Circuit board with a substrate made of silicon

Abstract

A circuit board with a substrate made of silicon comprises a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and wherein the metal layer is etched to form with metal circuits. Furthermore, electronic elements are adhered on the metal layer to form as circuits with specific functions. A packaging silicon layer encapsulates the metal layer and the electronic elements for packaging. The circuit board is a flat plate board or a curled board.

What is claimed is: 
     
         1 . A circuit board with a substrate made of silicon comprising:
 a silicon substrate made of silicon;   an adhering layer which is a gluing layer and is adhered on the silicon substrate;   a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and   wherein the metal layer is etched to form with metal circuits.   
     
     
         2 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein electronic elements are adhered on the metal layer to form as circuits with specific functions. 
     
     
         3 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein materials of the adhering layer are selected from at least one of Organic silicon polyester copolymer resin, Ethyl acetate and Organic silicon resin. 
     
     
         4 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein material of the metal layer is selected from copper, aluminum, sliver, and gold. 
     
     
         5 . The circuit board with a substrate made of silicon as claimed in  claim 3 , wherein a packaging silicon layer encapsulates the metal layer and the electronic elements for packaging. 
     
     
         6 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein the circuit board is a flat plate board. 
     
     
         7 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein the circuit board is a curled board for easy storage or transferring easily; and if necessary, the curled circuit board is straightened for forming circuits or packaging. 
     
     
         8 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein the liquid for etching is alkaline or acidic. 
     
     
         9 . The circuit board with a substrate made of silicon as claimed in  claim 1 , wherein the liquid for etching is copper chloride.