Polishing pad and polishing method

Abstract

There is provided a polishing pad that ensures sufficiently performing polishing up to a part near a projection portion and an inner surface of a recessed portion in a surface of an object to be polished in polishing the object to be polished having a surface with at least one of the projection portion and the recessed portion. The polishing pad includes a napped part ( 1 ) where a plurality of fibers ( 12 ) with a length of 3 mm or more are napped on a surface of a base portion ( 11 ). A count of the fibers ( 12 ) is 10000 pieces/cm 2 or more.

1 . A polishing pad comprising
 a base portion, and   a napped part in which a plurality of fibers with a length of 3 mm or more are napped on a surface of the base portion, wherein   a count of the fibers is 10000 pieces/cm 2  or more.   
     
     
         2 . The polishing pad according to  claim 1 , comprising
 a multilayer structure including an elastic layer made of an elastic body formed in an opposite side of a side of the base portion in which the fibers are napped.   
     
     
         3 . The polishing pad according to  claim 1 , wherein
 the fibers have a thickness of 20 μm or less.   
     
     
         4 . The polishing pad according to  claim 1 , wherein
 the fibers have a mass of 200 g/m 2  or more.   
     
     
         5 . The polishing pad according to  claim 1  used for polishing an object to be polished containing a metal or a metal oxide material. 
     
     
         6 . The polishing pad according to  claim 1  used for polishing an object to be polished having a surface with at least one of a projection portion and a recessed portion. 
     
     
         7 . The polishing pad according to  claim 1  used for polishing using a polishing composition containing abrasives with an average particle diameter of 0.5 μm or less and a water. 
     
     
         8 . The polishing pad according to  claim 1  used for a single-surface polishing device, the single-surface polishing device including a holder, a platen to which the polishing pad is mounted, and a rotation mechanism, the holder holding the object to be polished, the rotation mechanism rotating the holder and the platen, the single-surface polishing device causing the object to be polished to contact the polishing pad to polish only one surface among a plurality of surfaces that the object to be polished has. 
     
     
         9 . A polishing method comprising
 polishing an object to be polished using the polishing pad according to  claim 1 .   
     
     
         10 . A polishing method comprising
 polishing an object to be polished using the polishing pad according to  claim 1  and a polishing composition, the polishing composition containing abrasives with an average particle diameter of 0.5 μm or less and water.   
     
     
         11 . The polishing method according to  claim 10 , wherein
 the object to be polished contains a metal or a metal oxide material.   
     
     
         12 . The polishing method according to  claim 10 , wherein
 the object to be polished has a surface with at least one of a projection portion and a recessed portion.   
     
     
         13 . The polishing method according to  claim 10 , further comprising:
 using a single-surface polishing device, the single-surface polishing device including a holder, a platen to which the polishing pad is mounted, and a rotation mechanism, the holder holding the object to be polished, the rotation mechanism rotating the holder and the platen, and   causing the object to be polished to contact the polishing pad to polish only one surface among a plurality of surfaces of the object to be polished.   
     
     
         14 . The polishing pad according to  claim 2 , wherein
 the fibers have a thickness of 20 μm or less.   
     
     
         15 . The polishing pad according to  claim 2 , wherein
 the fibers have a mass of 200 g/m 2  or more.   
     
     
         16 . The polishing pad according to  claim 3 , wherein
 the fibers have a mass of 200 g/m 2  or more.   
     
     
         17 . The polishing pad according to  claim 2  used for polishing an object to be polished containing a metal or a metal oxide material. 
     
     
         18 . The polishing pad according to  claim 3  used for polishing an object to be polished containing a metal or a metal oxide material. 
     
     
         17 . The polishing pad according to  claim 4  used for polishing an object to be polished containing a metal or a metal oxide material. 
     
     
         18 . The polishing pad according to  claim 2  used for polishing an object to be polished having a surface with at least one of a projection portion and a recessed portion. 
     
     
         19 . The polishing pad according to  claim 3  used for polishing an object to be polished having a surface with at least one of a projection portion and a recessed portion. 
     
     
         20 . The polishing pad according to  claim 4  used for polishing an object to be polished having a surface with at least one of a projection portion and a recessed portion.