Communication module alignment

Abstract

Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.

What is claimed is: 
     
         1 . An apparatus comprising:
 a first communication module including:
 a printed circuit board, 
 one or more integrated circuit packages mounted on the printed circuit board, wherein each of the one or more integrated circuit packages comprise a wireless transceiver, transmitter, or receiver; and 
   a housing at least partially enclosing the first communication module, the housing including a plurality of alignment structures including at least one alignment structure protruding from a surface of the housing and at least one alignment structure recessed from the surface of the housing, wherein each alignment structure is positioned to at least partially overlap with an electromagnetic signal pathway of a corresponding integrated circuit package.   
     
     
         2 . The apparatus of  claim 1 , wherein the plurality of alignment structures are configured to align the first communication module with a second communication module of a second apparatus. 
     
     
         3 . The apparatus of  claim 2 , wherein the at least plurality of alignment structures are configured to provide a mechanical fit to corresponding alignment structures of a second device housing of the second apparatus. 
     
     
         4 . The apparatus of  claim 1 , wherein a magnet is positioned within the device and between at least two of the plurality of alignment structures, the magnet configured to attractively couple the apparatus to the second apparatus when positioned in proximity to the apparatus. 
     
     
         5 . The apparatus of  claim 4 , wherein the magnet is movable within the device housing between an engaged and a disengaged position. 
     
     
         6 . The apparatus of  claim 1 , wherein the housing is formed from a metallic material and wherein the plurality of alignment structures are each formed from a non-metallic material. 
     
     
         7 . The apparatus of  claim 1 , wherein one or more galvanic contacts are positioned on the surface of the housing and electronically coupled to the first communication module. 
     
     
         8 . The apparatus of  claim 7 , wherein the one or more galvanic contacts form part of the plurality of alignment structures. 
     
     
         9 . The apparatus of  claim 1 , wherein each alignment structure is centered over the corresponding electromagnetic signal pathway for data signals passing to or from the apparatus. 
     
     
         10 . The apparatus of  claim 1 , wherein the first communication module further comprises a respective signal guiding structure surrounding a perimeter formed by each of the one or more integrated circuit packages, wherein each signal guiding structure extends to a surface of the housing corresponding to one of the plurality of alignment structures to form a channel providing a pathway for data communications. 
     
     
         11 . The apparatus of  claim 1 , further comprising one or more magnets surrounding at least a portion of each signal guiding structure. 
     
     
         12 . A system comprising:
 a first device and a second device, the first device comprising:
 a printed circuit board, 
 one or more integrated circuit packages mounted on the printed circuit board, wherein each of the one or more integrated circuit packages comprise a wireless transceiver, transmitter, or receiver; and 
 a housing at least partially enclosing the first communication module, the housing including a plurality of alignment structures including at least one alignment structure protruding from a surface of the housing and at least one alignment structure recessed from the surface of the housing, wherein each alignment structure is positioned to at least partially overlap with an electromagnetic signal pathway of a corresponding integrated circuit package wherein the plurality of alignment structures are configured to align the first communication module with a second communication module of the second device.