Cooling system for a server

Abstract

Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold.

What is claimed is: 
     
         1 . A liquid cooling system for a plurality of server modules, the system comprising:
 a fluid distribution and collection manifold mounted to a server rack housing the plurality of server modules, the fluid distribution and collection manifold includes:
 an inlet line configured to receive a first cooling medium from the plurality of server modules through an outlet conduit for each server module, wherein each outlet conduit connects to the inlet line by self-sealing fluid connectors; and 
 an outlet line configurated to feed the first cooling medium to the plurality of server modules through an inlet conduit for each server module, wherein each inlet conduit connects to the outlet line by self-sealing fluid connectors; 
   a plurality of cold plate elements, wherein within each of the plurality of server modules one or more of the plurality of cold plate elements are connected to the inlet conduit and outlet conduit for the corresponding server module and each cold plate element is configured to thermally connect to at least one heat generating component;   a heat exchanger fluidly connected to the inlet line and the outlet line, wherein the inlet line delivers the first cooling medium circulated through the plurality of server modules and cold plate elements to the heat exchanger where heat transferred from the heat generating components to the first cooling medium is transferred via the heat exchanger to a second cooling medium;   a pair of fluid connectors connected to the heat exchanger, wherein the fluid connectors are configured to fluidly connect the heat exchanger to a cooling device so the second cooling medium is circulated between the heat exchanger and a cooling device, wherein the cooling device removes heat from the second cooling medium; and   a pump for circulating the first cooling medium through the plurality of server modules and cold plates;   wherein the first cooling medium and the second cooling medium remain fluidly isolated from each other.   
     
     
         2 . The liquid cooling system of  claim 1 , wherein the heat exchanger is mounted to the server rack housing the plurality of server modules. 
     
     
         3 . The liquid cooling system of  claim 1 , wherein the cooling device is an air-to-liquid heat exchanger. 
     
     
         4 . The liquid cooling system of  claim 1 , further comprising a pump for circulating the second cooling medium between the heat exchanger and the cooling device. 
     
     
         5 . The liquid cooling system of  claim 1 , wherein the heat exchanger includes a cold plate in thermal contact with a hot plate and a thermal transfer medium located between the hot plate and the cold plate to promote transfer of heat from the hot plate to the cold plate. 
     
     
         6 . The liquid cooling system of  claim 1 , wherein each server module may be connected and disconnected from the fluid distribution and collection manifold by the self-sealing fluid connectors, while the remaining server modules continue to be cooled by the circulation of the first cooling medium. 
     
     
         7 . The liquid cooling system of  claim 1 , wherein the cooling system is one of a plurality of duplicate cooling systems, wherein each cooling system cools a separate rack housing a plurality of server modules and the plurality of cooling systems all circulate the second cooling medium to the cooling device where heat is removed. 
     
     
         8 . The liquid cooling system of  claim 1 , wherein the cooling device is positioned outside a server room housing the plurality of server modules. 
     
     
         9 . A method of cooling a server having a plurality of server modules, the method comprising:
 fluidly connecting the plurality of server module to a fluid distribution and collection manifold mounted to a server rack housing the plurality of server modules, wherein:
 an inlet line of the fluid distribution and collection manifold is configured to receive a first cooling medium from the plurality of server modules through an outlet conduit for each server module; and 
 an outlet line of the fluid distribution and collection manifold is configured to feed the first cooling medium to the plurality of server modules through an inlet conduit for each server module; 
 wherein each outlet conduit connects to the inlet line and each inlet conduit connects to the outlet line by self-sealing fluid connectors; 
   fluidly connecting a plurality of cold plate elements and circulating the first cooling medium through the plurality of cold plate elements, wherein within each of the plurality of server modules one or more cold plate elements are connected to the inlet conduit and outlet conduit for the corresponding server module and each cold plate element is configured to thermally connect to at least one heat generating component within the server module;   fluidly connecting a heat exchanger to the inlet line and the outlet line of the fluid distribution and collection manifold, wherein the inlet line delivers the first cooling medium circulated through the plurality of server modules and cold plate elements to the heat exchanger where heat transferred from the heat generating components to the first cooling medium is transferred to a second cooling medium;   fluidly connecting and circulating the second cooling medium between the heat exchanger and a cooling device, wherein the cooling device removes heat from the second cooling medium; and   circulating the first cooling medium through the plurality of server modules and the plurality of cold plates using a pump;   wherein the first cooling medium and the second cooling medium remain fluidly isolated from each other.   
     
     
         10 . The method of  claim 9 , wherein the heat exchanger is mounted to the server rack housing the plurality of server modules. 
     
     
         11 . The method of  claim 9 , wherein the cooling device is an air-to-liquid heat exchanger. 
     
     
         12 . The method of  claim 9 , further comprising circulating the second cooling medium between the heat exchanger and the cooling device using a pump. 
     
     
         13 . The method of  claim 9 , wherein the heat exchanger includes a cold plate in thermal contact with a hot plate and a thermal transfer medium located between the hot plate and the cold plate to promote transfer of heat from the hot plate to the cold plate. 
     
     
         14 . The method of  claim 9 , further comprising fluidly isolating one of the plurality of server modules by disconnecting the self-sealing fluid connectors corresponding to the isolated server module while the remaining server modules continue to be cooled by the circulation of the first cooling medium. 
     
     
         15 . The method of  claim 9 , wherein the cooling device is positioned outside a server room housing the plurality of server modules.