Top mount cooling system and method for use thereof

Abstract

An embodiment provides a modular cooling device that is attachable to an enclosure such as a food or beverage cooler or refrigerator. In an embodiment, the modular cooling device includes various modules and is easy to assemble and disassemble. If one of the modules is damaged, it only requires the damaged module to be disassembled for repair or replacement, and the cooling function is restored, which solves inconvenient problems of conventional integrated refrigerators and like systems in terms of assembly, maintenance and repair. Other embodiments are described and claimed.

What is claimed is: 
     
         1 . A cooling device, comprising:
 a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of a top of an enclosure when mounted to the top of the enclosure by covering an opening defined within the top of the enclosure;   the bottom surface including an enclosure air intake and an enclosure air return;   an upper part including one or more ambient-side modules; and   a shell that covers the lower part and separates the lower part from the upper part;   the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure; and   the cooling device comprising an interface configured to reversibly attach to the top of the enclosure.   
     
     
         2 . The cooling device of  claim 1 , wherein:
 the one or more ambient-side modules include a compressor module in fluid communication with the condenser module; and   the one or more enclosure side modules include: coils in fluid communication with the compressor module; and one or more fans that promote air intake from the enclosure into the lower part and return of cooled air to the enclosure from the lower part.   
     
     
         3 . The cooling device of  claim 2 , wherein the compressor module is disposed at a first lateral side of the cooling device and the condenser module is disposed at a second lateral side of the cooling device. 
     
     
         4 . The cooling device of  claim 1 , wherein the one or more ambient-side modules include a control module comprising instructions that control the operation of the cooling device based on temperature within the enclosure. 
     
     
         5 . The cooling device of  claim 4 , wherein the control module is disposed proximate to the condenser module. 
     
     
         6 . The cooling device of  claim 1 , wherein the shell comprises an evaporator shell cover including insulating material. 
     
     
         7 . The cooling device of  claim 1 , wherein the shell comprises an evaporator shell side part that extends around the side surfaces of the lower part of the cooling device. 
     
     
         8 . The cooling device of  claim 1 , wherein the one or more ambient-side modules of the upper part are reversibly connected to the lower part. 
     
     
         9 . The cooling device of  claim 1 , wherein the upper part is reversibly connected to the lower part. 
     
     
         10 . The cooling device of  claim 1 , wherein the lower part is about 13 inches in length and width. 
     
     
         11 . The cooling device of  claim 1 , wherein the cooling device is about 14.5 inches in height. 
     
     
         12 . A kit, comprising:
 an attachment mechanism for securing a cooling device to a top of an enclosure that defines an opening for mounting the cooling device thereon; and   a cooling device, comprising:
 a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of the top of the enclosure when mounted to the top of the enclosure by covering the opening defined within the top of the enclosure; 
 the bottom surface including an enclosure air intake and an enclosure air return; 
 an upper part including one or more ambient-side modules; and 
 a shell that covers the lower part and separates the lower part from the upper part; 
   the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure.   
     
     
         13 . The kit of  claim 12 , wherein:
 the one or more ambient-side modules include a compressor module in fluid communication with the condenser module; and   the one or more enclosure side modules include: coils in fluid communication with the compressor module; and one or more fans that promote air intake from the enclosure into the lower part and return of cooled air to the enclosure from the lower part.   
     
     
         14 . A system, comprising:
 an enclosure; and   a cooling device, comprising:
 a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of a top of the enclosure when mounted to the top of the enclosure by covering an opening defined within the top of the enclosure; 
 the bottom surface including an enclosure air intake and an enclosure air return; 
 an upper part including one or more ambient-side modules; and 
 a shell that covers the lower part and separates the lower part from the upper part; 
   the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure; and   the cooling device comprising an interface configured to reversibly attach to the top of the enclosure.   
     
     
         15 . The system of  claim 14 , wherein:
 the one or more ambient-side modules include a compressor module in fluid communication with the condenser module; and   the one or more enclosure side modules include: coils in fluid communication with the compressor module; and one or more fans that promote air intake from the enclosure into the lower part and return of cooled air to the enclosure from the lower part.   
     
     
         16 . The system of  claim 14 , wherein the enclosure is a vending machine. 
     
     
         17 . The system of  claim 14 , wherein the lower part is about 13 inches in length and width. 
     
     
         18 . The system of  claim 14 , wherein the cooling device is about 14.5 inches in height. 
     
     
         19 . The system of  claim 14 , wherein the enclosure and the interface of the cooling device include fixing holes corresponding to each other. 
     
     
         20 . The system of  claim 19 , wherein the enclosure and the cooling device are connected to each other by a fastener and the fixing holes to achieve a detachable connection.