Conductive Polyamide/Polyphenylene Ether Resin Composition and Automotive Molded Article Manufactured Therefrom

Abstract

The present invention relates to a conductive polyamide/polyphenylene ether resin composition and an automotive molded article manufactured therefrom. The conductive polyamide/polyphenylene ether resin composition comprises: (a) a base resin comprising (a-1) polyphenylene ether and (a-2) polyamide; (b) a modified polyolefin based resin; (c) an impact modifier; (d) a compatibilizer; and (e) a conductive filler, and the conductive polyamide/polyphenylene ether resin composition is formed in a domain phase and a matrix phase, wherein the domain phase comprises (a-1) the polyphenylene ether and (c) the impact modifier and the matrix phase comprises (a-2) the polyamide and (b) the modified polyolefin based resin, (e) the conductive filler being dispersed on the domain phase and the matrix phase and the content of the conductive filler dispersed on the matrix phase being higher than that of the conductive filler dispersed on the domain phase.

1 . A conductive polyamide/polyphenylene ether resin composition, comprising:
 (a) a base resin comprising (a-1) a polyphenylene ether and (a-2) a polyamide; (b) a modified polyolefin resin, wherein the modified polyolefin resin (b) is maleic anhydride-modified low density polyethylene; (c) an impact modifier; (d) a compatibilizer; and (e) conductive fillers,   wherein the conductive polyamide/polyphenylene ether resin composition comprises a domain phase and a matrix phase,   the domain phase comprising the polyphenylene ether (a-1) and the impact modifier (c),   the matrix phase comprising the polyamide (a-2) and the modified polyolefin resin (b),   the conductive fillers (e) are dispersed in the domain phase and the matrix phase, the conductive fillers being dispersed in a larger amount in the matrix phase than in the domain phase,   wherein the conductive polyamide/polyphenylene ether resin composition is prepared by preparing a conductive polyphenylene ether resin composition through melt kneading of the polyphenylene ether (a-1), the modified polyolefin resin (b), the impact modifier (c), the compatibilizer (d) and the conductive fillers (e), and adding the polyamide (a-2) to the conductive polyphenylene ether resin composition, followed by melt kneading, and   wherein the conductive polyamide/polyphenylene ether resin composition has a falling dart impact strength of 25 J to 80 J as measured in accordance with ASTM D3763 and a surface resistance of 10 Ω/square to 10 11  Ω/square.   
     
     
         2 . The conductive polyamide/polyphenylene ether resin composition according to  claim 1 , wherein the base resin (a) comprises 10 wt % to 65 wt % of the polyphenylene ether (a-1) and 35 wt % to 90 wt % of the polyamide (a-2),
 the conductive polyamide/polyphenylene ether resin composition comprising:   1 to 15 parts by weight of the modified polyolefin resin (b),   1 to 15 parts by weight of the impact modifier (c),   0.2 to 10 parts by weight of the compatibilizer (d), and   0.1 to 5 parts by weight of the conductive fillers (e), relative to 100 parts by weight of the base resin (a).   
     
     
         3 . The conductive polyamide/polyphenylene ether resin composition according to  claim 1 , wherein the conductive fillers (e) comprises carbon black and/or carbon fibrils. 
     
     
         4 . The conductive polyamide/polyphenylene ether resin composition according to  claim 1 , wherein the polyphenylene ether (a-1) comprises poly(2,6-dimethyl-1,4-phenylene) ether, poly(2,6-diethyl-1,4-phenylene) ether, poly(2,6-dipropyl-1,4-phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2-methyl-6-propyl-1,4-phenylene) ether, poly(2-ethyl-6-propyl-1,4-phenylene) ether, poly(2,6-diphenyl-1,4-phenylene) ether, a copolymer of poly(2,6-dimethyl-1,4-phenylene) ether and poly(2,3,6-trimethyl-1,4-phenylene) ether, a copolymer of poly(2,6-dimethyl-1,4-phenylene) ether and poly(2,3,6-triethyl-1,4-phenylene) ether, and/or a combination thereof. 
     
     
         5 . The conductive polyamide/polyphenylene ether resin composition according to  claim 1 , wherein the polyamide (a-2) comprises polyamide 6, polyamide 66, polyamide 46, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 6/66, polyamide 6/612, polyamide MXD6, polyamide 6/MXD6, polyamide 66/MXD6, polyamide 6T, polyamide 6I, polyamide 6/6T, polyamide 6/6I, polyamide 66/6T, polyamide 66/6I, polyamide 6/6T/6I, polyamide 66/6T/6I, polyamide 9T, polyamide 9I, polyamide 6/9T, polyamide 6/9I, polyamide 66/9T, polyamide 6/12/9T, polyamide 66/12/9T, polyamide 6/12/9I, polyamide 66/12/6I, and/or a combination thereof. 
     
     
         6 . The conductive polyamide/polyphenylene ether resin composition according to  claim 1 , wherein the modified polyolefin resin (b) is a phase transfer agent for moving the conductive fillers (e) from the domain phase to the matrix phase. 
     
     
         7 . The conductive polyamide/polyphenylene ether resin composition according to  claim 1 , wherein the impact modifier (c) comprises a block copolymer comprising an aromatic vinyl compound and a conjugated diene compound, a hydrogenated block copolymer obtained by hydrogenation of the block copolymer comprising the aromatic vinyl compound and the conjugated diene compound, a modified block copolymer obtained by modification of the block copolymer with a compound comprising α,β-unsaturated dicarboxylic acid and/or α,β-unsaturated dicarboxylic acid derivative, and/or a modified hydrogenated block copolymer obtained by modification of the hydrogenated block copolymer with a compound comprising α,β-unsaturated dicarboxylic acid and/or α,β-unsaturated dicarboxylic acid derivative. 
     
     
         8 . The conductive polyamide/polyphenylene ether resin composition according to  claim 1 , wherein the compatibilizer (d) comprises maleic acid, maleic anhydride, maleic hydrazide, dichloro maleic anhydride, unsaturated dicarboxylic acid, fumaric acid, citric acid, citric acid anhydride, malic acid, and/or agaricic acid. 
     
     
         9 . The conductive polyamide/polyphenylene ether resin composition according to  claim 1 , wherein the conductive polyamide/polyphenylene ether resin composition has a falling dart impact strength of 35 J to 80 J as measured in accordance with ASTM D3763 and a surface resistance of 10 2  Ω/square to 10 8  Ω/square. 
     
     
         10 . A molded article for automobiles produced using the conductive polyamide/polyphenylene ether resin composition according to  claim 1 .