US2019035562A1PendingUtilityA1

High energy density capacitor system and method

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Assignee: FLASH POWER CAPACITORS LLCPriority: May 26, 2017Filed: Apr 2, 2018Published: Jan 31, 2019
Est. expiryMay 26, 2037(~10.9 yrs left)· nominal 20-yr term from priority
Inventors:Edward L. Davis
H01G 11/60H01G 11/58H01G 11/22H01G 11/84H01G 11/86H01G 11/52H10K 10/10H10D 1/68H01G 7/02H10K 10/00H10K 71/15
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Claims

Abstract

A high energy density capacitor comprising a substrate, a positive electrode, a negative electrode, a plurality of intermediate dielectric layers disposed between the positive electrode and negative electrode, and a metal layer deposited on each of the intermediate dielectric layers. Each intermediate dielectric layer comprises sequential layers of a high surface area dielectric material, an electrolyte and a polar organic solvent deposited onto the substrate. The plurality of intermediate dielectric layers and metal layers are arranged in series to form a stack, and at least one an internal passivation layer is disposed between each stack. The positive and negative electrodes extend along a height of the capacitor and have poles in an alternating arrangement around an edge thereof, wherein the positive and negative electrodes are attached to periodic metal layers deposited on each of the intermediate dielectric layers. Dipoles of the intermediate dielectric layers are aligned in an opposite direction of an electric field created between the positive and negative electrodes while charging.

Claims

exact text as granted — not AI-modified
Thus, having described the invention, What is claimed is: 
     
         1 . A high energy density capacitor, comprising:
 a substrate;   a positive electrode;   a negative electrode;   at least one intermediate dielectric layer disposed between the positive electrode and negative electrode, the at least one intermediate dielectric layer comprised of a high surface area dielectric material, an electrolyte and a polar organic solvent; and   a metal layer deposited on each of the at least one intermediate dielectric layers.   
     
     
         2 . The capacitor according to  claim 1  wherein the high surface area dielectric material has a dielectric constant in the range of about 10 9  to about 10 11 . 
     
     
         3 . The capacitor according to  claim 1  wherein the polar organic solvent is a polar protic solvent selected from the group comprising NH 3 , (CH 3 ) 3 COH, C 3 H 8 O, C 2 H 6 O, CH 3 OH, CH 3 COOH, and H 2 O. 
     
     
         4 . The capacitor according to  claim 1  wherein the polar organic solvent is a polar aprotic solvent selected from the group comprising C 3 H 6 O, (CH 3 ) 2 NCH, CH 3 CN, C 2 H 6 OS, CH 2 Cl 2 , C 4 H 8 O, and C 4 H 8 O 2 . 
     
     
         5 . The capacitor according to  claim 1  wherein the intermediate dielectric layer is formed by depositing sequential layers of the high surface area dielectric material, electrolyte and polar organic solvent onto the substrate using semiconductor fabrication techniques. 
     
     
         6 . The capacitor according to  claim 1  further comprising:
 a plurality of intermediate dielectric layers and metal layers arranged in series to form a stack; and 
 at least one an internal passivation layer disposed between each stack. 
 
     
     
         7 . The capacitor according to  claim 1  wherein the at least one intermediate dielectric layer is comprised by molar percentage of about 3% to about 20% electrolyte, about 3% to about 20% dielectric material, and about 60% to about 94% polar organic solvent. 
     
     
         8 . The capacitor according to  claim 1  wherein dipoles of the at least one intermediate dielectric layer align in an opposite direction of an electric field created between the positive and negative electrodes while charging. 
     
     
         9 . The capacitor according to  claim 1  wherein the positive and negative electrodes extend along a height of the capacitor and have poles in an alternating arrangement around an edge thereof, and wherein the positive and negative electrodes are attached to periodic metal layers deposited on each of the at least one intermediate dielectric layers. 
     
     
         10 . A method of forming a high energy density capacitor, comprising:
 providing a substrate;   providing a positive electrode disposed on the substrate;   providing a negative electrode opposite the positive electrode;   providing at least one intermediate dielectric layer disposed between the positive electrode and negative electrode, the at least one intermediate dielectric layer comprised of a high surface area dielectric material, an electrolyte and a polar organic solvent; and   providing a metal layer deposited on each of the at least one intermediate dielectric layers.   
     
     
         11 . The method according to  claim 10  wherein the step of providing at least one intermediate dielectric layer disposed between the positive electrode and negative electrode further comprises:
 depositing sequential layers of the high surface area dielectric material, electrolyte and polar organic solvent onto the substrate using semiconductor fabrication techniques. 
 
     
     
         12 . The method according to  claim 10  further comprising:
 providing a plurality of intermediate dielectric layers and metal layers arranged in series to form a stack; and 
 providing at least one an internal passivation layer disposed between each stack. 
 
     
     
         13 . The method according to  claim 10  further comprising:
 aligning dipoles of the at least one intermediate dielectric layer such that the polarized dielectric layer opposes an electric field created between the positive and negative electrodes while charging. 
 
     
     
         14 . The method according to  claim 10  further comprising:
 positioning the positive and negative electrodes to extend along a height of the capacitor such that poles of the electrodes are in an alternating arrangement around an edge thereof; and 
 attaching the positive and negative electrodes to periodic metal layers deposited on each of the at least one intermediate dielectric layers. 
 
     
     
         15 . The method according to  claim 10  wherein the polar organic solvent is a polar protic solvent selected from the group comprising NH 3 , (CH 3 ) 3 COH, C 3 H 8 O, C 2 H 6 O, CH 3 OH, CH 3 COOH, and H 2 O. 
     
     
         16 . The method according to  claim 10  wherein the polar organic solvent is a polar aprotic solvent selected from the group comprising C 3 H 6 O, (CH 3 ) 2 NCH, CH 3 CN, C 2 H 6 OS, CH 2 Cl 2 , C 4 H 8 O, and C 4 H 8 O 2 .

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