Electroplating apparatus

Abstract

An apparatus for electroplating which is applicable to the electroplating of workpiece is disclosed. The apparatus includes: an electroplating solution container, a target, an absorbent piece, and a power supply. All the electroplating solution, workpiece, absorbent piece, and target are placed inside the electroplating solution container with at least partial portions of each workpiece, absorbent piece and target submerged in the electroplating solution. The positive electrode of the power supply is electrically connected to the target while its negative electrode is electrically connected to the workpiece and absorbent piece simultaneously. When the power supply imposes a current through the circuit, the target releases metal ions into the electroplating solution and metal ions reduce and a metal coating is formed on the workpiece. In the meantime, carbocations in the electroplating solution are adsorbed on the absorbent piece.

What is claimed is: 
     
         1 . An electroplating apparatus, applicable to a workpiece to be electroplated, comprising:
 an electroplating container, which contains an electroplating solution and the workpiece to be electroplated at least partially submerged in the electroplating solution;   a target, which is made of conductive material and is contained in the electroplating container with at least partial submersion in the electroplating solution;   an absorbent piece, which is contained in the electroplating container with at least partial submersion in the electroplating solution; and   a power supply, which is equipped with a positive electrode and a negative electrode, connected electrically to the target and the workpiece, respectively;   when the power supply imposes an operating current, the target dissolves metal ions into the electroplating solution, the metal ions reduce into metal atoms and a coating is formed on the surface of the workpiece to be electroplated, and the absorbent piece adsorbs the carbocations in the electroplating solution.   
     
     
         2 . The electroplating apparatus of  claim 1 , wherein the absorbent piece is select from made of metal, ceramic or fabric. 
     
     
         3 . The electroplating apparatus of  claim 2 , wherein the material of the target is selected from copper alloy or nickel alloy, and the absorbent piece comprises porous nickel. 
     
     
         4 . The electroplating apparatus of  claim 2 , wherein the material of the target is selected from gold or platinum, and the absorbent piece comprises non-woven fabric. 
     
     
         5 . The electroplating apparatus of  claim 1 , wherein the range of the operating current density is between 0.001-0.005 A/cm 2 . 
     
     
         6 . The electroplating apparatus of  claim 1 , wherein the electroplating solution comprises choline chloride, nitrogenous compound, metal chloride, bio bacteria and inorganic acid agent. 
     
     
         7 . The electroplating apparatus of  claim 6 , wherein the electroplating solution further comprises saccharin. 
     
     
         8 . The electroplating apparatus of  claim 6 , wherein the nitrogenous compound is selected from ammonia, urea or uric acid. 
     
     
         9 . The electroplating apparatus of  claim 6 , wherein the metal chloride is selected from nickel chloride, copper chloride, cobalt chloride, zinc chloride, gold chloride or silver chloride. 
     
     
         10 . The electroplating apparatus of  claim 6 , wherein the inorganic acid agent is selected from nitric acid, boric acid, hydrobromic acid or perchloric acid. 
     
     
         11 . The electroplating apparatus of  claim 6 , wherein the electroplating solution further comprises glycerol (C3H8O3) which combines with the inorganic acid agent to form compound lipid. 
     
     
         12 . The electroplating apparatus of  claim 11 , wherein the volume fraction between inorganic acid agent and the glycerol is within 4:1 to 3:1. 
     
     
         13 . The electroplating apparatus of  claim 6 , wherein the bio bacteria is selected from  Saccharomycetes, Lactobacillus casei  strain shirota, photosynthetic bacteria,  Lactobacillus, Bacillus  and their combination, or fermented milk. 
     
     
         14 . The electroplating apparatus of  claim 6 , wherein the electroplating solution further comprises chitin ((C8H13O5N)n) which is added into the inorganic acid agent. 
     
     
         15 . The electroplating apparatus of  claim 1  further comprising a magnetic stirrer, which is placed in the electroplating container and can rotate to mix the electroplating solution.