US2019002281A1PendingUtilityA1
Aluminum nitride film, method of manufacturing aluminum nitride film, and high withstand voltage component
Est. expiryMar 8, 2036(~9.7 yrs left)· nominal 20-yr term from priority
C01P 2002/76C23C 24/04C23C 14/0617C23C 14/28C01P 2002/72H05B 3/06C01B 21/0728C23C 26/00C01P 2002/60H05B 3/84C01P 2002/74C01P 2006/90C01P 2006/40H05B 3/12H10P 72/0432H10W 40/259H01L 21/67103H01L 23/3731
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Claims
Abstract
An aluminum nitride film includes a polycrystalline aluminum nitride. A withstand voltage of the aluminum nitride film is 100 kV/mm or more.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An aluminum nitride film, comprising
a polycrystalline aluminum nitride, wherein a withstand voltage of the aluminum nitride film is 100 kV/mm or more.
2 . The aluminum nitride film according to claim 1 , wherein:
the polycrystalline aluminum nitride contains a plurality of aluminum nitride crystal grains; and a proportion of the grains in the aluminum nitride film is not less than 90 volume % nor more than 100 volume %.
3 . The aluminum nitride film according to claim 2 , wherein
an average grain diameter of the grains is 30 nm or less.
4 . The aluminum nitride film according to claim 1 , wherein
the withstand voltage is 200 kV/mm or more.
5 . The aluminum nitride film according to claim 1 , wherein
an X-ray diffraction pattern obtained by an X-ray diffraction analysis of the aluminum nitride film has a diffraction peak positioned at a diffraction angle 2θ of 33.2±1°.
6 . The aluminum nitride film according to claim 1 , wherein:
an X-ray diffraction pattern obtained by an X-ray diffraction analysis of the aluminum nitride film has a first diffraction peak positioned at a diffraction angle 2θ of 33.2±1° and a second diffraction peak positioned at a diffraction angle 2θ of 43.5±1°; and a ratio of intensity of the second diffraction peak to intensity of the first diffraction peak is 0.01 or more.
7 . The aluminum nitride film according to claim 1 , wherein
an X-ray diffraction pattern obtained by an X-ray diffraction analysis of the aluminum nitride film has a diffraction peak based on an aluminum nitride crystal, and does not have a diffraction peak other than the diffraction peak based on the aluminum nitride crystal.
8 . The aluminum nitride film according to claim 1 , wherein
the polycrystalline aluminum nitride includes hexagonal aluminum nitride and cubic aluminum nitride.
9 . The aluminum nitride film according to claim 1 , wherein
a surface roughness Ra of the aluminum nitride film is 3 μm or less.
10 . The aluminum nitride film according to claim 1 , wherein
a thickness of the aluminum nitride film is 1 μm or more.
11 . A high withstand voltage component, comprising:
a base material; and the aluminum nitride film according to claim 1 , being provided on the base material.
12 . The high withstand voltage component according to claim 11 , wherein
the high withstand voltage component is a semiconductor element mounting substrate, a component for heater, or a component for semiconductor manufacturing apparatus.
13 . A method of manufacturing an aluminum nitride film, comprising forming the aluminum nitride film according to claim 1 through a supersonic free jet physical vapor deposition method using an aluminum nitride powder.
14 . The method according to claim 13 , wherein
the aluminum nitride film is formed under an inert atmosphere containing nitrogen.
15 . The method according to claim 14 , wherein
the inert atmosphere further contains helium.Cited by (0)
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