Gas Enclosure Systems and Methods Utilizing Multi-Zone Circulation and Filtration

Abstract

The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices. Accordingly, various embodiments of a gas circulation and filtration system as disclosed herein can effectively remove both airborne particulate matter, as well as particulate matter generated proximal to a substrate during a printing process. As such, various embodiments of a gas circulation and filtration system in conjunction with various embodiments of a gas purification system of the present teachings can provide for a controlled manufacturing environment resulting in a high-yield of OLED various devices.

1 . (canceled) 
     
     
         2 . A method for processing a substrate, the method comprising:
 maintaining a controlled gas environment within a gas enclosure;   circulating gas within a tunnel structure positioned within the gas enclosure so as to provide a flow of gas across a substrate supported by a substrate support apparatus disposed within the tunnel structure; and   circulating gas within a bridge enclosure structure positioned within the gas enclosure, the bridge enclosure structure enclosing a printing system bridge; and   depositing ink onto a surface of the substrate from at least one printhead assembly mounted to the printing system bridge, the depositing occurring during circulating gas within the tunnel structure and the bridge enclosure structure.   
     
     
         3 . The method of  claim 2 , wherein circulating gas within the bridge enclosure structure comprises directing a portion of the gas from the tunnel structure to the bridge enclosure structure. 
     
     
         4 . The method of  claim 2 , further comprising circulating gas within a service bundle housing and past at least one of an optical, electrical, mechanical, and fluidic cable coupled to the at least one printhead assembly and routed through the service bundle housing. 
     
     
         5 . The method of  claim 2 , further comprising flowing a portion of the gas from the gas enclosure through a gas purification loop and back to the gas enclosure. 
     
     
         6 . The method of  claim 5 , wherein flowing the portion of the gas through the gas purification loop removes solvent from the portion of the gas. 
     
     
         7 . The method of  claim 2 , further comprising cooling the gas circulated through the bridge enclosure structure and/or through the tunnel structure. 
     
     
         8 . The method of  claim 2 , further comprising flowing a portion of the gas from the gas enclosure through a gas pressurization component and back to the gas enclosure to maintain a predetermined pressure within the gas enclosure. 
     
     
         9 . The method of  claim 2 , further comprising filtering particulate matter from gas circulated through the tunnel structure. 
     
     
         10 . The method of  claim 2 , further comprising filtering particulate matter from gas circulated through the bridge enclosure section. 
     
     
         11 . The method of  claim 2 , further comprising moving the printhead along the bridge while depositing ink on the surface of the substrate. 
     
     
         12 . The method of  claim 11 , further comprising moving the substrate in a direction perpendicular to a direction of movement of the printhead along the bridge while depositing ink on the surface of the substrate. 
     
     
         13 . The method of  claim 2 , further comprising moving the substrate while depositing ink on the surface of the substrate, wherein a direction of the flow of gas across the substrate is perpendicular to a direction of the moving of the substrate. 
     
     
         14 . The method of  claim 2 , further comprising supporting the substrate via floatation using a floatation table while depositing the ink. 
     
     
         15 . The method of  claim 2 , wherein depositing the ink comprises depositing an ink comprising an organic material used to form at least one layer of an organic light-emitting diode stack. 
     
     
         16 . The method of  claim 2 , wherein depositing the ink comprises depositing an ink comprising an organic material used to form an encapsulation layer of an organic light emitting diode display. 
     
     
         17 . The method of  claim 2 , wherein maintaining the controlled environment in the gas enclosure comprises maintaining a non-reactive gas environment in the gas enclosure. 
     
     
         18 . The method of  claim 17 , wherein the non-reactive gas environment is maintained using nitrogen gas. 
     
     
         19 . The method of  claim 2 , wherein maintaining the controlled environment in the gas enclosure comprises maintaining at least one of water vapor, solvent vapor, ozone, and oxygen below a specified limit. 
     
     
         20 . The method of  claim 2 , wherein the flow of gas across the substrate is substantially laminar. 
     
     
         21 . The method of  claim 2 , wherein maintaining the controlled environment in the gas enclosure comprises maintaining the environment to meet a particulate contamination specification. 
     
     
         22 . The method of  claim 21 , wherein the particulate contamination specification is an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 2 μm in size.