Cross-talk blocking structures for em communication

Abstract

Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.

What is claimed is: 
     
         1 . (canceled) 
     
     
         2 . An apparatus comprising:
 a communication module, the communication module including a first integrated circuit package and a second integrated circuit package, each integrated circuit package including at least one transmitter, receiver, or transceiver;   a housing, wherein the housing is configured to cover at least a portion of the communication module, the housing including a portion positioned directly in a path of respective signals directed to or from the first and second integrated circuit packages of the communication module; and   a signal blocking structure positioned in contact with a surface of the portion of the housing and the signal blocking structure positioned between the first integrated circuit package and the second integrated circuit package of the communication module.   
     
     
         3 . The apparatus of  claim 2 , wherein the signal blocking structure is positioned within a recess formed in the portion of the housing such that the signal blocking structure is partially embedded within the portion of the housing. 
     
     
         4 . The apparatus of  claim 2 , wherein the signal blocking structure is positioned within a recess formed in the portion of the housing such that the signal blocking structure is fully embedded within the portion of the housing. 
     
     
         5 . The apparatus of  claim 2 , wherein the signal blocking structure is attached to the surface of the portion of the housing with an adhesive. 
     
     
         6 . The apparatus of  claim 2 , wherein the signal blocking structure is configured to disrupt an electromagnetic field associated with signals propagating between the first IC package and the second IC package through the housing. 
     
     
         7 . The apparatus of  claim 2 , wherein the signal blocking structure is configured to disrupt an electromagnetic field associated with signals propagating between the first IC package and the second IC package through a printed circuit board of the communication module. 
     
     
         8 . The apparatus of  claim 2 , wherein the signal blocking structure is formed from a material that absorbs extremely high frequency electromagnetic radiation. 
     
     
         9 . The apparatus of  claim 8 , wherein the signal blocking structure is formed from a silica-ferrite material or an epoxy based ferrite material. 
     
     
         10 . The apparatus of  claim 2 , wherein the portion of the housing further includes a region composed of an absorbing material, and wherein the signal blocking structure is placed on the absorbing material. 
     
     
         11 . The apparatus of  claim 2 , wherein the portion of the housing further includes a region composed of an absorbing material, and wherein the signal blocking structure is positioned partially within the absorbing material. 
     
     
         12 . The apparatus of  claim 2 , wherein the housing comprises a dielectric structure that allows electromagnetic energy to propagate through. 
     
     
         13 . A system comprising:
 a mobile user device configured to communication with one or more other devices, the user device including:
 a communication module, the communication module including a first integrated circuit package and a second integrated circuit package, each integrated circuit package including at least one transmitter, receiver, or transceiver; 
 a housing, wherein the housing is configured to cover at least a portion of the communication module, the housing including a portion positioned directly in a path of respective signals directed to or from the first and second integrated circuit packages of the communication module; and 
 a signal blocking structure positioned in contact with a surface of the portion of the housing and the signal blocking structure positioned between the first integrated circuit package and the second integrated circuit package of the communication module. 
   
     
     
         14 . The system of  claim 13 , wherein the signal blocking structure is positioned within a recess formed in the portion of the housing such that the signal blocking structure is partially embedded within the portion of the housing. 
     
     
         15 . The system of  claim 13 , wherein the signal blocking structure is positioned within a recess formed in the portion of the housing such that the signal blocking structure is fully embedded within the portion of the housing. 
     
     
         16 . The system of  claim 13 , wherein the signal blocking structure is attached to the surface of the portion of the housing with an adhesive. 
     
     
         17 . The system of  claim 13 , wherein the signal blocking structure is configured to disrupt an electromagnetic field associated with signals propagating between the first IC package and the second IC package through the housing. 
     
     
         18 . The system of  claim 13 , wherein the signal blocking structure is configured to disrupt an electromagnetic field associated with signals propagating between the first IC package and the second IC package through a printed circuit board of the communication module. 
     
     
         19 . The system of  claim 13 , wherein the signal blocking structure is formed from a material that absorbs extremely high frequency electromagnetic radiation. 
     
     
         20 . The system of  claim 13 , wherein the signal blocking structure is formed from a silica-ferrite material or an epoxy based ferrite material. 
     
     
         21 . The system of  claim 13 , wherein the housing comprises a dielectric structure that allows electromagnetic energy to propagate through.