US2019115922A1PendingUtilityA1
Processor For Implementing Mathematical Functions or Models
Est. expiryFeb 13, 2036(~9.5 yrs left)· nominal 20-yr term from priority
H03K 19/17728G06F 7/4876G06F 15/7842G06F 15/7867
53
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Claims
Abstract
A processor comprises an array of computing elements, with each computing element comprising an arithmetic logic circuit (ALC) and at least one three-dimensional memory (3D-M) array. The 3D-M array stores at least a portion of a look-up table (LUT) for a non-arithmetic function, while the ALC performs arithmetic operations on the LUT data.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A processor for implementing a mathematical function, comprising:
at least first and second memory arrays on a memory level, wherein said first memory array stores at least a first portion of a first look-up table (LUT) for a first mathematical function; and, said second memory array stores at least a second portion of a second LUT for a second mathematical function; at least an arithmetic logic circuit (ALC) on a logic level for performing at least an arithmetic operation on selected data from said first LUT or said second LUT, wherein said logic level is a different physical level than said memory level; and means for communicatively coupling said memory level and said logic level; wherein said mathematical function is a combination of at least said first and second mathematical functions; and, each of said first and second mathematical functions includes more operations than arithmetic operations performable by said ALC.
2 . The processor according to claim 1 , further comprising a semiconductor substrate, wherein said logic level is disposed on said semiconductor substrate; said memory level is disposed above said substrate; and, said logic level and said memory level are communicatively coupled by a plurality of contact vias.
3 . The processor according to claim 2 , wherein said first memory array is a first three-dimensional memory (3D-M) array; and, said second memory array is a second 3D-M array.
4 . The processor according to claim 3 , wherein said first or second 3D-M array at least partially covers said ALC.
5 . The processor according to claim 1 , wherein said first LUT includes the functional values of said mathematical function; and, said second LUT includes the derivative values of said mathematical function.
6 . The processor according to claim 1 , wherein said mathematical function is a composite function of said first and second mathematical functions.
7 . The processor according to claim 1 , wherein said ALC comprises at least an adder, a multiplier, or a multiply-accumulator (MAC).
8 . The processor according to claim 1 , wherein said ALC comprises at least a pre-processing circuit and/or a post-processing circuit.
9 . The processor according to claim 1 , wherein said arithmetic operations performable by said ALC consist of addition, subtraction and multiplication.
10 . The processor according to claim 1 , wherein said processor is a micro-controller, a controller, a central processing unit (CPU), a digital signal processor (DSP), a graphic processing unit (GPU), a network-security processor, an encryption/decryption processor, an encoding/decoding processor, a neural-network processor, or an artificial intelligence (AI) processor.
11 . A processor for simulating a system including a system component, comprising:
at least a memory array for storing at least a portion of a look-up table (LUT) for a mathematical model of said system component; at least an arithmetic logic circuit (ALC) for performing at least an arithmetic operation on selected data from said LUT; and means for communicatively coupling said memory array and said ALC; wherein said mathematical model cannot be represented by a combination of arithmetic operations performable by said ALC.
12 . The processor according to claim 11 , wherein said memory array is disposed on a memory level; said ALC is disposed on a logic level; said memory level and said logic level are different physical levels.
13 . The processor according to claim 11 , further comprising a semiconductor substrate, wherein said ALC is disposed on said semiconductor substrate; said memory array is disposed above said substrate; and, said ALC and said memory array are communicatively coupled by a plurality of contact vias.
14 . The processor according to claim 13 , wherein said memory array is a three-dimensional memory (3D-M) array.
15 . The processor according to claim 11 , wherein said LUT includes at least raw measurement data.
16 . The processor according to claim 11 , wherein said LUT includes at least smoothed measurement data.
17 . The processor according to claim 11 , wherein said ALC comprises at least an adder, a multiplier, or a multiply-accumulator (MAC).
18 . The processor according to claim 11 , wherein said ALC comprises at least a pre-processing circuit and/or a post-processing circuit.
19 . The processor according to claim 11 , wherein said arithmetic operations performable by said ALC consist of addition, subtraction and multiplication.
20 . The processor according to claim 11 , wherein said processor is a micro-controller, a controller, a central processing unit (CPU), a digital signal processor (DSP), a graphic processing unit (GPU), a network-security processor, an encryption/decryption processor, an encoding/decoding processor, a neural-network processor, or an artificial intelligence (AI) processor.Join the waitlist — get patent alerts
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