Led display module

Abstract

An LED display module is disclosed. The LED display module includes a substrate; a plurality of multi-pixel packages arrayed in a matrix with rows and columns, respectively, each of the multi-pixel packages including a package substrate and two or more pixels located on the package substrate and each of the pixels including a red LED chip, a green LED chip, and a blue LED chip; and a driver IC adapted to independently control the pixels of the multi-pixel packages. Anode terminals of the LED chips in the pixels adjacent in the row direction are connected in common to one another such that the pixels are scanned in rows in response to scan signals.

What is claimed is: 
     
         1 . A multi-pixel combined LED package comprising:
 a package substrate formed an upper surface and a bottom surface;   a first pixel, a second pixel, a third pixel, and a fourth pixel configured on the upper surface of the package substrate and comprising a red chip, a green chip, and a blue chip, respectively;   a first red individual terminal on the bottom surface of the package substrate connected the red chip of the first pixel and the red chip of the third pixel;   a first green individual terminal on the bottom surface of the package substrate connected the green chip of the first pixel and the green chip of the third pixel;   a first blue individual terminal on the bottom surface of the package substrate connected the blue chip of the first pixel and the blue chip of the third pixel;   a first common electrode pad connected to the red chip, the green chip, and the blue chip of the first pixel and the red chip, the green chip, and the blue chip of the second pixel, respectively and formed the upper surface of the package substrate; and   a first common terminal located on the bottom surface of the package substrate,   wherein the first common terminal connected to the first common electrode pad.   
     
     
         2 . The LED package of  claim 1 , further comprising:
 a second red individual terminal on the bottom surface of the package substrate connected the red chip of the second pixel and the red chip of the fourth pixel;   a second green individual terminal on the bottom surface of the package substrate connected the green chip of the second pixel and the green chip of the fourth pixel; and   a second blue individual terminal on the bottom surface of the package substrate connected the blue chip of the second pixel and the blue chip of the fourth pixel.   
     
     
         3 . The LED package of  claim 1 , further comprising:
 a second common electrode pad connected to the red chip, the green, chip and the blue chip of the third pixel and the red chip, the green chip, and the blue chip of the fourth pixel, respectively and formed the upper surface of the package substrate.   
     
     
         4 . The LED package of  claim 3 , further comprising:
 a second common terminal located on the bottom surface of the package substrate;   wherein the second common terminal connected to the second common electrode pad.   
     
     
         5 . The LED package of  claim 1 , wherein the first pixel located in a first row and a first column, the second pixel located in the first row and a second column, the third pixel located in a second row and the first column, and the fourth pixel located in the second row and the second column. 
     
     
         6 . The LED package of  claim 1 , further comprising:
 a lot of bent structures including a vertical portion penetrating at least one of the package substrate layers and a horizontal portion formed on at least one of the package substrate layers,   wherein the first common terminal connected to the first common electrode pad by the bent structures.   
     
     
         7 . The LED package of  claim 4 , further comprising:
 a lot of bent structures including a vertical portion penetrating at least one of the package substrate layers and a horizontal portion formed on at least one of the package substrate layers,   wherein the second common terminal connected to the second common electrode pad by the bent structures.   
     
     
         8 . The LED package of  claim 1 , wherein a first conductive electrode of the red chip of the first pixel and a first conductive electrode of the red chip of the third pixel are commonly connected by a first R connection means, a first conductive electrode of the green chip of the first pixel and a first conductive electrode of the green chip of the third pixel are commonly connected by a first G connection means, and a first conductive electrode of the blue chip of the first pixel and a first conductive electrode of the blue chip of the third pixel are commonly connected by a first B connection means. 
     
     
         9 . The LED package of  claim 1 , wherein a first conductive electrode of the red chip of the second pixel and a first conductive electrode of the red chip of the fourth pixel are commonly connected by a second R connection means, a first conductive electrode of the green chip of the second pixel and a first conductive electrode of the green chip of the fourth pixel are commonly connected by a second G connection means, and a first conductive electrode of the blue chip of the second pixel and a first conductive electrode of the blue chip of the fourth pixel are commonly connected by a second B connection means. 
     
