Biocidal glazing composition, method, and article

Abstract

A biocidal additive package comprises at least one metal or metal containing compound selected from the group consisting of Cu 2 O, Cu(OH) 2 , Cu, CuO 3 , Cu 2 O 3 , and a combination thereof, and at least one non-copper metal or non-copper containing metal compound. Non-limiting examples of non-copper metal and non-copper containing metal compounds are Ag, Ag 2 O, Bi, Bi 2 O 3 , Zn, ZnO, or a combination thereof. A biocidal ceramic glaze layer and an article comprising a biocidal ceramic glaze layer are provided. Also provided is a method of affixing a biocidal ceramic glaze to a substrate.

What is claimed is: 
     
         1 . A biocidal additive package comprising:
 at least one metal or metal containing compound selected from the group consisting of Cu 2 O, Cu(OH) 2 , Cu, CuO 3 , Cu 2 O 3 , and a combination thereof, and at least one non-copper metal or non-copper metal containing compound.   
     
     
         2 . The biocidal additive package according to  claim 1 , wherein the non-copper metal containing compound is selected from the group consisting of a silver-containing compound, a barium-containing compound, a bismuth-containing compound, a tin-containing compound, a titanium-containing compound, a zinc-containing compound, and a combination thereof. 
     
     
         3 . The biocidal additive package according to  claim 2 , wherein silver-containing compound is selected from the group consisting of AgO, Ag 2 O, Ag 2 CO 3 , AgNO 3 , and a combination thereof. 
     
     
         4 . The biocidal additive package according to  claim 2 , wherein the barium-containing compound is BaCO 3 . 
     
     
         5 . The biocidal additive package according to  claim 2 , wherein the bismuth-containing compound is Bi 2 O 3 . 
     
     
         6 . The biocidal additive package according to  claim 2 , wherein the tin-containing compound is SnO 2 . 
     
     
         7 . The biocidal additive package according to  claim 2 , wherein the zinc-containing compound is ZnO. 
     
     
         8 . The additive package according to  claim 1 , wherein the non-copper metal or non-copper metal containing compound is selected from the group consisting of Ag, Ag 2 O, Ba, Bi, Bi 2 O 3 , Zn, ZnO, and a combination thereof. 
     
     
         9 . The additive package according to  claim 8 , wherein the non-copper metal-containing compound is a combination of 2% Bi 2 O 3 +4% ZnO. 
     
     
         10 . The additive package according to  claim 8 , wherein the non-copper metal containing compound is a combination of 2% Ag 2 O+2% Bi 2 O 3 +2% ZnO. 
     
     
         11 . A ceramic glaze layer comprising:
 at least one metal or metal containing compound selected from the group consisting of Cu 2 O, Cu(OH) 2 , Cu, CuO 3 , Cu 2 O 3 , and a combination thereof, and at least one non-copper metal or non-copper metal containing compound.   
     
     
         12 . The ceramic glaze layer according to  claim 11 , wherein the non-copper metal-containing compound is present in a ceramic glaze base in a range of at least 0.1 weight %. 
     
     
         13 . The ceramic glaze layer according to  claim 11 , wherein the metallic copper or copper-containing metal compound is present in a ceramic glaze base in a range of 1 weight % to 10 weight %. 
     
     
         14 . The ceramic glaze layer according to  claim 11 , wherein the non-copper metal or non-copper metal containing compound is metallic zinc or a zinc-containing metal compound. 
     
     
         15 . The ceramic glaze layer according to  claim 14 , wherein the metallic zinc or zinc-containing metal compound is present in a ceramic glaze base in a range of 1 weight % to 10 weight %. 
     
     
         16 . The ceramic glaze layer according to  claim 11 , wherein the non-copper metal containing compound is metallic silver or a silver-containing compound. 
     
     
         17 . The ceramic glaze layer according to  claim 16 , wherein the metallic silver or silver-containing metal compound is present in a ceramic glaze base in a range of 0.1 weight % to 3.0 weight %. 
     
     
         18 . A method of affixing a biocidal ceramic glaze to a substrate comprising:
 providing a biocidal ceramic glazing composition having one or more biocidal agents disposed therein,   applying the biocidal ceramic glazing composition to a substrate having a surface,   wherein the biocidal ceramic glazing composition comprises at least one metal or metal containing compound selected from the group consisting of Cu 2 O, Cu(OH) 2 , Cu, CuO 3 , Cu 2 O 3 , and a combination thereof, and at least one non-copper metal or non-copper metal containing compound.   
     
     
         19 . The method according to  claim 18 , wherein the biocidal ceramic glazing composition is applied to a fired glaze layer on the surface of the substrate. 
     
     
         20 . The method according to  claim 18 , the biocidal ceramic glazing composition is applied to an unfired glaze layer on the surface of the substrate. 
     
     
         21 . The method according to  claim 18 , wherein the non-copper metal containing compound is selected from the group consisting of a silver-containing compound, a barium-containing compound, a bismuth-containing compound, a tin-containing compound, a titanium-containing compound, a zinc-containing compound, and a combination thereof. 
     
     
         22 . A biocidal ceramic article comprising:
 a substrate and   a ceramic glaze layer on the substrate,
 wherein the ceramic glaze layer comprises at least one metal or metal containing compound selected from the group consisting of Cu 2 O, Cu(OH) 2 , Cu, CuO 3 , Cu 2 O 3 , and a combination thereof, and at least one non-copper metal or non-copper metal containing compound. 
   
     
     
         23 . The biocidal ceramic article according to  claim 22 , wherein the substrate is a ceramic substrate. 
     
     
         24 . The biocidal ceramic article according to  claim 22 , wherein the ceramic glaze layer is a fired or cured ceramic glaze layer.