Cooling system for electronic device

Abstract

A cooling system 400 configured to directly cool an electronic device immersed in a coolant includes a cooling tank 50 containing the coolant C, and a leakage receiving portion 21 disposed between the cooling tank 50 and a floor surface 32 so as to receive the coolant L leaked from the cooling tank 50 . The cooling tank 50 includes a lower structure 53 fixed to the floor surface 32 , an upper structure 51 having the electronic device immersed in the coolant C, and a seismic isolation device 55 disposed between the lower structure 53 and the upper structure 51 . It is possible to provide the cooling system which is highly durable against externally exerted strong impact and vibration caused by such disaster as earthquake.

1 . A cooling system configured to directly cool an electronic device immersed in a coolant, the cooling system comprising:
 a cooling tank containing the coolant; and   a leakage receiving portion disposed between the cooling tank and a floor surface so as to receive the coolant leaked from the cooling tank, wherein the cooling tank includes a lower structure fixed to the floor surface, an upper structure having the electronic device immersed in the coolant, and a seismic isolation device disposed between the lower structure and the upper structure.   
     
     
         2 . The cooling system according to  claim 1 , wherein:
 the lower structure includes a dispenser for dispensing a cold coolant;   the upper structure includes a plurality of inflow pipes that allow the dispensed cold coolant to flow into the cooling tank; and   each of the inflow pipes is connected to the dispenser with a flexible pipe.   
     
     
         3 . The cooling system according to  claim 1 , wherein:
 the upper structure includes a plurality of outflow pipes which allow the coolant that has been warmed in the cooling tank to flow out from the cooling tank;   the lower structure includes a collector for collecting the warmed coolant; and   each of the outflow pipes is connected to the collector with a flexible pipe.   
     
     
         4 . The cooling system according to  claim 1 , wherein:
 the lower structure includes an inlet passage for passing the cold coolant;   the upper structure includes a dispenser for dispensing the cold coolant, and a plurality of inflow pipes that allow the dispensed cold coolant to flow into the cooling tank; and   the inlet passage and the dispenser are connected with a flexible pipe.   
     
     
         5 . The cooling system according to  claim 1 , wherein:
 the upper structure includes a plurality of outflow pipes that allow the coolant that has been warmed in the cooling tank to flow out from the cooling tank, and a collector for collecting the warmed coolant;   the lower structure includes an outlet passage for passing the warmed coolant; and   the collector and the outlet passage are connected with a flexible pipe.