     
         10 . The LED package of  claim 1 , wherein a second conductive electrode of the red chip, the green chip, and blue chip of the first pixel and a second conductive electrode of the red chip, the green chip, and blue chip of the second pixel are commonly connected by a first common connection means. 
     
     
         11 . The LED package of  claim 1 , wherein a second conductive electrode of the red chip, the green chip, and blue chip of the third pixel and a second conductive electrode of the red chip, the green chip, and blue chip of the fourth pixel are commonly connected by a second common connection means. 
     
     
         12 . A multi-pixel combined LED package comprising:
 a package substrate formed an upper surface and a bottom surface and comprising a plurality of unit substrate layers included a lot of bent structures formed a vertical portion and a horizontal portion;   a first pixel, a second pixel, a third pixel, and a fourth pixel configured on the upper surface of the package substrate and comprising a red chip, a green chip, and a blue chip, respectively;   a first red individual terminal on the bottom surface of the package substrate connected the red chip of the first pixel and the red chip of the third pixel;   a first green individual terminal on the bottom surface of the package substrate connected the green chip of the first pixel and the green chip of the third pixel;   a first blue individual terminal on the bottom surface of the package substrate connected the blue chip of the first pixel and the blue chip of the third pixel; and   an electrode pad of the red chip of the first pixel and an electrode pad of the red chip of the third pixel formed the upper surface of the package substrate,   wherein at least one of the bent structures electrically connected the electrode pad of the red chip of the first pixel, the electrode pad of the red chip of the third pixel, and the first red individual terminal.   
     
     
         13 . The LED package of  claim 12 , further comprising:
 an electrode pad of the green chip of the first pixel and an electrode pad of the green chip of the third pixel formed the upper surface of the package substrate;   wherein at least one of the bent structures electrically connected the electrode pad of the green chip of the first pixel, the electrode pad of the green chip of the third pixel, and the first green individual terminal.   
     
     
         14 . The LED package of  claim 12 , further comprising:
 an electrode pad of the blue chip of the first pixel and an electrode pad of the blue chip of the third pixel formed the upper surface of the package substrate;   wherein at least one of the bent structures electrically connected the electrode pad of the blue chip of the first pixel, the electrode pad of the blue chip of the third pixel, and the first blue individual terminal.   
     
     
         15 . The LED package of  claim 12 , further comprising:
 a second red individual terminal on the bottom surface of the package substrate connected the red chip of the second pixel and the red chip of the fourth pixel;   a second green individual terminal on the bottom surface of the package substrate connected the green chip of the second pixel and the green chip of the fourth pixel; and   a second blue individual terminal on the bottom surface of the package substrate connected the blue chip of the second pixel and the blue chip of the fourth pixel.   
     
     
         16 . The LED package of  claim 15 , further comprising:
 an electrode pad of the red chip of the second pixel and an electrode pad of the red chip of the fourth pixel formed the upper surface of the package substrate,   wherein at least one of the bent structures electrically connected the electrode pad of the red chip of the second pixel, the electrode pad of the red chip of the fourth pixel, and the second red individual terminal.   
     
     
         17 . The LED package of  claim 15 , further comprising:
 an electrode pad of the green chip of the second pixel and an electrode pad of the green chip of the fourth pixel formed the upper surface of the package substrate,   wherein at least one of the bent structures electrically connected the electrode pad of the green chip of the second pixel, the electrode pad of the green chip of the fourth pixel, and the second green individual terminal.   
     
     
         18 . The LED package of  claim 15 , further comprising:
 an electrode pad of the blue chip of the second pixel and an electrode pad of the blue chip of the fourth pixel formed the upper surface of the package substrate,   wherein at least one of the bent structures electrically connected the electrode pad of the blue chip of the second pixel, the electrode pad of the blue chip of the fourth pixel, and the second blue individual terminal.   
     
     
         19 . The LED package of  claim 12 , wherein the first pixel located in a first row and a first column, the second pixel located in the first row and a second column, the third pixel located in a second row and the first column, and the fourth pixel located in the second row and the second column. 
     
     
         20 . The LED package of  claim 12 , wherein the vertical portion penetrating at least one of the unit substrate layers and the horizontal portion formed on at least one of the unit substrate layers.