Polycrystalline diamond compact
Abstract
A polycrystalline diamond compact including a cemented carbide substrate and a polycrystalline diamond layer disposed on the cemented carbide substrate. The polycrystalline diamond layer is nonplanar and includes a first curved surface, a second curved surface, and a side surface directly connected to the cemented carbide substrate. The first curved surface is connected to the second curved surface. The joint of the first curved surface and the second curved surface protrudes to form a first cutting edge. The joints of the first curved surface and the second curved surface and the side surface protrudes to form a plurality of second cutting edges.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A polycrystalline diamond compact, comprising a cemented carbide substrate and a polycrystalline diamond layer disposed on the cemented carbide substrate;
wherein:
the polycrystalline diamond layer is nonplanar and comprises a first curved surface, a second curved surface, and a side surface directly connected to the cemented carbide substrate;
the first curved surface is connected to the second curved surface;
a joint of the first curved surface and the second curved surface protrudes to form a first cutting edge; and
joints of the first curved surface and the second curved surface and the side surface protrudes to form a plurality of second cutting edges.
2 . The polycrystalline diamond compact of claim 1 , wherein the first cutting edge has an included angle formed by an edge of the first curved surface and an edge of the second curved surface, and the included angle is between 10 and 179°.
3 . The polycrystalline diamond compact of claim 1 , wherein the plurality of second cutting edges each have an included angle formed by the first curved surface and the side surface, or formed by the second curved surface and the side surface, and the included angle is between 10 and 179°.
4 . The polycrystalline diamond compact of claim 1 , wherein the polycrystalline diamond layer comprises a chamfer disposed between the first curved surface and the side surface, and between the second curved surface and the side surface.Join the waitlist — get patent alerts
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