Optical module and method for manufacturing the optical module
Abstract
An optical module includes: a photonic device emitting or receiving a light wave; an optical waveguide for transmitting the light wave; a lens focusing the light wave; a mirror for changing a traveling direction of the light wave to optically couple the photonic device with the optical waveguide; a manipulation lever for manipulating an orientation of the mirror; a support spring for supporting the mirror; and a substrate integrated with the mirror, the manipulation lever, and the support spring. The support spring couples the mirror with the substrate so as to allow the mirror to change the orientation thereof with movement or rotation along at least two axes. The manipulation lever extends from the mirror in a direction in which the manipulation lever avoids approaching the optical waveguide.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An optical module comprising:
a photonic device emitting or receiving a light wave; an optical waveguide transmitting the light wave; a lens focusing the light wave; a mirror changing a traveling direction of the light wave to optically couple the photonic device with the optical waveguide; a manipulation lever manipulating an orientation of the mirror; a support spring supporting the mirror; and a substrate integrated with the mirror, the manipulation lever, and the support spring, the substrate having a surface just over which the mirror, the manipulation lever, and the support spring are arranged, wherein: the mirror includes a mirror surface reflecting the light wave, the mirror surface being directed obliquely upward so that a first optical path between the mirror surface and the optical waveguide does not overlap a second optical path between the mirror surface and the photonic device, and the second optical path extends in a direction which crosses the surface of the substrate,
the support spring couples the mirror with the substrate so as to allow the mirror to change the orientation thereof with movement or rotation along at least two axes, and
the manipulation lever extends from the mirror in a direction in which the manipulation lever avoids approaching the optical waveguide.
2 . The optical module according to claim 1 , wherein:
the support spring extends in a direction different from the direction of the manipulation lever.
3 . The optical module according to claim 2 , wherein:
a plurality of the support springs are provided to extend in directions different from each other.
4 . The optical module according to claim 1 , wherein:
the manipulation lever is bent to connect to the mirror, and extends along the support spring.
5 . The optical module according to claim 1 , wherein:
the manipulation lever is brazed to the substrate.
6 . The optical module according to claim 5 , further comprising:
an electrode provided adjacent to the manipulation lever on the substrate and causing a brazing material to melt.
7 . The optical module according to claim 1 , wherein:
the substrate is an SOI substrate, and the mirror, the manipulation lever, and the support spring are integrally formed in a surface Si layer of the SOI substrate.
8 . The optical module according to claim 1 , wherein:
the lens is formed integrally with the photonic device.
9 . The optical module according to claim 1 , wherein:
the photonic device is an array photonic device, which emits or receives each of a plurality of light waves, and the optical waveguide transmits the plurality of light waves.
10 . The optical module according to claim 1 , further comprising:
an optical isolator between the mirror and the optical waveguide.
11 . The optical module according to claim 1 , wherein:
the photonic device is a semiconductor laser device.
12 . The optical module according to claim 1 , wherein:
the photonic device is a semiconductor light-receiving device.
13 . The optical module according to claim 1 , wherein:
the manipulation lever has a handle, and the mirror, the photonic device, and the handle are aligned in a row, when viewed from above the surface of the substrate.Join the waitlist — get patent alerts
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