Method of manufacturing plated component

Abstract

A method of manufacturing a plated component includes: a molding step of molding a substrate including a plurality of plateable portions, which are spaced apart from each other, and coupling portions, which couple the plateable portions to each other, the substrate being a nonconductive plastic molding; an electroless plating step of forming a conductive coating on the plateable portions; and an electrolytic plating step of conducting different electrolytic plating processes on the plateable portions on which different metallic coatings are to be formed.

1 . A method of manufacturing a plated component, comprising:
 a molding step of molding a substrate including a plurality of plateable portions, which are spaced apart from each other, and coupling portions, which couple the plateable portions to each other, the substrate being a nonconductive plastic molding;   an electroless plating step of imparting conductivity to the plateable portions by forming a conductive coating on the plateable portions; and   an electrolytic plating step of conducting different electrolytic plating processes on the plateable portions on which different metallic coatings are to be formed.   
     
     
         2 . The method according to  claim 1 , wherein the electrolytic plating step includes
 a first electrolytic plating process of forming a first metallic coating on first plateable portions of the plateable portions in a state in which an electric current is supplied to the first plateable portions and a current supply to all the other plateable portions is blocked, and   a second electrolytic plating process of forming a second metallic coating on second plateable portions of the plateable portions different from the first plateable portions in a state in which an electric current is supplied to the second plateable portions and a current supply to all the other plateable portions is blocked.   
     
     
         3 . The method according to  claim 1 , wherein the electrolytic plating step includes
 a first electrolytic plating process of forming a first metallic coating on all of the plateable portions in a state in which an electric current is supplied to all the plateable portions, and   a second electrolytic plating process of forming a second metallic coating that is different from the first metallic coating on first plateable portions of the plateable portions in a state in which an electric current is supplied to the first plateable portions.