Layered heater system with honeycomb core structure

Abstract

A layered heater system is provided, which includes an engineered substrate, a heater substrate disposed on the engineered substrate, a resistive element layer formed proximate the heater plate, and a protective layer formed on the resistive element layer. Terminal pads are formed over at least a portion of the resistive element layer and are exposed through the protective layer. The engineered substrate includes a plurality of walls which extend in a thickness direction of the engineered substrate and which have a thickness engineered for specific heat transfer requirement.

What is claimed is: 
     
         1 . A layered heater system comprising:
 an engineered substrate comprising a plurality of walls which extend in a thickness direction of the engineered substrate and which have a thickness engineered for specific heat transfer requirement;   a heater plate disposed on the engineered substrate;   a resistive element layer formed proximate the heater plate;   a protective layer formed on the resistive element layer; and   terminal pads formed over at least a portion of the resistive element layer, wherein the terminal pads are exposed through the protective layer.   
     
     
         2 . The layered heater system according to  claim 1 , wherein the engineered substrate comprises an upper face sheet, a lower face sheet, and a core disposed between the upper face sheet and the lower face sheet, and the heater plate is disposed proximate at least one of the upper face sheet and the lower face sheet. 
     
     
         3 . The layered heater system according to  claim 2 , wherein the core defines a honeycomb structure. 
     
     
         4 . The layered heater system according to  claim 3 , wherein the honeycomb structure comprises a plurality of cells defined by the plurality of walls. 
     
     
         5 . The layered heater system according to  claim 3 , wherein the honeycomb structure comprises a plurality of cells having a peripheral size, and the peripheral size is tailored for specific load carrying capability. 
     
     
         6 . The layered heater system according to  claim 1 , wherein the plurality of walls are a plurality of support ribs for supporting the heater plate thereon. 
     
     
         7 . The layered heater system according to  claim 1 , further comprising a dielectric layer formed on the heater plate, wherein the resistive element layer is formed on the dielectric layer. 
     
     
         8 . The layered heater system according to  claim 7 , wherein the dielectric layer is directly formed on the heater plate by a layered process selected from a group consisting of thick film, thin film, thermal spray, and sol-gel, and the resistive element layer is directly formed on the dielectric layer by the layered process. 
     
     
         9 . The layered heater system according to  claim 1 , further comprising at least one temperature sensor. 
     
     
         10 . The layered heater system according to  claim 9 , further comprising a thermowell disposed between the heater plate and the engineered substrate to receive the at least one temperature sensor. 
     
     
         11 . The layered heater system according to  claim 1 , further comprising a gap between the heater plate and the engineered substrate. 
     
     
         12 . The layered heater system according to  claim 1 , wherein the heater plate is in direct contact with the engineered substrate. 
     
     
         13 . The layered heater system according to  claim 1 , wherein the resistive element layer and the terminal pads face the engineered substrate, and the engineered substrate defines at least one aperture and an internal cavity for housing lead wires from the terminal pads and components of the layered heater system. 
     
     
         14 . The layered heater system according to  claim 1 , further comprising:
 an electrical interconnect for use in a connecting the terminal pads to a power supply comprising:
 a dielectric enclosure defining an inner cavity having a central portion; and 
 a contact member disposed within the central portion of the inner cavity of the dielectric enclosure, the contact member being adapted for electrical contact with the terminal pad. 
   
     
     
         15 . The layered heater system according to  claim 14 , wherein the electrical interconnect is in a high voltage vacuum environment. 
     
     
         16 . A layered heater system comprising:
 an engineered substrate comprising an upper face sheet, a lower face sheet, and a core disposed between the upper face sheet and the lower face sheet;   a dielectric layer formed proximate at least one of the upper face sheet and the lower face sheet;   a resistive element layer formed on the dielectric layer;   a protective layer formed on the resistive element layer; and   terminal pads formed over at least a portion of the resistive element layer, wherein the terminal pads are exposed through the protective layer.   
     
     
         17 . The layered heater system according to  claim 16 , further comprising a heater plate disposed proximate at least one of the upper face sheet and the lower face sheet, wherein the dielectric layer is disposed on the heater plate. 
     
     
         18 . The layered heater system according to  claim 16 , further comprising:
 an electrical interconnect for connecting the terminal pads to a power supply, the electrical interconnect comprising:
 a dielectric enclosure defining an inner cavity having a central portion; and 
 a contact member disposed within the central portion of the inner cavity of the dielectric enclosure, the contact member being adapted for electrical contact with the terminal pad. 
   
     
     
         19 . The layered heater system according to  claim 16 , wherein the electrical interconnect is in a high voltage vacuum environment. 
     
     
         20 . The layered heater system according to  claim 16 , wherein the engineered substrate is configured to control heat transfer from the resistive element layer disposed proximate the at least one of the upper face sheet and the lower face sheet to the other one of the upper face sheet and the lower face sheet.