Continuous deposition installation and assembly for same

Abstract

A continuous separation installation for the galvanic deposition of a substance on objects includes contacting devices having at least one electrically conductive contact arm. The contacting devices are arranged in areas of the continuous separation installation which are free from an electrolyte used for the galvanic deposition of the substance. There is also described an assembly for a continuous separation installation.

1 - 15 . (canceled) 
     
     
         16 . A continuous deposition installation for the electrolyte deposition of a substance on objects, the continuous deposition installation comprising:
 contacting devices having at least one electrically conductive contact arm;   said contacting devices being arranged in regions of the continuous deposition installation that are free of an electrolyte used for the electrolyte deposition of the substance.   
     
     
         17 . The continuous deposition installation according to  claim 16 , wherein:
 the electrolyte is arranged in a tank;   said tank having at least one outflow device configured to enable a level of the electrolyte in said tank to be lowered locally in outflow regions;   said contacting devices have contact surfaces for contacting the objects;   said contact surfaces of said contacting devices are disposed in said outflow regions.   
     
     
         18 . The continuous deposition installation according to  claim 17 , wherein at least one said outflow device comprises a hollow body, which is arranged at least in sections below said contact surfaces of at least one contacting device and through which the electrolyte is able to flow at least in sections. 
     
     
         19 . The continuous deposition installation according to  claim 18 , wherein said hollow body is a pipe having an upper opening below said contact surfaces of at least one said contacting device. 
     
     
         20 . The continuous deposition installation according to  claim 18 , wherein a plurality of contacting devices are electrically conductively connected to a voltage source and a load resistance is connected upstream of at least one portion of said plurality of contacting devices, and wherein the respective said load resistance is dimensioned such that, upon contact being made, an electric current of substantially identical magnitude is applied to each of said plurality of contacting devices. 
     
     
         21 . The continuous deposition installation according to  claim 20 , wherein all of said contacting devices are electrically conductively connected to the voltage source. 
     
     
         22 . The continuous deposition installation according to  claim 16 , which comprises a dedicated rectifier connected to each said contacting device. 
     
     
         23 . The continuous deposition installation according to  claim 16 , comprising:
 at least one assembly including:   a plurality of contacting devices;   a control device connectable to a voltage supply;   wherein each contacting device of said plurality of contacting devices is connected to said control device via separate electrical lines and electric current is able to be applied separately to each contacting device of said plurality of contacting devices;   wherein said control device is configured to the effect that electric current applied to the individual contacting devices of said plurality of contacting devices is controlled by open-loop control or closed-loop control, separately for each of said individual contacting devices;   wherein said control device is configured as constant-current closed-loop control for each of said individual contacting devices, such that electric current of constant magnitude is able to be applied separately to each of said individual contacting devices;   wherein said control device is configured to run through separate, predefinable current profiles for each of said individual contacting devices; and   wherein said control device has a communication interface for bidirectional data exchange.   
     
     
         24 . The continuous deposition installation according to  claim 16 , wherein said communication interface is a bus interface. 
     
     
         25 . The continuous deposition installation according to  claim 16 , wherein the electric current applied to the individual contacting devices of said plurality of contacting devices is controlled by closed-loop control. 
     
     
         26 . An assembly for a continuous deposition installation for depositing a substance on objects, the assembly comprising:
 a plurality of contacting devices; and   a control device connectable to a voltage supply;   wherein each of said contacting devices is connected to said control device via separate electrical lines, such that electric current may be applied separately to each of said contacting devices.   
     
     
         27 . The assembly according to  claim 26 , wherein said contacting devices are at least four contacting devices. 
     
     
         28 . The assembly according to  claim 26 , wherein said control device is configured to cause electric current to be applied to the individual said contacting devices to be controlled by open-loop control and/or closed-loop control separately for each of said individual contacting devices. 
     
     
         29 . The assembly according to  claim 28 , wherein said control device is a constant-current closed-loop controller for each individual said contacting device of said contacting devices such that electric current of constant magnitude is applied separately to each individual said contacting device. 
     
     
         30 . The assembly according to  claim 28 , wherein said control device is configured to run through separate, predefinable current profiles for each individual said contacting device. 
     
     
         31 . The assembly according to  claim 26 , wherein said control device includes a communication interface configured to bidirectionally exchange data with a data processing device. 
     
     
         32 . The assembly according to  claim 26 , wherein said communication interface is a bus interface. 
     
     
         33 . A method for galvanically depositing metals or metal alloys, the method comprising:
 providing an installation according to  claim 16 ; and   depositing the metal or the metal alloy on a substrate.   
     
     
         34 . The method according to  claim 33 , which comprises depositing on a solar cell.