PCB Assembly with Molded Matrix Core

Abstract

Methods and devices related to the design and fabrication of molded cores for printed circuit board assemblies and system-on-package (SIP) devices are discussed. The discussed printed circuit board assemblies may have multiple electrical components embedded in a molded core matrix and forming electrical connections with one or more printed circuit boards attached to the molded core matrix. Methods for sourcing of electrical components and production of the molded cores and printed circuit board assemblies are also discussed. The methods and devices may increase a volumetric density of electrical components in printed circuit board assemblies and provide improved mechanical properties to the electrical circuit device.

What is claimed is: 
     
         1 . A method to produce a printed circuit board assembly, the method comprising:
 disposing a set of electrical components on a plane such that a height of each electrical component as measured along a distance perpendicular to the plane best approximates without exceeding a first height; and   applying a molding material about the set of electrical components such that a thickness of the molding material as measured along a dimension perpendicular to the plane is substantially identical to the first height to form a core of the printed circuit board assembly.   
     
     
         2 . The method of  claim 1 , comprising disposing a first printed circuit board along a first side the core of the printed circuit board assembly, such that a first electrical component of the set of electrical components contacts a first surface of the first printed circuit board. 
     
     
         3 . The method of  claim 2 , comprising disposing a second printed circuit board along a second side of the core of the printed circuit board assembly opposite to the first side, such that the first electrical component contacts the second printed circuit board. 
     
     
         4 . The method of  claim 2 , wherein the first electrical component contacts the first surface at a first terminal, and the method comprises soldering the first electrical component to the first terminal. 
     
     
         5 . The method of  claim 2 , comprising:
 soldering a second set of electrical components to a second surface of the first printed circuit board opposite to the first surface; and   applying a second molding material to the second surface of the first printed circuit board.   
     
     
         6 . The method of  claim 1 , comprising:
 producing a hole in the core of the printed circuit board assembly; and   filling the hole with a conductive material to form a thru-mold via.   
     
     
         7 . The method of  claim 1 , comprising disposing at least one electrical component on the plane such that a respective height of the at least one electrical component, as measured along a direction perpendicular to the plane, does not approximate the first height. 
     
     
         8 . The method of  claim 1 , wherein the core of the printed circuit board assembly is produced in a first location and the method comprises shipping the core of the printed circuit board assembly to a second location. 
     
     
         9 . A method of manufacture of an electronic device, comprising:
 receiving a core of a printed circuit board assembly, wherein the core comprises:
 a first electrical component having a first height measured along a direction perpendicular to a plane; and 
 a mold supporting the first electrical component, wherein the mold has a thickness measured as a distance from a first surface of the core and a second surface of the core opposite to the first surface, and wherein the thickness is substantially similar to the first height; and 
   disposing a first printed circuit board along the first surface of the core such that the first printed circuit board contacts the first electrical component.   
     
     
         10 . The method of  claim 9 , wherein the core of the printed circuit board assembly comprises a plurality of electrical components that comprise the first electrical component, the first printed circuit board comprises a plurality of terminals, and disposing the first printed circuit board along the first surface cause each respective electrical component of the plurality of electrical components to contact a respective terminal of the plurality of terminals. 
     
     
         11 . The method of  claim 10 , wherein at least one electrical component of the plurality of electrical components contacts at least two terminals of the plurality of terminals. 
     
     
         12 . The method of  claim 10 , comprising soldering each respective electrical component of the plurality of electrical components to the respective terminal of the plurality of terminals. 
     
     
         13 . The method of  claim 12 , wherein soldering comprises a single step soldering between the core and the first printed circuit board. 
     
     
         14 . The method of  claim 9 , comprising disposing a second printed circuit board along the second surface of the core such that the second printed circuit board contacts the first electrical component. 
     
     
         15 . The method of  claim 9 , wherein the core contacts the first printed circuit board in a first region of the first printed circuit board and the method comprises attaching a second electrical component to a second region of the first printed circuit board. 
     
     
         16 . The method of  claim 9 , comprising attaching a second electrical component to a surface of the first printed circuit board opposite to the core. 
     
     
         17 . A method for manufacturing an electronic device comprising a printed circuit board assembly, wherein the printed circuit board assembly comprises:
 a core comprising:
 a plurality of electrical components comprising a first electrical component having a first height measured along a direction perpendicular to a plane; and 
 a mold supporting the plurality of electrical components, wherein the mold has a thickness substantially similar to the first height as measured along the direction perpendicular to the plane; 
   a first printed circuit board disposed along a bottom of the core and comprising a plurality of terminals, wherein each respective terminal of the plurality of terminals is electrically coupled a respective component of the plurality of electrical components; and   a second printed circuit board disposed along a top of the core and comprising a first terminal electrically coupled to the first electrical component; and   wherein the method comprises:
 producing the core by applying a molding material about the plurality of electrical components; 
 attaching the first printed circuit board to the bottom of the core; and 
 attaching the second printed circuit board to the top of the core. 
   
     
     
         18 . The method of  claim 17 , comprising soldering the plurality of terminals of the first printed circuit board to the plurality of electrical components in a single soldering step. 
     
     
         19 . The method of  claim 17 , wherein producing the core is performed in a first location and attaching the first printed circuit board to the bottom of the core is performed in a second location. 
     
     
         20 . The method of  claim 19 , comprising producing the first printed circuit board and the second printed circuit board in a third location different from the first location and the second location.