Heat exchange structure of heat dissipation device

Abstract

A heat exchange structure of heat dissipation device includes a main body and a thermoelectric cooling chip. The main body has at least one first space in communication with at least one first opening and at least one second opening. The first space has an open side and a cooling fluid therein. The thermoelectric cooling chip has a cold face to contact with at least one heat source and a hot face to mate with the open side of the main body. In the present invention, the thermoelectric cooling chip is directly used instead of the metal-made heat conduction substrate of the conventional water-cooling heat dissipation device and serves to directly actively cool the heat source. The heat of the hot face of the thermoelectric cooling chip is absorbed by the cooling fluid inside the main body to dissipate. Accordingly, the heat dissipation performance is enhanced as a whole.

What is claimed is: 
     
         1 . A heat exchange structure of heat dissipation device comprising:
 a main body having at least one first space in communication with at least one first opening and at least one second opening, the first space having an open side and a cooling fluid; and   a thermoelectric cooling chip having a cold face and a hot face, the hot face being mated with the open side of the main body, the cold face being in contact with at least one heat source.   
     
     
         2 . The heat exchange structure of heat dissipation as claimed in  claim 1 , wherein the first space has at least one first chamber and a second chamber, the first and second chambers being up and down arranged corresponding to each other, the first and second chambers respectively communicating with the first and second openings, a pump being disposed in the first chamber. 
     
     
         3 . The heat exchange structure of heat dissipation as claimed in  claim 1 , wherein multiple heat dissipation structures extend from the hot face, the heat dissipation structures being composed of multiple radiating columns. 
     
     
         4 . The heat exchange structure of heat dissipation as claimed in  claim 1 , wherein the main body has a first section and a second section, the first and second sections being horizontally positioned and correspondingly connected with each other, the second section having a second space, a pump being disposed in the first space of the first section, the thermoelectric cooling chip being correspondingly mated with the second space of the second section. 
     
     
         5 . The heat exchange structure of heat dissipation as claimed in  claim 1 , further comprising a pump and at least one water tank unit, the pump being connected to the main body and the water tank unit respectively via a first tube body and a second tube body, the water tank unit being connected to the main body via a third tube body, the pump serving to drive the cooling fluid to flow into and out of the first space of the main body, the water tank unit serving to cool the cooling fluid.