US2019287730A1PendingUtilityA1

Method to Reduce Anode Lead Wire Embrittlement in Capacitors

53
Assignee: KEMET ELECTRONICS CORPPriority: Mar 15, 2018Filed: Mar 15, 2018Published: Sep 19, 2019
Est. expiryMar 15, 2038(~11.7 yrs left)· nominal 20-yr term from priority
H01G 9/052H01G 9/0036H01G 9/15H01G 2009/05H01G 9/0032H01G 9/012H01G 9/032H01G 9/07H01G 9/048H01G 9/042
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Claims

Abstract

An improved capacitor, and method of manufacturing the improved capacitor, is provided. The method includes deoxygenating and leaching the anode wire to produce a capacitor comprising an anode having a surface area of at least 4.0 m2/g or a charge density of at least 200,000 CV/g with the anode wire having an equivalent diameter of less than 0.30 mm extending from said anode. A dielectric is on the anode and a cathode is on the dielectric.

Claims

exact text as granted — not AI-modified
1 . A capacitor comprising:
 an anode having a surface area of at least 4.0 m 2 /g or a charge density of at least 200,000 CV/g;   an anode wire having an equivalent diameter of less than 0.30 mm extending from said anode;   a dielectric on said anode; and   a cathode on said dielectric.   
     
     
         2 . The capacitor of  claim 1  wherein said anode has a surface area of at least 5.0 m 2 /g. 
     
     
         3 . The capacitor of  claim 1  wherein said anode has a charge density of at least 250,000 CV/g. 
     
     
         4 . The capacitor of  claim 1  wherein said anode has a surface area of at least 6.0 m 2 /g. 
     
     
         5 . The capacitor of  claim 1  wherein said anode wire has a microhardness of at least 120 kgf/mm 2 . 
     
     
         6 . The capacitor of  claim 5  wherein said anode wire has a microhardness of at least 200 kgf/mm 2 . 
     
     
         7 . The capacitor of  claim 6  wherein said anode wire is ductile. 
     
     
         8 . The capacitor of  claim 1  wherein said anode has a charge density of at least 300,000 CV/g. 
     
     
         9 . The capacitor of  claim 1  wherein said anode wire comprises tantalum. 
     
     
         10 . The capacitor of  claim 9  wherein said anode wire further comprises a dopant. 
     
     
         11 . The capacitor of  claim 10  wherein said dopant is selected from the group consisting of yttrium, silicon, cerium, carbon, germanium, palladium, platinum, rhenium, molybdenum, lanthanum, neodymium and thallium. 
     
     
         12 . The capacitor of  claim 1  wherein said anode wire has an equivalent cross-sectional of no more than 0.30 mm. 
     
     
         13 . The capacitor of  claim 12  wherein said anode wire has an equivalent cross-sectional of no more than 0.20 mm. 
     
     
         14 . The capacitor of  claim 13  wherein said anode wire has an equivalent cross-sectional of no more than 0.10 mm. 
     
     
         15 . The capacitor of  claim 1  wherein said anode comprises a valve metal. 
     
     
         16 . The capacitor of  claim 15  wherein said valve metal is selected from the group consisting of niobium and tantalum. 
     
     
         17 . The capacitor of  claim 16  wherein said valve metal is tantalum. 
     
     
         18 . The capacitor of  claim 1  wherein said cathode comprises a material selected from manganese dioxide and a conductive polymer. 
     
     
         19 . The capacitor of  claim 18  wherein said conductive polymer is a thiophene. 
     
     
         20 . The capacitor of  claim 19  wherein said thiophene comprises polyethylenedioxythiophene. 
     
     
         21 . The capacitor of  claim 1  further comprising a transition layer on said cathode. 
     
     
         22 . The capacitor of  claim 1  further comprising a cathode external termination in electrical contact with said cathode and an anode external termination in electrical contact with said anode. 
     
     
         23 . The capacitor of  claim 1  further comprising an encapsulant over at least a portion of said capacitor. 
     
     
         24 . A method for forming a capacitor comprising:
 deoxygenating an anode wire to form a deoxygenated anode wire;   leaching said deoxygenated anode wire to form a deoxygenated and leached anode wire;   inserting said deoxygenated and leached anode wire into a valve metal powder;   pressing said valve metal powder into a monolith with said deoxygenated and leached anode wire embedded therein;   sintering said monolith to form an anode with said deoxygenated and leached anode wire extending from said anode;   forming a dielectric on said anode; and   forming a cathode on said dielectric.   
     
