Apparatus and method for transportation of a deposition source

Abstract

An apparatus for contactless transportation of a deposition source is provided. The apparatus includes a deposition source assembly. The deposition source assembly includes the deposition source. The deposition source assembly includes a first active magnetic unit. The apparatus includes a guiding structure extending in a source transportation direction. The deposition source assembly is movable along the guiding structure. The first active magnetic unit and the guiding structure are configured for providing a first magnetic levitation force for levitating the deposition source assembly.

1 . An apparatus for contactless transportation of a deposition source, comprising:
 a deposition source assembly, comprising:
 the deposition source; and 
 a first active magnetic unit; and 
   a guiding structure with magnetic properties extending in a source transportation direction, wherein the deposition source assembly is movable along the guiding structure, wherein the first active magnetic unit and the guiding structure are configured for providing a first magnetic levitation force (FI) for levitating the deposition source assembly, wherein the apparatus further comprise a controller configured for controlling the first active magnetic unit to align the deposition source in a vertical direction (Y).   
     
     
         2 . (canceled) 
     
     
         3 . The apparatus according to  claim 1 , wherein the deposition source is an evaporation source or a sputter source. 
     
     
         4 . The apparatus according to  claim 1 , wherein the first active magnetic unit is an element selected from the group consisting of: an electromagnetic device; a solenoid; a coil; a superconducting magnet; and any combination thereof. 
     
     
         5 . The apparatus according to  claim 1 , wherein the guiding structure is made of magnetic material. 
     
     
         6 . The apparatus according to  claim 1 , further comprising a magnetic drive system configured for contactless transportation of the deposition source assembly in the source transportation direction along the guiding structure. 
     
     
         7 . An apparatus for contactless levitation of a deposition source, comprising:
 a deposition source assembly having a first rotation axis, wherein the deposition source assembly comprises:
 a deposition source; 
 a first active magnetic unit arranged at a first side of the deposition source assembly; and 
 a second active magnetic unit arranged at a second side of the deposition source assembly; 
   a guiding structure including a passive magnetic unit; and   a controller configured for controlling the first active magnetic unit and the second active magnetic unit, wherein the first active magnetic unit and the second active magnetic unit are configured for magnetically levitating the deposition source assembly and for rotating the deposition source around the first rotation axis for alignment of the deposition source.   
     
     
         8 . The apparatus according to  claim 7 , wherein the deposition source assembly further comprises a third active magnetic unit and a fourth active magnetic unit configured for magnetically levitating the deposition source assembly, wherein:
 the third active magnetic unit is arranged at the first side of the deposition source assembly;   the fourth active magnetic unit is arranged at the second side of the deposition source assembly; and   the first active magnetic unit, the second active magnetic unit, the third active magnetic unit and the fourth active magnetic unit are configured for rotating the deposition source assembly around the first rotation axis and around a second rotation axis of the deposition source assembly for alignment of the deposition source.   
     
     
         9 . The apparatus according to  claim 8 , wherein the first rotation axis is parallel to a substrate receiving area of the apparatus and the second rotation axis is perpendicular to the substrate receiving area. 
     
     
         10 . The apparatus according to  claim 1 , wherein the apparatus further comprises:
 a first passive magnetic unit configured for providing a first transversal force (TI);   a further active magnetic unit configured for providing a first opposing transversal force ( 01 ), wherein the first opposing transversal force is an adjustable force counteracting the first transversal force; and   a controller configured for controlling the further active magnet unit to provide for a transversal alignment of the deposition source.   
     
     
         11 . A method for contactlessly aligning a deposition source, comprising:
 generating an adjustable magnetic field with an active magnetic unit to levitate the deposition source; and   controlling the adjustable magnetic field with a controller to align the deposition source.   
     
     
         12 . A method for contactlessly aligning a deposition source, comprising:
 providing a first magnetic levitation force (FI) with a first active magnetic unit and a second magnetic levitation force (F 2 ) with a second active magnetic unit to levitate the deposition source, wherein the first magnetic levitation force is spaced from the second magnetic levitation force; and   controlling at least one of the first magnetic levitation force and the second magnetic levitation force with a controller to align the deposition source.   
     
     
         13 . The method according to  claim 12 , further comprising:
 providing a third magnetic levitation force and a fourth magnetic levitation force to levitate the deposition source, wherein the third magnetic levitation force is spaced from the fourth magnetic levitation force, wherein the first magnetic levitation force, the second magnetic levitation force, the third magnetic levitation force and the fourth magnetic levitation force are configured to rotate the deposition source with respect to a first rotation axis and with respect to a second rotation axis; and   controlling at least one of the first magnetic levitation force, the second magnetic levitation force, the third magnetic levitation force and the fourth magnetic levitation force to align the deposition source.   
     
     
         14 . The method according to  claim 11 , further comprising:
 providing a first transversal force (TI) acting on the deposition source, wherein the first transversal force is provided using a first passive magnetic unit;   providing a first opposing transversal force ( 01 ) acting on the deposition source, wherein the first opposing transversal force is an adjustable magnetic force counteracting the first transversal force; and   controlling the first opposing transversal force to provide for a transversal alignment of the deposition source.   
     
     
         15 . The method according to  claim 11 , wherein the aligning of the deposition source is performed when the deposition source is in a first position, the method further comprising:
 transporting the deposition source from the first position to a second position; and contactlessly aligning the deposition source when the deposition source is in the second position.   
     
     
         16 . The method according to  claim 11 , wherein the aligning of the deposition source is performed relative to a first substrate while the deposition source moves past a first substrate. 
     
     
         17 . The apparatus according to  claim 1 , wherein the guiding structure is made of ferromagnetic material. 
     
     
         18 . The apparatus according to  claim 6 , wherein the magnetic drive system comprises a passive magnetic unit at the guiding structure and an active magnetic unit in or at the deposition source assembly. 
     
     
         19 . The apparatus according to  claim 18 , wherein the controller is connected to the drive system to control the speed of the deposition source assembly. 
     
     
         20 . The apparatus according to  claim 18 , wherein the passive magnetic unit comprises a plurality of permanent magnets with varying pole orientation. 
     
     
         21 . The method according to  claim 11 , wherein the aligning of the deposition source is performed relative to a first substrate while the deposition sources moves past a first substrate in a first position and relative to a second substrate while the deposition sources moves past a second substrate in a second position different from the first position.