Chrome-free etch solutions for chemically resistant polymer materials

Abstract

Chemically resistant polymers are etched using a chrome-free etch solution which is aqueous and alkaline. The chrome-free etch aqueous alkaline solution is environmentally friendly and can be used in the preparation of chemically resistant polymers for electroless metal plating including the plating of through-hole walls in the manufacture of printed circuit boards.

What is claimed is: 
     
         1 . A method comprising:
 a. providing a substrate comprising one or more organic polymers chosen from acrylonitrile butadiene styrene and acrylonitrile butadiene styrene-polycarbonate;   b. providing an aqueous alkaline etch composition composed of hydrogen peroxide and one or more sources of hydroxide ions; and   c. applying the aqueous alkaline etch composition to the substrate to etch at least the one or more organic polymers chosen from acrylonitrile butadiene styrene and acrylonitrile butadiene styrene-polycarbonate.   
     
     
         2 . The method of  claim 1 , further comprising cleaning the substrate prior to applying the aqueous alkaline etch composition to the substrate. 
     
     
         3 . The method of  claim 1 , further comprising treating the substrate with a solvent swell. 
     
     
         4 . The method of  claim 3 , further comprising treating the solvent swell treated and etched substrate with a conditioner. 
     
     
         5 . The method of  claim 4 , further comprising contacting the solvent swell treated, etched and conditioned substrate with a catalyst. 
     
     
         6 . The method of  claim 5 , further comprising contacting the solvent swell treated, etched, conditioned and catalyzed substrate with an electroless metal plating bath to electroless plate metal on the solvent swell treated, etched and conditioned substrate. 
     
     
         7 . The method of  claim 1 , wherein the hydrogen peroxide ranges from 10 g/L to 15 g/L of the aqueous alkaline etch composition. 
     
     
         8 . The method of  claim 1 , wherein the one or more sources of hydroxide ions ranges from 5 g/L to 30 g/L. 
     
     
         9 . The method of  claim 1 , wherein the aqueous alkaline etch composition has a pH of 10 or greater. 
     
     
         10 . The method of  claim 6 , wherein the electroless metal plating bath is a copper, copper alloy, nickel or nickel alloy electroless plating bath.