Integrated magnetic passive devices using magnetic film

Abstract

An inductive device is disclosed, including a first wire coupled to a first terminal and to a second terminal, a non-conductive material surrounding the first wire, and a magnetic film. The non-conductive material spans the region from the first terminal to the second terminal. The magnetic film surrounds at least a portion of the non-conductive material between the first terminal and the second terminal. The first wire has a first amount of inductance.

What is claimed is: 
     
         1 . An inductive device, comprising:
 a conductive wire coupled to a first terminal and to a second terminal;   a non-conductive material surrounding the conductive wire, wherein the non-conductive material spans a region between the first terminal and the second terminal; and   a plurality of magnetic beads surrounding at least a portion of the non-conductive material between the first terminal and the second terminal;   wherein the plurality of magnetic beads imparts an amount of inductance on to the conductive wire.   
     
     
         2 . The inductive device of  claim 1 , further comprising an encapsulating package surrounding the plurality of magnetic beads. 
     
     
         3 . The inductive device of  claim 2 , wherein the encapsulating package is configured to prevent movement of the plurality of magnetic beads. 
     
     
         4 . The inductive device of  claim 1 , further comprising a different wire adjacent and parallel to the conductive wire. 
     
     
         5 . The inductive device of  claim 4 , wherein the different wire is coupled to a third terminal and to a fourth terminal. 
     
     
         6 . The inductive device of  claim 5 , wherein the amount of inductance is modified dependent upon a current through the different wire between the third terminal and the fourth terminal. 
     
     
         7 . The inductive device of  claim 5 , wherein the conductive wire and the different wire are twisted around each other such that the first terminal and the fourth terminal are on a same side of the inductive device. 
     
     
         8 . A method for creating an inductive device comprising:
 surrounding an insulated wire with a plurality of magnetic beads;   forming an encapsulating package around the plurality of magnetic beads; and   attaching a respective terminal to each end of the insulated wire;   wherein the plurality of magnetic beads imparts an amount of inductance onto the insulated wire.   
     
     
         9 . The method of  claim 8 , further comprising selecting a density of a respective bead of the plurality of magnetic beads based on the amount of inductance. 
     
     
         10 . The method of  claim 8 , further comprising selecting a number of the plurality of magnetic beads based on the amount of inductance. 
     
     
         11 . The method of  claim 8 , further comprising preventing, by the encapsulating package, movement of the plurality of magnetic beads. 
     
     
         12 . The method of  claim 8 , further comprising:
 placing a different wire parallel to the insulated wire; and   placing the different wire based on a desired amount of inductive coupling between the insulated wire and the different wire.   
     
     
         13 . The method of  claim 12 , further comprising:
 attaching additional terminals to each end of the different wire; and   modifying the amount of inductance on the insulated wire based on a current through the different wire between the additional terminals.   
     
     
         14 . The method of  claim 8 , further comprising forming, by the encapsulating package, structural rigidity for the inductive device. 
     
     
         15 . A system comprising:
 an integrated circuit including:
 a first bond pad; and 
 a second bond pad; and 
   an inductive device including:
 a conductive wire, wherein a first end of the conductive wire is coupled to the first bond pad and a second end of the conductive wire is coupled to the second bond pad; 
 a non-conductive material surrounding the conductive wire, wherein the non-conductive material spans a region between the first bond pad and the second bond pad; 
 a plurality of magnetic beads surrounding at least a portion of the non-conductive material; and 
 an encapsulating package surrounding the plurality of magnetic beads; 
 wherein the plurality of magnetic beads imparts an amount of inductance on to the conductive wire. 
   
     
     
         16 . The system of  claim 15 , further comprising a different wire adjacent and parallel to the conductive wire. 
     
     
         17 . The system of  claim 16 , wherein the integrated circuit includes a third bond pad and a fourth bond pad, and wherein a first end of the different wire is coupled to the third bond pad and a second end of the different wire is coupled to the fourth bond pad. 
     
     
         18 . The system of  claim 17 , wherein the integrated circuit is configured to supply a current from the third bond pad to the fourth bond pad, through the different wire, and wherein an amount of the current modifies the amount of inductance on the conductive wire. 
     
     
         19 . The system of  claim 15 , wherein the encapsulating package is configured to prevent movement of the plurality of magnetic beads. 
     
     
         20 . The system of  claim 19 , wherein the encapsulating package is configured to form structural rigidity for the inductive device.