Heated build platform and system for three dimensional printing methods

Abstract

An apparatus performing as a base for printing 3D objects using high temperature thermoplastics employing additive manufacturing methods is provided. The apparatus comprises a heated build platform, a thin removable plate secured on top of the build platform, a high temperature polymer coating applied over the removable plate, and surface treatment of high temperature polymer coating to maintain adhesion between 3D object and printing surface. Also, the removable plate has low coefficient of thermal expansion compared to build platform below it, for avoiding bowing of the plate as it is heated due to heated build platform, hence providing flat printing surface. The thin removable plate allows 3D objects to pop off the plate upon cooling, without damaging the polymer coating, the plate, or the object. It also allows for continuous operation of printing, while the plate is released for cooling, a new plate is installed for printing.

1 - 19 . (canceled) 
     
     
         20 . A method for printing a three-dimensional (3D) object comprising:
 (a) providing an apparatus comprising:
 (i) a thermally conductive plate; and 
 (ii) a polymer coating coupled to a surface of said thermally conductive plate, wherein said polymer coating is not a polyimide tape; and 
   (b) printing said 3D object adjacent to said thermally conductive plate while controlling a temperature of said thermally conductive plate, wherein said polymer coating facilitates adhesion of said 3D object to said thermally conductive plate during printing; and   (c) removing said 3D object from said thermally conductive plate without damaging said polymer coating.   
     
     
         21 . A method of  claim 20 , wherein said 3D object is printed using fused filament fabrication. 
     
     
         22 . A method of  claim 20 , wherein (b) comprises heating said thermally conductive plate during printing. 
     
     
         23 . A method of  claim 22 , wherein said thermally conductive plate is heated at a temperature such that a first layer of said 3D object adheres to said polymer coating. 
     
     
         24 . A method of  claim 20 , wherein said 3D object comprises a polymer. 
     
     
         25 . A method of  claim 24 , wherein said polymer is a thermoplastic. 
     
     
         26 . A method of  claim 20 , wherein said apparatus further comprises a build platform coupled to said thermally conductive plate. 
     
     
         27 . A method of  claim 26 , further comprising removing said thermally conductive plate from said build platform subsequent to printing said 3D object. 
     
     
         28 . A method of  claim 26 , wherein said thermally conductive plate is removable from said build platform. 
     
     
         29 . A method of  claim 26 , wherein said thermally conductive plate is non-magnetically secured to said build platform. 
     
     
         30 . A method of  claim 20 , wherein said 3D object is removed from said thermally conductive plate subsequent to said thermally conductive plate cooling to a temperature that is less than a temperature of said thermally conductive plate at which said 3D object is printed. 
     
     
         31 . A method of  claim 20 , wherein said 3D object is removed from said thermally conductive plate without damaging said polymer coating and said thermally conductive plate. 
     
     
         32 . A method of  claim 31 , wherein said 3D object is removed from said thermally conductive plate without damaging said polymer coating, said thermally conductive plate, and said 3D object. 
     
     
         33 . A method of  claim 20 , wherein said polymer coating is a spray-coated polymer coating. 
     
     
         34 . A method of  claim 20 , wherein said apparatus further comprises a thermocouple to provide feedback to a controller for maintaining a temperature set point of said thermally conductive plate. 
     
     
         35 . A method of  claim 20 , wherein said apparatus further comprises a temperature control unit that controls said temperature of said thermally conductive plate. 
     
     
         36 . A method of  claim 35 , wherein said temperature control unit comprises a heater cartridge that is used to control said temperature of said thermally conductive plate.