US2018340056A1PendingUtilityA1

Buffer sheet composition and buffer sheet

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Assignee: HITACHI CHEMICAL CO LTDPriority: Aug 28, 2015Filed: Aug 26, 2016Published: Nov 29, 2018
Est. expiryAug 28, 2035(~9.1 yrs left)· nominal 20-yr term from priority
Inventors:Yuta KosekiDaisuke FujimotoKumpei YamadaNaoya SuzukiHitoshi OnozekiHiroshi Takahashi
C08L 21/00H10W 72/0198H10W 72/07141H10W 74/15H10W 72/07331H10W 72/07332H10W 72/07304H10W 72/072H10W 72/241H10W 72/07232H10W 72/0711H10W 72/01336H10W 72/01333H10W 72/252H10W 72/222H10W 72/073H10W 72/07163H10W 72/07178
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Claims

Abstract

The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.

Claims

exact text as granted — not AI-modified
1 . A buffer sheet composition comprising a thermosetting compound,
 wherein the buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component in a case in which the electronic component is heated by the heating member so as to mount the electronic component on a substrate.   
     
     
         2 . The buffer sheet composition according to  claim 1 , further comprising a polymerization initiator. 
     
     
         3 . The buffer sheet composition according to  claim 1 , further comprising a curing agent. 
     
     
         4 . The buffer sheet composition according to  claim 1 , further comprising a solvent. 
     
     
         5 . A buffer sheet comprising a thermosetting composition layer obtained by forming the buffer sheet composition according to  claim 1  into a sheet. 
     
     
         6 . The buffer sheet according to  claim 5 , comprising a support on or above one surface or both surfaces of the buffer sheet. 
     
     
         7 . The buffer sheet according to  claim 5 , wherein the composition layer has an average thickness of 20 μm or more.

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