Apparatus for transcutaneously treating tissue

Abstract

Apparatus for transcutaneously treating tissue beneath a skin surface using radiofrequency energy. The apparatus includes an electrode assembly supported by a handpiece. The electrode assembly includes an electrode configured to transfer the radiofrequency energy through the skin surface to the tissue. A force sensor, which is located in the handpiece, is configured to detect an amount of force applied by the electrode against the skin surface.

What is claimed is: 
     
         1 . A handpiece for non-invasively treating tissue using RF energy, the handpiece comprising:
 a handpiece assembly including a handpiece housing; and   an electrode assembly coupled to the handpiece housing, the electrode assembly including at least one RF electrode with a dielectric portion and a conductive portion disposed on the dielectric portion, the RF electrode configured to deliver RF energy to the tissue, and the conductive portion arranged relative to the dielectric portion such that the RF energy is capacitively coupled from the conductive portion for delivery into the tissue by transmission through the dielectric portion.   
     
     
         2 . The handpiece of  claim 1  wherein the electrode assembly includes a thermal sensor. 
     
     
         3 . The handpiece of  claim 1  wherein the dielectric portion is arranged to contact the tissue. 
     
     
         4 . The handpiece of  claim 1  wherein the dielectric portion is positioned around at least a portion of a periphery of the conductive portion. 
     
     
         5 . The handpiece of  claim 1  wherein the dielectric portion is positioned around an entirety of a periphery of the conductive portion. 
     
     
         6 . The handpiece of  claim 1  wherein the electrode assembly is moveable within at least a portion of the handpiece housing. 
     
     
         7 . The handpiece of  claim 1 , wherein the electrode assembly is slideably moveable within at least a portion of the handpiece housing.