Flip-chip light-emitting module

Abstract

A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.

1 . A flip-chip light-emitting module, comprising:
 a thermal dissipation substrate;   a package assembly including a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame, the frame including a conductive path disposed on an inner surface of the frame; and   a light-emitting chip disposed on the thermal dissipation substrate, and including a top conductive contact and a light-emitting surface at the same side, the top conductive contact electrically connected to the conductive path through a conductor;   wherein the package assembly further includes a filling layer filled between an inner side of the frame and the thermal substrate.   
     
     
         2 . The flip-chip light-emitting module according to  claim 1 , wherein the frame further includes a side wall surrounding the lateral of the thermal dissipation substrate and an extension wall extending from the side wall to the top conductive contact, the conductive path includes an external connective end and an internal connective end, the external connective end is on the side wall, the internal connective end is on the extension wall and is electrically connected to the top conductive contact through the conductor. 
     
     
         3 . The flip-chip light-emitting module according to  claim 2 , wherein the conductive path further includes a path body extending between the external connective end and the internal connective end, the path body is disposed at the inner surface of the frame. 
     
     
         4 . The flip-chip light-emitting module according to  claim 1 , wherein the thermal dissipation substrate is a metal plate, the light-emitting chip further includes a bottom conductive contact electrically connected to the thermal dissipation substrate. 
     
     
         5 . The flip-chip light-emitting module according to  claim 1 , wherein the light-emitting chip further includes another top conductive contact, the package assembly further includes another conductive path, the flip-chip light-emitting module further includes another conductor, and each conductor connects the top conductive contact and the conductive path correspondingly. 
     
     
         6 . The flip-chip light-emitting module according to  claim 5 , wherein the thermal dissipation substrate is made up of a plurality of spaced plates, the plates are metal plates, two adjacent plates together define a thermal dissipation path, the light-emitting chip further includes bottom conductive contacts, and the bottom conductive contacts are electrically connected to the plates, respectively. 
     
     
         7 . The flip-chip light-emitting module according to  claim 1 , wherein the light-emitting chip further includes an optical axis extending outward from the light-emitting surface, the lens unit further includes a support deposited on the frame and a lens, the support and the frame together define an light channel around the optical axis, and the lens is deposed on the support and is in the light channel. 
     
     
         8 . The flip-chip light-emitting module according to  claim 7 , wherein the support and the frame are made integrally as a one-piece structure. 
     
     
         9 . The flip-chip light-emitting module according to  claim 1 , wherein the package assembly further includes a filling layer filled between the frame and the thermal dissipation substrate. 
     
     
         10 . The flip-chip light-emitting module according to  claim 1 , wherein the frame of the package assembly is made of a ceramic material, the light-emitting chip is selected from the group consisting of light-emitting diodes, resonant-cavity light-emitting diodes, and vertical-cavity surface-emitting laser chips, the conductor is a welding ball, and the conductive path is a wire.