Methods and systems for geometric optimization of multilayer ceramic capacitors

Abstract

Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Conductive layer ends and dielectric layer edges of a multilayer ceramic capacitor may be modified to comprise a round shape, which may increase voltage limits by reducing electric field intensity that results from sharp corners. Further, the capacitor may comprise wave-like structures to increase surface area of a conductive layer and/or dielectric layer. The round shape of the conductive layer end may in-part reduce the need for a wide protective gap due to its dome-shape permitting the dielectric layer to be wider on top and bottom, and thinner at the center, e.g. concave, which provides strength support to the layers. The 3D Printing process permits the distance between the conductive layer end of the conductive layer to be much closer to the dielectric layer edge of the dielectric layer, such as below the standard 500 microns.

What is claimed is: 
     
         1 . A multilayer ceramic capacitor, comprising:
 a ceramic body;   one or more dielectric layers alternately stacked with two or more conductive layers,   wherein at least one conductive layer comprises a conductive layer end comprising at least one of a round shape, a bulbous shape, and a wavy shape;   a pair of external termination disposed at opposite end portions of the body, and   wherein the two or more conductive layers are alternately coupled to an external termination of the pair of external termination.   
     
     
         2 . The multilayer ceramic capacitor of  claim 1 , further comprising:
 wherein at least one dielectric layer comprises a dielectric layer edge encompassing the conductive layer end.   
     
     
         3 . The multilayer ceramic capacitor of  claim 2 , further comprising:
 where the dielectric layer edge comprises at least one of an inverse round shape, an inverse bulbous shape, and an inverse wavy shape.   
     
     
         4 . The multilayer ceramic capacity of  claim 1 , further comprising:
 wherein the bulbous shape of the conductive layer end comprises a smooth angle, and   wherein the smooth angle resembles the letter “S”.   
     
     
         5 . The multilayer ceramic capacitor of  claim 3 , further comprising:
 wherein the at least one inverse round shape and inverse bulbous shape comprises a wavy shape.   
     
     
         6 . The multilayer ceramic capacitor of  claim 3 , further comprising:
 wherein the inverse wavy shape comprises a secondary wavy shape.   
     
     
         7 . A multilayer ceramic capacitor, comprising:
 a ceramic body;   a conductive layer comprising at least one of a base metal and a noble metal;   a dielectric layer comprising barium titanate,   wherein one or more dielectric layers are alternately stacked with two or more conductive layers,   wherein at least one dielectric layer comprises a dielectric layer edge comprising a concave shape,   wherein the two or more conductive layers are alternately coupled to an external termination of the pair of external termination, and   wherein an electric field is generated between two juxtapose conductive layers when voltage is applied to the pair of external termination.   
     
     
         8 . The multilayer ceramic capacitor of  claim 7 , further comprising:
 wherein at least one conductive layer comprises a conductive layer end comprising a convex shape.   
     
     
         9 . The multilayer ceramic capacitor of claim  18 , further comprising:
 wherein the concave shape of the dielectric layer edge encompasses the convex shape of the conductive layer end.   
     
     
         10 . The multilayer ceramic capacitor of claim  18 , further comprising:
 wherein the convex shape of the conductive layer end permits the dielectric layer to comprise a greater width disposed at a top portion and at a bottom portion than at a center portion.   
     
     
         11 . The multilayer ceramic capacitor of claim  18 , further comprising:
 wherein a distance between the conductive layer end and the dielectric layer edge is less than 500 microns.   
     
     
         12 . The multilayer ceramic capacitor of claim  18 , further comprising:
 wherein a distance between the conductive layer end and the dielectric layer edge is greater than a thickness of the dielectric layer.   
     
     
         13 . A multilayer ceramic capacitor, comprising:
 a ceramic body;   one or more dielectric layers alternately stacked with two or more conductive layers,   wherein at least one conductive layer comprises a plane disposed in an xy-direction, a perimeter in a z-direction surrounding and in direct contact with the plane, and a corner.   
     
     
         14 . The multilayer ceramic capacitor of  claim 13 , further comprising:
 wherein the plane comprises a round shape.   
     
     
         15 . The multilayer ceramic capacitor of  claim 13  further comprising:
 wherein the perimeter comprises a round shape. 
 
     
     
         16 . The multilayer ceramic capacitor of  claim 13 , further comprising:
 wherein the corner comprises a round shape.   
     
     
         17 . The multilayer ceramic capacitor of  claim 13 , further comprising:
 wherein the plane, the perimeter, and the corner comprise a round shape.