Shielding Tape With Features For Mitigating Micro-Fractures And The Effects Thereof

Abstract

In an electronic cable, a shielding tape prevents and mitigates the creation and propagation of micro-fractures and the deleterious effects thereof. In some embodiments, the shielding tape has layers which are oriented in a non-zero transverse relation with respect to each other, or have been treated to have non-zero orientations. Other embodiments include micro-fracture propagation mitigation means, such as perforations, ridges, waffling, and dimpling. In some embodiments, the layers of the shielding tape are bonded to each other with an electrically-conductive elastomeric adhesive. In other embodiments, the shielding tape is wrapped around a cable's dielectric and form an overlap gap, which is filled by an electrically-conductive elastomeric adhesive.

The invention claimed is: 
     
         1 . Shielding tape in an electronic cable, the shielding tape comprising:
 a metallic layer; and   micro-fracture propagation mitigation means formed in the metallic layer.   
     
     
         2 . The shielding tape of  claim 1 , wherein the micro-fracture propagation mitigations means includes perforations formed through the metallic layer. 
     
     
         3 . The shielding tape of  claim 2 , wherein the perforations have a major dimension smaller than approximately 12 millimeters. 
     
     
         4 . The shielding tape of  claim 3 , wherein the major dimension is smaller than approximately 3 millimeters. 
     
     
         5 . The shielding tape of  claim 2 , wherein the perforations are spaced apart in an array across the metallic layer. 
     
     
         6 . The shielding tape of  claim 5 , wherein the perforations have a major dimension smaller than approximately 12 millimeters and are spaced apart from each other in the array by at least the major dimension. 
     
     
         7 . The shielding tape of  claim 6 , wherein the major dimension is smaller than approximately 3 millimeters. 
     
     
         8 . The shielding tape of  claim 1 , wherein the micro-fracture propagation mitigations means includes ridges formed in the metallic layer. 
     
     
         9 . The shielding tape of  claim 8 , wherein:
 each ridge in the metallic layer comprises a first wall and a second wall arranged obliquely with respect to the first wall; and   the first and second walls each project into and out of a plane along which the metallic layer extends.   
     
     
         10 . The shielding tape of  claim 1 , wherein the micro-fracture propagation mitigations means includes waffling formed in the metallic layer. 
     
     
         11 . The shielding tape of  claim 10 , wherein the waffling is formed by intersecting ridges on the metallic layer spaced apart by depressions between the ridges. 
     
     
         12 . The shielding tape of  claim 1 , wherein the micro-fracture propagation mitigations means includes dimpling formed in the metallic layer. 
     
     
         13 . The shielding tape of  claim 12 , wherein the dimpling is formed by semi-spherical concave depressions into the layer. 
     
     
         14 . The shielding tape of  claim 13 , wherein the concave depressions are spaced apart in an array across the metallic layer. 
     
     
         15 . The shielding tape of  claim 14 , wherein the concave depressions each have a major dimension, and the concave depressions are spaced apart from each other in the array by at least the major dimension. 
     
     
         16 . Shielding tape in an electronic cable, the shielding tape comprising:
 a first metallic layer having a first orientation along which micro-fractures are predisposed to form;   a second metallic layer having a second orientation along which micro-fractures are predisposed to form; and   the first and second orientations have a non-zero transverse relation with respect to each other.   
     
     
         17 . The shielding tape of  claim 16 , wherein the first and second orientations in the first and second metallic layers are formed by burnishing the first and second metallic layers. 
     
     
         18 . The shielding tape of  claim 16 , wherein the first metallic layer is arranged with a non-zero transverse orientation with respect to the second metallic layer. 
     
     
         19 . Shielding tape in an electronic cable, the shielding tape comprising:
 a first layer;   a second layer;   an adhesive disposed between the first and second layers; and   metallic solids dispersed throughout the adhesive, defining the adhesive with electrically conductive material characteristics.   
     
     
         20 . The shielding tape of  claim 19 , wherein the adhesive is an elastomeric adhesive. 
     
     
         21 . An electronic cable comprising:
 a conductor;   an insulator surrounding the conductor;   shielding tape wrapped around the insulator, the shielding tape having overlapping edges forming an overlap gap therebetween;   an adhesive disposed in the overlap gap; and   metallic solids dispersed throughout the adhesive, defining the adhesive with electrically conductive material characteristics.   
     
     
         22 . The cable of  claim 21 , wherein the adhesive is an elastomeric adhesive.