Crystal packaging with conductive pillars

Abstract

A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals.

1 . (canceled) 
     
     
         2 . A packaged module for use in a wireless communication device, the packaged module comprising:
 a first die configured to be supported by a substrate and implementing at least a portion of a radio frequency baseband subsystem; and   a crystal assembly disposed between the first die and the substrate, the crystal assembly including a crystal, a housing having a cavity configured to accommodate the crystal therein, a first terminal to receive a first signal, a conductive pillar formed at least partially within a side of the housing, and a conductive layer in one or both of electrical or thermal communication with the conductive pillar.   
     
     
         3 . The packaged module of  claim 2  wherein the conductive layer extends along at least the side of the housing in which the conductive pillar is at least partially formed. 
     
     
         4 . The packaged module of  claim 2  wherein the conductive layer shields devices within the cavity from radio frequency interference. 
     
     
         5 . The packaged module of  claim 4  wherein the devices include at least one of oscillator circuitry, load capacitors, a front-end integrated circuit, and a surface acoustic wave filter. 
     
     
         6 . The packaged module of  claim 2  wherein the conductive pillar and the conductive layer form a heat sink. 
     
     
         7 . The packaged module of  claim 6  wherein the heat sink dissipates heat generated by a power amplifier placed above or below the crystal assembly. 
     
     
         8 . The packaged module of  claim 2  wherein the conductive pillar is configured to conduct a second signal different from the first signal. 
     
     
         9 . The packaged module of  claim 8  wherein the crystal assembly further includes a second terminal to output a third signal that is different from the first and second signals. 
     
     
         10 . The packaged module of  claim 2  wherein the conductive layer extends along at least four sides of the housing. 
     
     
         11 . A crystal assembly comprising:
 a housing having a cavity configured to accommodate the crystal therein;   a first terminal to receive a first signal;   a conductive pillar formed at least partially within a side of the housing; and   a conductive layer in one or both of electrical or thermal communication with the conductive pillar and extending along one or more sides of the housing.   
     
     
         12 . The crystal assembly of  claim 11  wherein the crystal assembly is configured to be disposed between a first die and a substrate of a packaged module. 
     
     
         13 . The crystal assembly of  claim 11  further comprising one or more surface acoustic wave devices housed within the housing. 
     
     
         14 . The crystal assembly of  claim 11  further comprising one or more integrated circuit die housed within the housing. 
     
     
         15 . The crystal assembly of  claim 11  further comprising one or more load capacitors and oscillator circuitry. 
     
     
         16 . The crystal assembly of  claim 11  further comprising a lid configured to receive an integrated circuit and wirebonds configured to electrically connect a pad of the integrated circuit to the conductive pillar. 
     
     
         17 . The crystal assembly of  claim 16  wherein the integrated circuit is a front-end integrated circuit. 
     
     
         18 . The crystal assembly of  claim 11  wherein the crystal assembly is hermetically sealed. 
     
     
         19 . The crystal assembly of  claim 18  wherein the cavity is gas-filled. 
     
     
         20 . The crystal assembly of  claim 11  further comprising one or more pads disposed on a bottom surface of the crystal assembly, the one or more pads in communication with one or more components housed within the housing. 
     
     
         21 . A wireless device, comprising:
 an antenna implemented to receive a radio frequency input signal and to transmit a radio frequency output signal; and   a packaged module including a first die configured to be supported by a substrate and implementing at least a portion of a radio frequency baseband subsystem, the packaged module further comprising a crystal assembly disposed between the first die and the substrate, the crystal assembly including a crystal, a housing having a cavity configured to accommodate the crystal therein, a first terminal to receive a first signal, a conductive pillar formed at least partially within a side of the housing, and a conductive layer in one or both of electrical or thermal communication with the conductive pillar.