     
         25 . The method for forming a capacitor of  claim 24  wherein said deoxygenated and leached anode wire comprises tantalum. 
     
     
         26 . The method for forming a capacitor of  claim 25  wherein said deoxygenated and leached anode wire further comprises a dopant. 
     
     
         27 . The method for forming a capacitor of  claim 26  wherein said dopant is selected from the group consisting of yttrium, silicon, cerium, carbon, germanium, palladium, platinum, rhenium, molybdenum, lanthanum, neodymium and thallium. 
     
     
         28 . The method for forming a capacitor of  claim 24  wherein said anode wire has an equivalent diameter of no more than 0.30 mm. 
     
     
         29 . The method for forming a capacitor of  claim 28  wherein said anode wire has an equivalent diameter of no more than 0.20 mm. 
     
     
         30 . The method for forming a capacitor of  claim 29  wherein said anode wire has an equivalent diameter of no more than 0.10 mm. 
     
     
         31 . The method for forming a capacitor of  claim 24  wherein said anode comprises a valve metal. 
     
     
         32 . The method for forming a capacitor of  claim 31  wherein said valve metal is selected from the group consisting of niobium and tantalum. 
     
     
         33 . The method for forming a capacitor of  claim 32  wherein said valve metal is tantalum. 
     
     
         34 . The method for forming a capacitor of  claim 24  wherein said cathode comprises a material selected from manganese dioxide and a conductive polymer. 
     
     
         35 . The method for forming a capacitor of  claim 34  wherein said conductive polymer is a thiophene. 
     
     
         36 . The method for forming a capacitor of  claim 35  wherein said thiophene comprises polyethylenedioxythiophene. 
     
     
         37 . The method for forming a capacitor of  claim 24  further comprising passivating said anode after said sintering and prior to said forming of said dielectric. 
     
     
         38 . The method for forming a capacitor of  claim 37  wherein said passivating comprises introducing said anode to a first aliquot of oxygen comprising less than a stoichiometric amount of oxygen necessary to form a native dielectric. 
     
     
         39 . The method for forming a capacitor of  claim 38  wherein said passivating further comprises introducing said anode to a second aliquot of said oxygen. 
     
     
         40 . The method for forming a capacitor of  claim 37  wherein said passivating is at a temperature of no more than 60° C. 
     
     
         41 . The method for forming a capacitor of  claim 40  wherein said passivating is at a temperature of no more than 50° C. 
     
     
         42 . The method for forming a capacitor of  claim 24  further comprising leaching of said anode after said sintering and prior to said forming of said dielectric. 
     
     
         43 . The method for forming a capacitor of  claim 24  wherein said sintering is at a temperature of at least 1,100° C. to no more than 1,800° C. 
     
     
         44 . The method for forming a capacitor of  claim 24  wherein said valve metal powder has a surface area of at least 4.0 m 2 /g. 
     
     
         45 . The method for forming a capacitor of  claim 44  wherein said valve metal powder has a surface area of at least 200,000 m 2 /g. 
     
     
         46 . The method for forming a capacitor of  claim 24  wherein said valve metal powder has a charge density of at least 250,000 CV/g. 
     
     
         47 . The method for forming a capacitor of  claim 46  wherein said valve metal powder has a charge density of at least 300,000 CV/g. 
     
     
         48 . The method for forming a capacitor of  claim 24  wherein said deoxygenating of said anode wire comprises heating said anode wire in the presence of a reducing agent having a higher affinity for oxygen than said anode wire. 
     
     
         49 . The method for forming a capacitor of  claim 48  wherein said reducing agent is selected from the group consisting of alkali metals, alkaline earth metals and aluminum. 
     
     
         50 . The method for forming a capacitor of  claim 49  wherein said reducing agent magnesium. 
     
     
         51 . The method for forming a capacitor of  claim 24  wherein said leaching comprises treating said deoxygenated anode wire with an aqueous solution comprising at least one of hydrogen peroxide or an acid. 
     
     
         52 . The method for forming a capacitor of  claim 24  further comprising forming a transition layer on said cathode. 
     
     
         53 . The method for forming a capacitor of  claim 24  further comprising attaching cathode external termination to said cathode in in electrical contact with said cathode and attaching an anode external termination to said cathode in electrical contact with said anode. 
     
     
         54 . The method for forming a capacitor of  claim 24  further comprising encapsulating at least a portion of said capacitor.

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