High energy density capacitor system and method
Abstract
A high energy density capacitor comprising a substrate, a positive electrode, a negative electrode, a plurality of intermediate dielectric layers disposed between the positive electrode and negative electrode, and a metal layer deposited on each of the intermediate dielectric layers. Each intermediate dielectric layer comprises sequential layers of a high surface area dielectric material, an electrolyte and a polar organic solvent deposited onto the substrate. The plurality of intermediate dielectric layers and metal layers are arranged in series to form a stack, and at least one an internal passivation layer is disposed between each stack. The positive and negative electrodes extend along a height of the capacitor and have poles in an alternating arrangement around an edge thereof, wherein the positive and negative electrodes are attached to periodic metal layers deposited on each of the intermediate dielectric layers. Dipoles of the intermediate dielectric layers are aligned in an opposite direction of an electric field created between the positive and negative electrodes while charging.
Claims
exact text as granted — not AI-modifiedThus, having described the invention, What is claimed is:
1 . A high energy density capacitor, comprising:
a substrate; a positive electrode; a negative electrode; at least one intermediate dielectric layer disposed between the positive electrode and negative electrode, the at least one intermediate dielectric layer comprised of a high surface area dielectric material, an electrolyte and a polar organic solvent; and a metal layer deposited on each of the at least one intermediate dielectric layers.
2 . The capacitor according to claim 1 wherein the high surface area dielectric material has a dielectric constant in the range of about 10 9 to about 10 11 .
3 . The capacitor according to claim 1 wherein the polar organic solvent is a polar protic solvent selected from the group comprising NH 3 , (CH 3 ) 3 COH, C 3 H 8 O, C 2 H 6 O, CH 3 OH, CH 3 COOH, and H 2 O.
4 . The capacitor according to claim 1 wherein the polar organic solvent is a polar aprotic solvent selected from the group comprising C 3 H 6 O, (CH 3 ) 2 NCH, CH 3 CN, C 2 H 6 OS, CH 2 Cl 2 , C 4 H 8 O, and C 4 H 8 O 2 .
5 . The capacitor according to claim 1 wherein the intermediate dielectric layer is formed by depositing sequential layers of the high surface area dielectric material, electrolyte and polar organic solvent onto the substrate using semiconductor fabrication techniques.
6 . The capacitor according to claim 1 further comprising:
a plurality of intermediate dielectric layers and metal layers arranged in series to form a stack; and
at least one an internal passivation layer disposed between each stack.
7 . The capacitor according to claim 1 wherein the at least one intermediate dielectric layer is comprised by molar percentage of about 3% to about 20% electrolyte, about 3% to about 20% dielectric material, and about 60% to about 94% polar organic solvent.
8 . The capacitor according to claim 1 wherein dipoles of the at least one intermediate dielectric layer align in an opposite direction of an electric field created between the positive and negative electrodes while charging.
9 . The capacitor according to claim 1 wherein the positive and negative electrodes extend along a height of the capacitor and have poles in an alternating arrangement around an edge thereof, and wherein the positive and negative electrodes are attached to periodic metal layers deposited on each of the at least one intermediate dielectric layers.
10 . A method of forming a high energy density capacitor, comprising:
providing a substrate; providing a positive electrode disposed on the substrate; providing a negative electrode opposite the positive electrode; providing at least one intermediate dielectric layer disposed between the positive electrode and negative electrode, the at least one intermediate dielectric layer comprised of a high surface area dielectric material, an electrolyte and a polar organic solvent; and providing a metal layer deposited on each of the at least one intermediate dielectric layers.
11 . The method according to claim 10 wherein the step of providing at least one intermediate dielectric layer disposed between the positive electrode and negative electrode further comprises:
depositing sequential layers of the high surface area dielectric material, electrolyte and polar organic solvent onto the substrate using semiconductor fabrication techniques.
12 . The method according to claim 10 further comprising:
providing a plurality of intermediate dielectric layers and metal layers arranged in series to form a stack; and
providing at least one an internal passivation layer disposed between each stack.
13 . The method according to claim 10 further comprising:
aligning dipoles of the at least one intermediate dielectric layer such that the polarized dielectric layer opposes an electric field created between the positive and negative electrodes while charging.
14 . The method according to claim 10 further comprising:
positioning the positive and negative electrodes to extend along a height of the capacitor such that poles of the electrodes are in an alternating arrangement around an edge thereof; and
attaching the positive and negative electrodes to periodic metal layers deposited on each of the at least one intermediate dielectric layers.
15 . The method according to claim 10 wherein the polar organic solvent is a polar protic solvent selected from the group comprising NH 3 , (CH 3 ) 3 COH, C 3 H 8 O, C 2 H 6 O, CH 3 OH, CH 3 COOH, and H 2 O.
16 . The method according to claim 10 wherein the polar organic solvent is a polar aprotic solvent selected from the group comprising C 3 H 6 O, (CH 3 ) 2 NCH, CH 3 CN, C 2 H 6 OS, CH 2 Cl 2 , C 4 H 8 O, and C 4 H 8 O 2 .Cited by (0)
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