Method of reconditioning an electronic processing device

Abstract

The invention provides a method of assessing suitability of a component for assembly in an electronic processing device. A first step of the method comprises obtaining a component of an electronic processing device. This may be obtained from a disassembled electronic processing device. The method includes subjecting said component to a plurality of tests where at least two of said tests are of a different technical character to each other and assessing test data derived from each of said plurality of tests to determine to a selected or calculated degree of confidence whether or not the tested component is to be considered as a suitable component for assembly in an electronic processing device of a type to which the tested component belongs. The test data may be automatically assessed by a data processing system.

1 . A method of reconditioning an electronic processing device, the method comprising the steps of:
 disassembling an electronic processing device to at least obtain a main processor board assembly, said main processor board assembly having a unique identifier belonging to or associated therewith;   assessing suitability of the main processor board assembly for reassembly in an electronic processing device; and, if suitable,   reassembling said main processor board assembly with reconditioned or new electronic processing device components to thereby provide a reconditioned electronic processing device including the unique identifier belonging to or associated with said main processor board assembly.   
     
     
         2 . The method of  claim 1  further comprising the step of using the unique identifier belonging to or associated with said main processor board assembly to track at least said main processor board assembly through a reconditioning process. 
     
     
         3 . The method of  claim 1 , wherein the unique identifier associated with said main processor board assembly is stored in a memory of the main processor board assembly. 
     
     
         4 . The method of  claim 1 , wherein the unique identifier associated with said main processor board assembly comprises an International Mobile Equipment Identity (IMEI). 
     
     
         5 . The method of  claim 4 , wherein the International Mobile Equipment Identity (IMEI) comprises an IMEI of the disassembled electronic processing device. 
     
     
         6 . The method of  claim 4 , wherein the International Mobile Equipment Identity (IMEI) of the disassembled electronic processing device comprises an operational IMEI and the method further comprises using the operational IMEI as the IMEI of the reconditioned electronic processing device. 
     
     
         7 . The method of  claim 1 , wherein the main processor board assembly is reassembled with reconditioned or new electronic processing device components comprising a screen assembly and a housing to thereby provide the reconditioned electronic processing device. 
     
     
         8 . The method of  claim 4 , further comprising the step of marking said IMEI on an exterior surface of the reconditioned electronic processing device. 
     
     
         9 . The method of  claim 1 , wherein all of the steps are performed in a first processing facility. 
     
     
         10 . The method of  claim 9 , further comprising the step of sending all disassembled parts of the disassembled electronic processing device save for the main processor board assembly to a second processing facility. 
     
     
         11 . The method of  claim 9 , further comprising the step of receiving at the first facility one or more reconditioned or new electronic processing device components prior to receiving the electronic processing device for disassembly. 
     
     
         12 . The method of  claim 1 , wherein, if at the assessment step, the main processor board assembly is found not suitable for reassembly in an electronic processing device then sending said main processor board assembly to a work station for one or more of repair and reconditioning. 
     
     
         13 . The method of  claim 1 , wherein the assessment step comprises:
 subjecting said main processor board assembly or components thereof to a plurality of tests where at least two of said tests are of a different technical character to each other; and   assessing test data derived from each of said plurality of tests to determine to a selected or calculated degree of confidence whether or not the main processor board assembly or components thereof is to be considered as suitable for reassembly in an electronic processing device of a type to which the tested main processor board assembly or components thereof belongs.   
     
     
         14 . The method of  claim 13 , wherein the plurality of tests includes at least one test which, based on data derived from such test, provides a selected or calculated, but not absolute degree of confidence that the tested main processor board assembly or components thereof is suitable for reassembly in which case the process of testing is continued if the degree of confidence is above a selected or calculated threshold. 
     
     
         15 . The method of  claim 13 , wherein the plurality of tests includes at least one test which, based on data derived from such test, provides an absolute certainty that the tested main processor board assembly or components thereof is not authentic, in which case the process of testing is concluded and the tested main processor board assembly or components thereof is identified as not being suitable for reassembly in an electronic processing device of a type to which the type of tested main processor board assembly or components thereof belongs. 
     
     
         16 . The method of  claim 13 , wherein one of the plurality of tests of a first technical character comprises one or more of: a physical test; and a visual test; and another of the plurality of tests of a second, different technical character comprises one or more of: a spectroscopy test; an operational test; and a data processing test. 
     
     
         17 . The method of  claim 13 , wherein the data derived from each test is assessed against data compiled from one or more main processor board assembly or components thereof of the same type known, considered or assessed to be authentic and/or from one or more main processor board assembly or components thereof of the same type known with absolute certainty to be authentic. 
     
     
         18 . The method of  claim 13 , wherein the data derived from each test is assessed against data for a main processor board assembly or components thereof of the same type provided by any of a manufacturer, supplier, or designer of the electronic processing device or from an authorized supplier of main processor board assemblies or components thereof to the manufacturer, supplier, or designer of the electronic processing device. 
     
     
         19 . The method of  claim 13 , wherein the data derived from each test is assessed against data compiled from prior testing of one or more main processor board assembly or components thereof of the same type. 
     
     
         20 . The method of  claim 13 , wherein one of the plurality of test comprises one or more of a data processing test of the component and an operational process of the component. 
     
     
         21 . A system for reconditioning an electronic processing device, the system comprising:
 a system for disassembling an electronic processing device to at least obtain a main processor board, said main processor board assembly having a unique identifier belonging to or associated therewith;   a system for assessing suitability of the main processor board assembly for reassembly in an electronic processing device; and   a system for reassembling said main processor board assembly with reconditioned or new electronic processing device components to thereby provide a reconditioned electronic processing device including the unique identifier belonging to or associated with said main processor board assembly.