Surfacing film for composites with barrier layer
Abstract
Fiber reinforced resin matrix composite laminates are provided comprising: at least one layer of fiber reinforced resin matrix comprising a cured resin matrix; and a surfacing construction bound to the cured resin matrix and forming a surface of the laminate, comprising: at least one barrier layer; and at least one cured adhesive layer derived from high temperature cure adhesive. In some embodiments, barrier layer(s) may be substantially impermeable to organic solvents, water, and/or gasses. In another aspect, fiber reinforced resin matrix composite laminates are provided comprising: a) at least one layer of fiber reinforced resin matrix comprising a cured resin matrix; and b) a surfacing construction bound to the cured resin matrix and forming a surface of the laminate, comprising: at least one barrier layer; and at least one electrically conductive layer. In another aspect, a surfacing construction is provided comprising a barrier layer and a curable adhesive layer.
Claims
exact text as granted — not AI-modifiedWe claim:
1 . A method of making a fiber reinforced resin matrix composite laminate comprising the steps of:
a) providing a curable fiber reinforced resin matrix comprising a curable resin matrix; b) providing a surfacing construction comprising:
i) at least one barrier layer; and
ii) at least one curable adhesive layer;
c) providing a tool having a shape which is the inverse of the desired shape of the laminate; e) laying up the surfacing construction and the curable fiber reinforced resin matrix in the tool, with the surfacing construction in contact with the tool and with at least one curable adhesive layer in contact with the curable fiber reinforced resin matrix; and f) curing the curable resin matrix and curable adhesive layer to make a fiber reinforced resin matrix composite laminate;
wherein the barrier layer(s) have a composition different from that of the curable adhesive layer(s) and the barrier layer(s) have a composition different from that of the cured resin matrix.
2 . The method according to claim 1 wherein at least one curable adhesive layer has a composition different from that of the curable resin matrix.
3 . The method according to claim 1 wherein at least one barrier layer is substantially impermeable to organic solvents.
4 . The method according to claim 1 wherein at least one barrier layer is substantially impermeable to water, organic solvents and gasses.
5 . The method according to claim 1 wherein the surfacing construction additionally comprises:
iii) at least one electrically conductive layer.
6 . The method according to claim 1 wherein the surfacing construction additionally comprises:
iv) at least one EMI shield layer.
7 . The method according to claim 1 wherein the surfacing construction additionally comprises:
v) at least one UV protection layer.
8 . The method according to claim 1 wherein the surfacing construction additionally comprises:
vi) at least one viscoelastic layer having a peak damping ratio (Tan δ) of at least 1.0 as measured in shear mode by DMTA at 10 Hz.
9 . The method according to claim 1 wherein the surfacing construction comprises a barrier layer comprising a fluoropolymer.
10 . The method according to claim 1 wherein the surfacing construction comprises a barrier layer comprising a non-perfluorinated fluoropolymer.
11 . The method according to claim 1 wherein the surfacing construction comprises a curable adhesive layer comprising an epoxy adhesive and a dicyandiamide curative.
12 . The method according to claim 1 wherein the surfacing construction comprises a curable adhesive layer comprising an epoxy adhesive and a dicyandiamide curative and a barrier layer comprising a non-perfluorinated fluoropolymer.
13 . The method according to claim 1 wherein the surfacing construction comprises a curable adhesive layer comprising an epoxy adhesive and curative which contains no amine-containing curative.
14 . The method according to claim 1 wherein at least one curable adhesive layer has a composition different from that of the curable resin matrix.
15 . The method according to claim 1 wherein at least one curable adhesive layer has a composition which is the same as that of the curable resin matrix.
16 . The method according to claim 1 wherein at least one curable adhesive layer is the curable resin matrix.
17 . The method according to claim 1 wherein at least one curable adhesive layer is not the curable resin matrix.Join the waitlist — get patent alerts
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