect to a total weight of potassium and tungsten.   
     
     
         4 . The saw wire according to  claim 3 , wherein
 the potassium content of the metal wire is at least 0.005 wt % with respect to the total weight of potassium and tungsten.   
     
     
         5 . The saw wire according to  claim 1 , wherein
 the surface roughness Ra of the metal wire is greater than 0.05 μm.   
     
     
         6 . The saw wire according to  claim 1 , wherein
 the diameter of the metal wire is at least 10 μm.   
     
     
         7 . The saw wire according to  claim 1 , wherein
 the diameter of the metal wire is uniform.   
     
     
         8 . The saw wire according to  claim 1 , wherein
 an elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa.   
     
     
         9 . The saw wire according to  claim 1 , further comprising:
 a plurality of abrasive particles provided around a surface of the metal wire.   
     
     
         10 . The saw wire according to  claim 9 , further comprising:
 a nickel plating layer provided over the surface of the metal wire.   
     
     
         11 . The saw wire according to  claim 9 , wherein
 the plurality of abrasive particles include at least one of diamond and cubic boron nitride.   
     
     
         12 . The saw wire according to  claim 9 , wherein
 an average grain diameter of the plurality of abrasive particles is at most 10 μm.   
     
     
         13 . A cutting apparatus, comprising the saw wire according to  claim 1 . 
     
     
         14 . The cutting apparatus according to  claim 13 , further comprising:
 a tension releasing device that releases tension exerted on the saw wire.   
     
     
         15 . A method of slicing an ingot, the method comprising:
 moving at least one saw wire relative to the ingot, each saw wire including a metal wire containing at least one of tungsten and a tungsten alloy, a surface roughness Ra of the metal wire being at most 0.15 μm, and a diameter of the metal wire being at most 60 μm; and   dividing the ingot at least into partly-sliced portions by the at least one saw wire.   
     
     
         16 . A method of manufacturing a saw wire, the method comprising:
 forming a metal wire containing at least one of tungsten and a tungsten alloy, wherein   a surface roughness Ra of the metal wire is at most 0.15 μm, and   a diameter of the metal wire is at most 60 μm.   
     
     
         17 . The method according to  claim 16 , wherein
 the forming includes repeatedly performing a plurality of processes in sequence, and   the plurality of processes includes a wire drawing process, a polishing process, and a die exchange process.