Circuit board with a substrate made of silicon

Abstract

A circuit board with a substrate made of silicon includes a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and wherein the metal layer is formed with metal circuits by screen printing. Electronic elements are adhered on the metal layer to form as circuits with specific functions. Materials of the adhering layer contains Organic silicon polyester copolymer resin, Ethyl acetate and Organic silicon resin. Material of the metal layer is selected from copper, aluminum, sliver, and gold. A packaging silicon layer encapsulates the metal layer and the electronic elements for packaging. Material of the metal layer is selected from copper, aluminum, sliver, and gold.

What is claimed is: 
     
         1 . A circuit board with a substrate made of silicon comprising:
 a silicon substrate made of silicon;   an adhering layer which is a gluing layer and is adhered on the silicon substrate;   a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and   wherein the metal layer is formed with metal circuits by screen printing.   
     
     
         2 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein electronic elements are adhered on the metal layer to form as circuits with specific functions. 
     
     
         3 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein materials of the adhering layer contains Organic silicon polyester copolymer resin, Ethyl acetate and Organic silicon resin. 
     
     
         4 . The circuit board with a substrate made of silicon as claimed in  claim 2 , wherein material of the metal layer is selected from copper, aluminum, sliver, and gold. 
     
     
         5 . The circuit board with a substrate made of silicon as claimed in  claim 2 , wherein a packaging silicon layer encapsulates the metal layer and the electronic elements for packaging. 
     
     
         6 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein material of the metal layer is selected from copper, aluminum, sliver, and gold. 
     
     
         7 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein the circuit board is formed by spraying silicon material from a silicon material barrel into a space between two rollers; wherein the rollers will compress and roll the silicon material to be form as a silicon substrate with a predetermined width; by the two rollers and a transferring belt, guiding the silicon substrate to a gluing material coating unit, and then gluing material being coated on the silicon substrate so as to form a gluing layer; guiding the silicon substrate with the gluing layer to a first baking unit for baking the silicon substrate with the gluing layer; guiding the baked silicon substrate with the gluing layer to a screen printing plate adding unit so as to adhere a screen plate on the gluing layer to form with an integrated board; wherein the screen plate has hollowed areas for forming circuits in the succeeding process; transferring the integrated board to an ink unit to add metal ink on the hollowed areas of the screen plate; and then taking out the screen plate and left metal inks are formed as a metal layer which is a printed circuit; in that, the metal layer, the silicon substrate and the gluing layer are formed as a compound board; and guiding the compound board to a second baking unit for baking the compound board.