Resin composition for resin molding, and resin molding
Abstract
A resin molding including a polyolefin, a polyamide in a content of 1 part by mass to 50 parts by mass per 100 parts of the polyolefin, carbon fibers in a content of 1 part by mass to 50 parts by mass per 100 parts by mass of the polyolefin, organic fibers in a content of 1 part by mass to 20 parts by mass per 100 parts by mass of the polyolefin, and a carboxylic anhydride-modified polyolefin as a compatibilizer in a content of 1 part by mass to 10 parts by mass per 100 parts by mass of the polyolefin, where a proportion of a carbon fiber and an organic fiber each having a fiber length in a range of 1 mm to 20 mm to all the carbon fibers and the organic fibers is 1% to 20% by number.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A resin molding comprising:
a polyolefin; a polyamide in a content of 1 part by mass to 50 parts by mass per 100 parts of the polyolefin; carbon fibers in a content of 1 part by mass to 50 parts by mass per 100 parts by mass of the polyolefin; organic fibers in a content of 1 part by mass to 20 parts by mass per 100 parts by mass of the polyolefin, the organic fibers having an average fiber length of 1 mm to 20 mm; and a carboxylic anhydride-modified polyolefin as a compatibilizer in a content of 1 part by mass to 10 parts by mass per 100 parts by mass of the polyolefin, wherein a proportion of a carbon fiber and an organic fiber each having a fiber length in a range of 1 mm to 20 mm to all the carbon fibers and the organic fibers is 1% to 20% by number.
2 . The resin molding according to claim 1 , wherein the polyolefin is at least one selected from the group consisting of polypropylene, polyethylene, and ethylene-vinyl acetate copolymer.
3 . The resin molding according to claim 1 , wherein the compatibilizer is at least one modified polyolefin selected from the group consisting of a modified polypropylene, a modified polyethylene, and a modified ethylene-vinyl acetate copolymer, and the modified polyolefin has a modified moiety containing a carboxylic anhydride residue.
4 . The resin molding according to claim 3 , wherein the carboxylic anhydride residue is a maleic anhydride residue.
5 . The resin molding according to claim 1 , wherein the organic fibers have a melting point higher than a melting point of polyolefin, a softening point higher than the melting point of polyolefin, or a thermal decomposition temperature higher than the melting point of polyolefin.
6 . The resin molding according to claim 5 , wherein the organic fibers are at least one of aramid fibers and vinylon fibers.
7 . The resin molding according to claim 1 , wherein part of the polyamide forms a covering layer around the periphery of each of the carbon fibers.
8 . The resin molding according to claim 7 , wherein the compatibilizer forms an intervening layer between the covering layer and the polyolefin.
9 . The resin molding according to claim 1 , which is a non-crosslinked resin molding.
10 . The resin moldings according to claim 1 , the content of the polyamide is from 11.8 parts by mass to 50 parts by mass, and the content of the compatibilizer is from 3.9 parts by mass to 10 parts by mass.Join the waitlist — get patent alerts
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