Epoxy resin composition, process for producing same, and uses of said composition

Abstract

The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.

1 - 10 . (canceled) 
     
     
         11 . An epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): 
       
         
           
           
               
               
           
         
       
       wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): 
       
         
           
           
               
               
           
         
       
       wherein Y is a bond, a C 1-6  alkylene group, an oxygen atom (—O—), or a group represented by the formula: —S(O) m — wherein m is 0, 1, or 2;
 R 1  is the same or different, and is a C 1-18  alkyl group, a C 2-9  alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; 
 R 2  is the same or different, and is a C 1-18  alkylene group, wherein one or more carbon atoms of this group other than a carbon atom directly bonded to a silicon atom may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; 
 R 3  is the same or different, and is a C 1-18  alkyl group, a C 2-9  alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; and 
 n is the same or different, and is an integer of 0 to 3. 
 
     
     
         12 . The epoxy resin composition according to  claim 11 , wherein the curing accelerator is a nitrogen-containing curing accelerator. 
     
     
         13 . The epoxy resin composition according to  claim 12 , wherein the nitrogen-containing curing accelerator is a tertiary amine compound or an imidazole compound. 
     
     
         14 . The epoxy resin composition according to  claim 12 , wherein the nitrogen-containing curing accelerator is an imidazole compound. 
     
     
         15 . The epoxy resin composition according to  claim 12 , wherein the nitrogen-containing curing accelerator is a tertiary amine compound. 
     
     
         16 . The epoxy resin composition according to  claim 11 , wherein the epoxy resin is represented by the formula (1a): 
       
         
           
           
               
               
           
         
       
       wherein 
       X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2a): 
       
         
           
           
               
               
           
         
       
       wherein 
       Y is a bond, a C 1-6  alkylene group, an oxygen atom (—O—), or a group represented by the formula: —S(O) m — wherein m is 0, 1, or 2;
 R 1  is the same or different, and is a C 1-18  alkyl group, a C 2-9  alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; 
 R 2  is the same or different, and is a C 1-18  alkylene group, wherein one or more carbon atoms of this group other than a carbon atom directly bonded to a silicon atom may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; 
 R 3  is the same or different, and is a C 1-18  alkyl group, a C 2-9  alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; and 
 n is the same or different, and is an integer of 0 to 3. 
 
     
     
         17 . The epoxy resin composition according to  claim 11 , wherein the epoxy resin is represented by the formula (1a): 
       
         
           
           
               
               
           
         
       
       wherein 
       all R 1  are C 1-3  alkyl groups, both n are 0, both R 2  are dimethylene groups, and X is a 1,4-phenylene group. 
     
     
         18 . The epoxy resin composition according to  claim 11 , wherein the acid anhydride-based curing agent is at least one member selected from the group consisting of cyclic aliphatic acid anhydrides, aromatic acid anhydrides, and aliphatic acid anhydrides. 
     
     
         19 . The epoxy resin composition according to  claim 11 , wherein the acid anhydride-based curing agent is at least one member selected from the group consisting of hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, 1-methylnorbornane-2,3-dicarboxylic anhydride, 5-methylnorbornane-2,3-dicarboxylic anhydride, norbornane-2,3-dicarboxylic anhydride, 1-methylnadic anhydride, 5-methylnadic anhydride, nadic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, 3-methyltetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, and dodecenylsuccinic anhydride. 
     
     
         20 . A process for producing the epoxy resin composition according to  claim 11 , the process comprising mixing an epoxy resin represented by the formula (1), an acid anhydride-based curing agent, and a curing accelerator. 
     
     
         21 . A cured product of the epoxy resin composition according to  claim 11 . 
     
     
         22 . A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, a printed circuit board material, or a composite material, each of which uses the epoxy resin composition according to  claim 11  or a cured product thereof.