Electronic component

Abstract

An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the first direction is smaller than a length of the conductive resin layer in the third direction.

What is claimed is: 
     
         1 . An electronic component device, comprising:
 an electronic device; and   an electronic component disposed on the electronic device, wherein   the electronic device includes a first principal surface and pad electrodes disposed on the first principal surface,   the electronic component includes
 an element body of a rectangular parallelepiped shape including a second principal surface opposing the first principal surface, a third principal surface opposing the second principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction, and 
 external electrodes disposed at both end portions of the element body in the third direction, 
   each of the external electrodes includes a first electrode portion disposed on the second principal surface, a second electrode portion disposed on a corresponding end surface of the pair of end surfaces, and third electrode portions disposed on the pair of side surfaces,   the first electrode portion, the second electrode portion, and the third electrode portions include a conductive resin layer,   the first electrode portions are soldered on the respective pad electrodes, and   an interval between the first electrode portions in the third direction is smaller than an interval between the pad electrodes in the third direction.   
     
     
         2 . The electronic component device according to  claim 1 , wherein
 the conductive resin layers included in the first electrode portion, the second electrode portion, and the third electrode portions are integrated with each other to continuously cover one part of the second principal surface, one part of the corresponding end surface, and one part of each of the pair of side surfaces.   
     
     
         3 . The electronic component device according to  claim 2 , wherein
 a first length of the integrated conductive resin layers in the first direction is smaller than a second length of the integrated conductive resin layers in the third direction.   
     
     
         4 . The electronic component device according to  claim 2 , wherein
 the external electrode further includes a sintered metal layer disposed on the end portion of the element body to be positioned between the element body and the integrated conductive resin layers,   the conductive resin layer included in the first electrode portion includes a maximum thickness position, and   in the third direction, a third length from the maximum thickness position to a first end edge of the conductive resin layer included in the first electrode portion is larger than a fourth length from the maximum thickness position to a second end edge of the sintered metal layer.   
     
     
         5 . The electronic component according to  claim 4 , wherein
 a thickness of the conductive resin layer included in the first electrode portion gradually decreases from the maximum thickness position to the first end edge.   
     
     
         6 . The electronic component according to  claim 4 , wherein
 a fifth length from the second end edge to the first end edge in the third direction is larger than the first length.   
     
     
         7 . The electronic component according to  claim 1 , wherein
 an area of the conductive resin layer included in the first electrode portion is larger than an area of the conductive resin layer included in the second electrode portion.   
     
     
         8 . The electronic component according to  claim 1 , wherein
 a maximum thickness of the conductive resin layer included in the first electrode portion is larger than a maximum thickness of the conductive resin layer included in the second electrode portion.   
     
     
         9 . An electronic component device, comprising:
 an electronic device; and   an electronic component;   a solder coupling the electronic device and the electronic component, wherein   the electronic device includes a first principal surface, and a first pad electrode and a second pad electrode that are disposed on the first principal surface,   the electronic component includes
 an element body of a rectangular parallelepiped shape including a second principal surface opposing the first principal surface, a third principal surface opposing the second principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction, and 
 external electrodes disposed at both end portions of the element body in the third direction, 
   each of the external electrodes includes a first electrode portion disposed on the second principal surface, a second electrode portion disposed on a corresponding end surface of the pair of end surfaces, and third electrode portions disposed on the pair of side surfaces,   the first electrode portion, the second electrode portion, and the third electrode portions include a conductive resin layer,   the solder includes a first solder coupling the first pad electrode and the first electrode portion corresponding to the first pad electrode, and a second solder coupling the second pad electrode and the first electrode portion corresponding to the second pad electrode, and   an interval between the first and second solders in the third direction at a first electrode portion side is smaller than an interval between the first and second solders in the third direction at a pad electrode side.   
     
     
         10 . The electronic component device according to  claim 9 , wherein
 the conductive resin layers included in the first electrode portion, the second electrode portion, and the third electrode portions are integrated with each other to continuously cover one part of the second principal surface, one part of the corresponding end surface, and one part of each of the pair of side surfaces.   
     
     
         11 . The electronic component device according to  claim 10 , wherein
 a first length of the integrated conductive resin layers in the first direction is smaller than a second length of the integrated conductive resin layers in the third direction.   
     
     
         12 . The electronic component device according to  claim 10 , wherein
 the external electrode further includes a sintered metal layer disposed on the end portion of the element body to be positioned between the element body and the integrated conductive resin layers,   the conductive resin layer included in the first electrode portion includes a maximum thickness position, and   in the third direction, a third length from the maximum thickness position to a first end edge of the conductive resin layer included in the first electrode portion is larger than a fourth length from the maximum thickness position to a second end edge of the sintered metal layer.   
     
     
         13 . The electronic component according to  claim 12 , wherein
 a thickness of the conductive resin layer included in the first electrode portion gradually decreases from the maximum thickness position to the first end edge.   
     
     
         14 . The electronic component according to  claim 12 , wherein
 a fifth length from the second end edge to the first end edge in the third direction is larger than the first length.   
     
     
         15 . The electronic component according to  claim 9 , wherein
 an area of the conductive resin layer included in the first electrode portion is larger than an area of the conductive resin layer included in the second electrode portion.   
     
     
         16 . The electronic component according to  claim 9 , wherein
 a maximum thickness of the conductive resin layer included in the first electrode portion is larger than a maximum thickness of the conductive resin layer included in the second electrode portion.