US2019000418A1PendingUtilityA1

Universal ultrasound device and related apparatus and methods

62
Assignee: BUTTERFLY NETWORK INCPriority: Jun 20, 2016Filed: Aug 24, 2018Published: Jan 3, 2019
Est. expiryJun 20, 2036(~9.9 yrs left)· nominal 20-yr term from priority
A61B 8/54A61B 8/0891A61B 8/56B06B 1/0292A61B 8/467A61B 8/483A61B 8/485A61B 8/4477A61B 8/4444A61B 8/4236B06B 1/0622A61B 8/12A61B 8/4472A61B 8/0883A61B 8/488A61B 8/4494A61B 8/465A61B 8/4427A61B 8/5207
62
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Claims

Abstract

A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An ultrasound sensor, comprising
 a substrate,   a plurality of circular or square ultrasonic transducers on the substrate;   a membrane configured to vibrate in response to a changing voltage differential applied to the ultrasonic transducers, the membrane having a thickness of less than or equal to 5 microns and at least partially bounding at least one of the plurality of ultrasonic transducers.   
     
     
         2 . The ultrasound sensor of  claim 1 , further comprising control circuitry on the substrate configured to apply a peak-to-peak AC voltage in a range of 16-41 V to the plurality of ultrasonic transducers. 
     
     
         3 . The ultrasound sensor of  claim 1 , wherein the plurality of ultrasonic transducers are configured to operate in a frequency range of 1-15 MHz. 
     
     
         4 . The ultrasound sensor of  claim 1 , wherein the plurality of ultrasonic transducers form an array. 
     
     
         5 . The ultrasound sensor of  claim 4 , wherein the array has a pitch of about 52 microns. 
     
     
         6 . The ultrasound sensor of  claim 1 , wherein at least one of the plurality of ultrasonic transducers is configured to operate in a collapsed mode and at least one of the plurality of ultrasonic transducers is configured to operate in a non-collapsed mode. 
     
     
         7 . The ultrasound sensor of  claim 1 , wherein:
 the plurality of ultrasonic transducers are configured to detect ultrasound signals having frequencies in a first frequency range, at a first depth relative to a subject;   the plurality of ultrasonic transducers are configured to detect ultrasound signals having frequencies in a second frequency range, at a second depth relative to the subject; and   the first depth is smaller than the second depth.   
     
     
         8 . The ultrasound sensor of  claim 1 , wherein the plurality of ultrasonic transducers are configured to receive a bias voltage in the range of 30-110 Volts. 
     
     
         9 . The ultrasound sensor of  claim 1 , wherein the plurality of ultrasonic transducers comprise capacitive micromachined ultrasonic transducers (CMUTs). 
     
     
         10 . The ultrasound sensor of  claim 1 , wherein the plurality of ultrasonic transducers comprise CMOS ultrasonic transducers (CUTs). 
     
     
         11 . The ultrasound sensor of  claim 1 , wherein:
 the plurality of ultrasonic transducers comprise a plurality of ultrasonic transducer cavities;   the substrate is a first substrate and comprises a first thermal oxide layer; and   the ultrasound sensor further comprises a second substrate comprising a second thermal oxide layer, bonded to the first thermal oxide layer, defining an oxide-to-oxide bond; and   the plurality of ultrasonic transducer cavities are formed between the first and second substrates.   
     
     
         12 . The ultrasound sensor of  claim 1 , wherein the membrane has a thickness of less than or equal to 2 microns.

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