Reduction of magnetic sensor component variation due to magnetic materials through the application of magnetic field

Abstract

A microelectronic device, possibly a packaged microelectronic device, contains a magnetic sensor component and magnetizable structural features. Magnetic moments of the magnetizable structural features are aligned parallel to each other. The microelectronic device is formed by applying a magnetic field so as to align magnetic moments of the magnetizable structural features with the applied magnetic field. Application of the magnetic field is subsequently discontinued. The magnetic moments of the magnetizable structural features remain aligned parallel to each other after the applied magnetic field is discontinued.

What is claimed is: 
     
         1 . A microelectronic device, comprising:
 a substrate;   a magnetic sensor component; and   magnetizable structural features containing magnetizable material, separate from the magnetic sensor component, each magnetizable structural feature having a magnetic moment, wherein the magnetic moments of the magnetizable structural features are aligned parallel to each other.   
     
     
         2 . The microelectronic device of  claim 1 , further comprising an active circuit proximate to the magnetizable structural features and the magnetic sensor component. 
     
     
         3 . The microelectronic device of  claim 1 , wherein the magnetizable structural features comprise bond pads and the magnetizable material comprises nickel. 
     
     
         4 . The microelectronic device of  claim 1 , wherein the magnetizable structural features comprise a seal ring around a perimeter of the microelectronic device and the magnetizable material comprises nickel. 
     
     
         5 . The microelectronic device of  claim 1 , wherein the magnetic moments of the magnetizable structural features are aligned parallel to a top surface of the substrate. 
     
     
         6 . The microelectronic device of  claim 1 , wherein the magnetic sensor component includes a fluxgate magnetometer core. 
     
     
         7 . The microelectronic device of  claim 1 , wherein magnetic sensor component includes a magnetoresistive sensor. 
     
     
         8 . The microelectronic device of  claim 1 , wherein magnetic sensor component includes a Hall plate. 
     
     
         9 . The microelectronic device of  claim 1 , wherein the magnetic moments of the magnetizable structural features are aligned perpendicular to a field measurement axis of the magnetic sensor component. 
     
     
         10 . The microelectronic device of  claim 1 , further comprising dummy magnetizable structural features which are disconnected from the active circuit. 
     
     
         11 . A packaged microelectronic device, comprising:
 an active circuit;   a magnetic sensor component;   a package housing the active circuit and the magnetic sensor component; and   magnetizable structural features disposed in the package, separate from the magnetic sensor component, wherein the magnetizable structural features of the package contain magnetizable material, each magnetizable structural feature having a magnetic moment, wherein the magnetic moments of the magnetizable structural features are aligned parallel to each other.   
     
     
         12 . The packaged microelectronic device of  claim 11 , wherein magnetic sensor component includes a fluxgate magnetometer core. 
     
     
         13 . The packaged microelectronic device of  claim 11 , wherein magnetic sensor component includes a magnetoresistive sensor.