Resin compositions

Abstract

The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

1 . A resin having a structure defined by Formula (VI): 
       
         
           
           
               
               
           
         
         wherein 
         X is cyclopentadiene; 
         B is H; 
         (Z) n  is a bond; 
         m is an integer ranging from 1 to 5; 
         and A has the structure defined by Formula (IIC): 
       
       
         
           
           
               
               
           
         
         wherein R a  and R b  are independently selected from H, F, a C 1  to C 10  linear or cyclic, branched or straight chain aliphatic group; T is —CH 2 —, -phenyl, or —CH 2 — phenyl; Y is H, —CH 3 , —CH═CH 2 , —CH═CH—CH 3 , or alkyne; t is 0 or an integer ranging from 1 to 20; u is 0 or 1; z is an integer ranging from 1 to 5. 
       
     
     
         2 . The resin of  claim 1 , wherein t is 1; and R a  and R b  are each H. 
     
     
         3 . The resin of  claim 2 , wherein Y is —CH═CH 2 . 
     
     
         4 . The resin of  claim 1 , wherein m is 2, and a first A group comprises a vinyl benzyl moiety; and wherein a second A group is —CH 2 —CH═CH 2 . 
     
     
         5 . The resin of  claim 1 , wherein the resin has the structure 
       
         
           
           
               
               
           
         
       
     
     
         6 . The resin of  claim 1 , wherein the resin has the structure 
       
         
           
           
               
               
           
         
       
     
     
         7 . The resin of  claim 1 , wherein the resin comprises at least one A moiety terminating in one of a —CH═CH 2  group, a —CH═CH—CH 3  group, or an alkyne group. 
     
     
         8 . A polymer or copolymer derived from the resin of  claim 1 . 
     
     
         9 . The polymer or copolymer of  claim 8 , wherein the polymer or copolymer has a room temperature viscosity of 100 to 1,000,000 mPa*s. 
     
     
         10 . The polymer or copolymer of  claim 8 , wherein the polymer or copolymer comprises a glassy material which can be ground into a fine powder. 
     
     
         11 . The polymer or copolymer of  claim 8 , wherein the polymer or copolymer is soluble in an organic solvent selected from the group consist of MEK, Xylenes, NMP, DMF, DCM, Acetonitrile, Acetone, DMSO, THF. 
     
     
         12 . The polymer or copolymer of  claim 8 , wherein the polymer or copolymer comprises a molecular weight ranging from between about 200 to about 1,000,000 Da. 
     
     
         13 . The polymer or copolymer of  claim 8 , further comprising an additive selected from the group consisting of adhesion agents, peroxides, crosslinking agents, antioxidants, flame retardants, diluents and fillers. 
     
     
         14 . The polymer or copolymer of  claim 8 , wherein the polymer or copolymer has a Dk value ranging from about 1.5 to about 3. 
     
     
         15 . The polymer or copolymer of  claim 8 , wherein the polymer or copolymer polymer has a Df value ranging from about 0.0001 to 0.004. 
     
     
         16 . A polymer or copolymer comprising (i) a resin of  claim 1 ; and (ii) a second component selected from the group consisting of polyethylenes, polypropylenes, polybutylenes, low vinyl polybutadienes (predominantly 1,3 addition), high vinyl polybutadienes (significant 1,2 addition), polystyrenes, butadiene-styrene copolymers, SMA polymers, ABS polymers, polydicyclopentadienes, epoxies, polyurethanes, cyanate esters, poly(phenylene oxide), EPDM polymers, cyclic olefin copolymers (COC), polyimides, bismaleimides, phosphazenes, olefin-modified phosphazenes, acrylates, vinyl esters, polylactones, polycarbonates, polysulfones, polythioethers, polyetheretherketones (PEEK), polydimethylsiloxanes (PDMS), polyethylene terephthalates (PET), and polybutylene terephthalates (PBT), styrene, divinylbenzene, 1,2-bis(vinylphenyl)ethane, vinylbenzyl ether compounds, vinyl ether compounds, allyl ether compounds, vinylphenyl monomers, vinyl monomers, and allyl monomers. 
     
     
         17 . A copolymer derived from a polymerization of the resin of  claim 1 , and a comonomer, wherein the comonomer is selected from the group consisting of styrene, divinyl benzene, vinyl toluene, methyl styrene, tert-butyl styrene, alpha-methyl styrene, alpha-methyl styrene dimer, vinyl cyclohexene, ethylidene norbornene, vinyl norbornene, alpha-pinene, beta-pinene, limonene, other terpenes, polybutadienes, modified polybutadienes, polystyrenes (homopolymer and block-copolymers), modified polystyrenes, polyterpenes, other vinyl-reactive monomers, and reactive dimers/oligomers/polymers/co-polymers thereof. 
     
     
         18 . A composition comprising a first resin of  claim 1  and a second resin of  claim 1 , wherein the first and second resins are different. 
     
     
         19 . A flexible printed circuit board comprising a material derived from the resin of  claim 1 . 
     
     
         20 . A radome or satellite structure comprising a material derived from the resin of  claim 1 . 
     
     
         21 . A resin of  claim 8  for use in any one of: (i) a Copper clad laminate (CCL), (ii) a HDI substrate, (iii) an IC substrate in printed circuit boards at high temperature and low Df applications; (iv) a molding compound in power device application; and (v) RF heating in oil and gas applications.