Sealing a heat pipe

Abstract

Examples are disclosed that relate to sealing a heat pipe. One example provides a heat pipe including a heat pipe body having a sealed end at which opposing interior surfaces of the heat pipe body are joined, a sealant located in a least a portion of the sealed end of the heat pipe body between the opposing interior surface, the sealant having a higher oxygen transport rate than the heat pipe body, and a permanent seal forming an outer surface of the sealed end.

1 . A heat pipe, comprising:
 a heat pipe body comprising a sealed end at which opposing interior surfaces of the heat pipe body are joined;   a sealant located in a least a portion of the sealed end of the heat pipe body between the opposing interior surfaces, the sealant comprising a higher oxygen transport rate than the heat pipe body; and   a permanent seal forming an outer surface of the sealed end.   
     
     
         2 . The heat pipe of  claim 1 , wherein the sealant comprises a polymer material. 
     
     
         3 . The heat pipe of  claim 2 , wherein the sealant comprises an epoxy material. 
     
     
         4 . The heat pipe of  claim 3 , wherein the epoxy material comprises a polyepoxy/polyamine material. 
     
     
         5 . The heat pipe of  claim 2 , wherein the sealant comprises a laminated film. 
     
     
         6 . The heat pipe of  claim 2 , wherein the sealant comprises one or more of a thermoplastic material and a pressure sensitive adhesive. 
     
     
         7 . The heat pipe of  claim 1 , wherein the permanent seal comprises a weld. 
     
     
         8 . The heat pipe of  claim 1 , wherein the permanent seal comprises a metallization layer. 
     
     
         9 . A method for manufacturing a heat pipe, the method comprising:
 applying a sealant on an interior surface of a heat pipe body adjacent to an open end of the heat pipe body;   inserting a tube in the open end of the heat pipe body and reducing a pressure within the heat pipe body via the tube;   adding a working fluid to the interior of the heat pipe body;   while the tube is inserted in the open end of the heat pipe body, applying pressure to the heat pipe body to press together opposing interior surfaces on which the sealant is applied to form a temporary gas barrier; and   after forming the temporary gas barrier, forming a permanent gas barrier to seal the open end of the heat pipe body.   
     
     
         10 . The method of  claim 9 , wherein applying the sealant comprises applying a multilayer laminate material. 
     
     
         11 . The method of  claim 9 , wherein applying the sealant comprises applying a polyepoxy barrier film. 
     
     
         12 . The method of  claim 9 , wherein applying the sealant comprises applying the sealant in a fluid phase. 
     
     
         13 . The method of  claim 9 , wherein applying pressure to the heat pipe body comprises applying pressure at a location beyond a distal end of the tube inserted in the open end. 
     
     
         14 . The method of  claim 9 , wherein applying pressure to the heat pipe body further comprises applying heat at the location beyond the distal end of the tube to form a seal with the sealant. 
     
     
         15 . The method of  claim 9 , wherein forming the permanent gas barrier comprises one or more of forming a weld and forming a metallization layer. 
     
     
         16 . The method of  claim 9 , further comprising cutting the heat pipe body at a location of the sealant after forming the temporary gas barrier. 
     
     
         17 . An electronic device, comprising:
 a heat-generating component; and   a heat-pipe positioned to transport heat from the heat-generating component, the heat pipe comprising
 a heat pipe body comprising a sealed end at which opposing interior surfaces of the heat pipe body are joined; 
 a sealant located in a least a portion of the sealed end of the heat pipe body between the opposing interior surface, the sealant comprising a higher oxygen transport rate than the heat pipe body; and 
 a permanent seal forming an outer surface of the sealed end, the permanent seal comprising a lower oxygen transport rate than the sealant. 
   
     
     
         18 . The electronic device of  claim 17 , wherein the electronic device comprises a portable electronic device. 
     
     
         19 . The electronic device of  claim 17 , wherein the sealant comprises one or more of an epoxy polymer and a thermoplastic adhesive 
     
     
         20 . The electronic device of  claim 17 , wherein the permanent seal comprises one or more of a weld and a metallization layer.