Die and device for positioning a joining element or for clinch joining

Abstract

A die for a device for joining is proposed, wherein at least one monitoring element for monitoring the functionality of the die is attached to the die, wherein the monitoring element comprises a strain gauge, wherein the monitoring element comprises exactly two sensors, wherein the spring means have a cross spring with multiple elastically movable spring arms, wherein one die portion is assigned to one spring arm, and wherein the spring arms are connected at one point, wherein the die has four movable die portions which are elastically movable in each case by means of one spring arm of the spring means.

1 . A die for a device for joining, wherein at least one monitoring element for monitoring the functionality of the die is attached to the die, wherein the monitoring element comprises a strain gauge, wherein the spring means have a cross spring with multiple elastically movable spring arms, wherein one die portion is assigned to one spring arm, and wherein the spring arms are connected at one point, wherein the die has four movable die portions which are elastically movable in each case by means of one spring arm of the spring means. 
     
     
         2 . The die as claimed in  claim 1 , wherein at least one monitoring element for monitoring the joining process that it is intended to be able to carry out by means of the die is attached to the die. 
     
     
         3 . The die as claimed in  claim 1 , wherein the monitoring element is coupled to a die portion of the die which, during the joining, is subjected to a movement caused by the joining process, wherein the monitoring element monitors the movement of the movable die portion. 
     
     
         4 . The die as claimed in  claim 1 , wherein the monitoring element is coupled to a die portion of the die which is provided movably on the die. 
     
     
         5 . The die as claimed in  claim 1 , wherein the monitoring element is coupled to a secondary structure, wherein the secondary structure interacts with a die portion of the die which is provided movably on the die. 
     
     
         6 . The die as claimed in  claim 1 , wherein the monitoring element comprises a sensor arrangement. 
     
     
         7 . The die as claimed in  claim 1 , wherein the monitoring element comprises a sensor such as a strain gauge which serves for continuously providing measurement signals for the monitoring of the functionality of the die and/or of the joining process that can be carried out by means of the die. 
     
     
         8 . The die as claimed in  claim 1 , wherein the monitoring element is configured to, in the event of the die portion that is coupled to the monitoring element being subjected to a load that lies outside a normal load state, provide an associated measurement signal. 
     
     
         9 . The die as claimed in  claim 1 , wherein the monitoring element is designed to provide a measurement signal to a superordinate unit. 
     
     
         10 . The die as claimed in  claim 1 , wherein the monitoring element comprises multiple sensors. 
     
     
         11 . The die as claimed in  claim 1 , wherein the monitoring element comprises exactly two sensors. 
     
     
         12 . The die as claimed in  claim 1 , wherein the monitoring element comprises exactly three or exactly four sensors. 
     
     
         13 . The die as claimed in  claim 1 , further comprises a movable die portion which interacts with spring means for a resettable movement. 
     
     
         14 . The die as claimed in  claim 1 , further comprises spring means with an elastically flexible spring arm. 
     
     
         15 . A device for placing a joining element on a workpiece or for clinch joining of the workpiece, comprising a punch unit and an oppositely situated die unit, between which the workpiece that can be worked by means of the device can be clamped, wherein the die unit comprises a die as claimed in  claim 1 . 
     
     
         16 . A die for a device for joining wherein at least one monitoring element for monitoring the joining process that it is intended to be able to carry out by means of the die is attached to the die. 
     
     
         17 . A device for placing a joining element on a workpiece or for clinch joining of the workpiece, comprising a punch unit and an oppositely situated die unit, between which the workpiece that can be worked by means of the device can be clamped, wherein the die unit comprises a die as claimed in  claim 16 .